NPC 2013 capex to focus on FC CSP substrates, says president

Jun 18, 21:45

Nan Ya PCB (NPC) will invest most of its targeted capex of NT$2 billion (US$67 million) on FC CSP (chip scale package) substrates in 2013, acknowledging brisk demand coming from the...

Kinsus to perform strongly in 1Q13 on steady demand for FC CSP substrates

Jan 7, 12:08

Kinsus Interconnect Technology will perform relatively strongly in the first quarter of 2013, buoyed by shipments of FC CSP (flip-chip chip-scale package) substrates to clients including...

STATS ChipPAC to expand operations in Korea

Nov 20, 13:42

STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...

FC CSP substrate supply may be affected by explosion at Nippon Shokubai

Oct 4, 01:20

The supply of a chemical raw materials for producing ink used in the production of FC CSP (flip chip-chip scale package) substrates may be affected after a recent explosion and fire...

Kinsus looks to increasing shipments of FC CSP substrates in 4Q12

Sep 20, 13:59

Kinsus Interconnect Technology has entered the supply chain of Apple's iPhone 5 and is expected to see robust shipments of its FC CSP (chip scale package) substrates for Qualcomm's...

Kinsus nets NT$6.28 per share in 2011

Feb 8, 15:29

IC substrate supplier Kinsus Interconnect Technology has announced NT$2.8 billion (US$94.9 million) in net profits and an EPS of NT$6.28 for 2011. The firm's board of directors decided...

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

Kinsus ramping up FC CSP substrate shipments for Apple A5 CPUs, says paper

Newswatch - Oct 4, 12:28

Shipments of flip-chip chip-scale package (FC CSP) substrates for Apple's A5 processors from Taiwan-based Kinsus Interconnect Technology are expected to top one million units a month...

Unimicron lands orders from TI and Apple, says paper

Newswatch - Sep 9, 11:54

Unimicron Technology will soon begin to ship its FC CSP (flip-chip chip-scale-packaging) substrates to Texas Instruments (TI) for the production of ARM-based OMAP3 CPU lineups, according...

Kinsus announces strong sales for July

Newswatch - Aug 11, 15:29

IC substrate maker Kinsus Interconnect Technology has announced revenues of NT$1.48 billion (US$50.95 million) for July, up 5.5% sequentially and 8.3% on year, according to a company...

Kinsus posts EPS over NT$3 in 1H11, says paper

Newswatch - Jul 27, 13:50

IC substrate maker Kinsus Interconnect Technology has reported net profits of NT$1.41 billion (US$48.91 million) for the first half of 2011, which translated into an EPS of NT$3.16...

Strong growth for semiconductor equipment in advanced packaging market, says Information Network

Jul 20, 10:28

Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...

Kinsus lands FC CSP substrate orders from Intel, says paper

Newswatch - May 17, 14:12

IC substrate maker Kinsus Interconnect Technology has landed orders for FC CSP (flip-chip chip-scale packaging) substrates from Intel, according to a Chinese-language Commercial...

Unimicron to spend NT$6-7 billion for capacity ramp in 2011

Jan 31, 11:45

Unimicron Technology will invest NT$6-7 billion (US$207-241 million) to ramp up its capacity for HDI boards and flip-chip chip-scale packaging (FC CSP) substrates in 2011 to meet...

Kinsus to commence operation of China plant

Sep 28, 01:00

Taiwan-based IC substrate maker Kinsus Interconnect Technology revealed that construction of a new plant in Suzhou, China is near completion, and production will kick off in the fourth...

Kinsus looks to strong demand for FC CSP and base station substrates in 3Q10

Jul 28, 11:57

IC substrate maker Kinsus Interconnect Technology expects its revenues to grow 5-10% sequentially in the third quarter with flip-chip chip-scale packaging (FC CSP) and base station...

IC substrate maker Kinsus sees order visibility through May

Mar 9, 16:18

Kinsus Interconnect Technology has seen its order visibility extend to May 2010, with new orders focusing on bismaleimide triazine (BT)-based flip-chip chip scale packaging (FC CSP)...

Kinsus share price tumbles as Qualcomm lowers revenue forecast for fiscal 2010

Jan 29, 16:14

Shares of Taiwan-based IC substrate maker Kinsus Interconnect Technology fell the 7% daily limit to close at NT$80 (US$2.49) on the Taiwan Stock Exchange (TSE) on January 28 after...

Kinsus November revenues drop more than 10%

Dec 7, 16:19

IC substrate supplier Kinsus Interconnect Technology saw November revenues drop over 10% to NT$1.07 billion (US$33.37 million), as customers slowed down their orders amid inventory...

Kinsus revenues to drop slightly in November and December; stay flat in 4Q09

Nov 27, 16:58

IC substrate maker Kinsus Interconnect Technology's revenues are estimated to drop 5% sequentially in November and December 2009 due to inventory adjustment at downstream customers,...

Kinsus to see revenues grow 15-20% sequentially in 3Q09

Sep 10, 16:28

Taiwan-based IC substrate maker Kinsus Interconnect Technology is expected to see its revenues grow 15-20% sequentially in the third quarter, higher than the 15% increase projected...

Kinsus FC CSP substrate utilization rate up on orders from Qualcomm

Aug 18, 14:37

Taiwan-based IC substrate maker Kinsus Interconnect Technology has seen its capacity utilization for flip-chip chip scale packaging (FC CSP) substrates rise to more than 80% and the...

IC substrate makers Kinsus and PPT see mixed 1Q09 results

Apr 22, 16:04

IC substrate maker Kinsus Interconnect Technology may post better than expected results for the first quarter of this year, as peer maker Phoenix Precision Technology (PPT) saw losses...

Kinsus sees revenues jump 45% sequentially in March

Newswatch - Apr 9, 13:58

Kinsus Interconnect Technology has reported that revenues soared 45% sequentially to NT$754 million (US$22.44 million) in March, buoyed by increasing shipments of flip-chip (FC) chip-scale...

Kinsus expects strong substrate shipment growth in March due to China 3G deployment

Mar 20, 17:11

IC substrate maker Kinsus Interconnect Technology estimates that March revenues will top NT$700 million (US$20.74 million) because China handset makers have expanded deployment of...

IC substrate maker Kinsus to see sales decline but will remain profitable in January

Jan 19, 15:36

Investors estimate Kinsus Interconnect Technology's January sales to be only around NT$500 million (US$14.93 million) due to sagging market demand. However, the company said it expects...

IC substrate maker Kinsus to see sales decline more than 15% in 4Q amid weak order volumes

Nov 12, 12:06

IC substrate maker Kinsus Interconnect Technology expects to see a sales decline of more than 15% in the fourth quarter, while its utilization rate will be in the 65-70% range and...

Kinsus trims gross margin guidance slightly amid product mix adjustment

Aug 21, 16:36

Kinsus Interconnect Technology, which previously guided that its gross margins may hit 30% in the third quarter, revised its guidance to 27-28% as bookings for bismaleimide triazine...