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News tagged FC CSP
  • Last update: Tuesday 20 May 2014 [42 news items]

SPIL setting up FC CSP capacity in eastern China

May 20, 12:01

Siliconware Precision Industries (SPIL), in view of fast growing demand for ICs used in smartphones, is setting up FC (flip chip) CSP (chip scale package) capacity at its two factories...

SPIL expects 1Q14 revenues to drop 4-8%

Jan 27, 20:40

IC backend house Siliconware Precision Industries (SPIL) has forecast consolidated revenues for the the first quarter of 2014 will decrease 4-8% sequentially, as production utilization...

IC backend service firms to ramp up bumping, WL-CSP capacities in 2014, say sources

Dec 31, 11:26

Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...

IC substrate makers to ramp up FC CSP substrates in 2014

Dec 30, 23:10

IC substrate makers Kinsus Interconnect Technology, Unimicron Technology and Nanya PCB all plan to ramp up their production capacity for flip-chip chip scale package (FC CSP) substrates...

ASE likely to lose orders as plants might shut down over toxic leaks

Dec 13, 10:23

One or more factories of Taiwan-based Advanced Semiconductor Engineering (ASE), the world's largest IC packaging house, might receive a government order to suspend operations for...

Kinsus sales to decline 5% sequentially in 4Q13

Nov 20, 21:57

Kinsus Interconnect Technology is expected to see its revenues drop 5% sequentially in the fourth quarter of 2013 as declining demand from the high-end smartphone sector will offset...

SPIL posts record revenues for October

Nov 6, 12:09

Siliconware Precision Industries (SPIL) saw its October consolidated revenues climb to an all-time high of NT$6.55 billion (US$222.7 million) for October 2013, representing growth...

ASE to land growing backend orders for Apple devices, says report

Newswatch - Aug 29, 15:56

IC packaging and testing house Advanced Semiconductor Engineering (ASE) is expected to secure backend orders for fingerprint sensors, application processors and Wi-Fi modules for...

Kinsus 3Q13 sales expected to hit record, says report

Newswatch - Aug 28, 14:46

IC substrate supplier Kinsus Interconnect Technology is expected to see its third-quarter revenues climb to an all-time high with gross margin rising above 27%, thanks to growing...

High-end packaging next battlefield for IC assembly and test services providers, says Amkor executive

Jul 9, 15:53

Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...

Kevin Yu, Amkor sales director for Greater China

NPC 2013 capex to focus on FC CSP substrates, says president

Jun 18, 21:45

Nan Ya PCB (NPC) will invest most of its targeted capex of NT$2 billion (US$67 million) on FC CSP (chip scale package) substrates in 2013, acknowledging brisk demand coming from the...

SPIL expanding capacity for high-end ICs

Jun 17, 21:29

Siliconware Precision Industries (SPIL) has moved to expand production capacity at a fast pace for high-end IC packaging and testing in anticipation of robust demand for mobile communication...

SPIL chairman Bough Lin

Kinsus to perform strongly in 1Q13 on steady demand for FC CSP substrates

Jan 7, 12:08

Kinsus Interconnect Technology will perform relatively strongly in the first quarter of 2013, buoyed by shipments of FC CSP (flip-chip chip-scale package) substrates to clients including...

STATS ChipPAC to expand operations in Korea

Nov 20, 13:42

STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...

FC CSP substrate supply may be affected by explosion at Nippon Shokubai

Oct 4, 01:20

The supply of a chemical raw materials for producing ink used in the production of FC CSP (flip chip-chip scale package) substrates may be affected after a recent explosion and fire...

Kinsus looks to increasing shipments of FC CSP substrates in 4Q12

Sep 20, 13:59

Kinsus Interconnect Technology has entered the supply chain of Apple's iPhone 5 and is expected to see robust shipments of its FC CSP (chip scale package) substrates for Qualcomm's...

Kinsus nets NT$6.28 per share in 2011

Feb 8, 15:29

IC substrate supplier Kinsus Interconnect Technology has announced NT$2.8 billion (US$94.9 million) in net profits and an EPS of NT$6.28 for 2011. The firm's board of directors decided...

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

Kinsus ramping up FC CSP substrate shipments for Apple A5 CPUs, says paper

Newswatch - Oct 4, 12:28

Shipments of flip-chip chip-scale package (FC CSP) substrates for Apple's A5 processors from Taiwan-based Kinsus Interconnect Technology are expected to top one million units a month...

Unimicron lands orders from TI and Apple, says paper

Newswatch - Sep 9, 11:54

Unimicron Technology will soon begin to ship its FC CSP (flip-chip chip-scale-packaging) substrates to Texas Instruments (TI) for the production of ARM-based OMAP3 CPU lineups, according...

Kinsus announces strong sales for July

Newswatch - Aug 11, 15:29

IC substrate maker Kinsus Interconnect Technology has announced revenues of NT$1.48 billion (US$50.95 million) for July, up 5.5% sequentially and 8.3% on year, according to a company...

Kinsus posts EPS over NT$3 in 1H11, says paper

Newswatch - Jul 27, 13:50

IC substrate maker Kinsus Interconnect Technology has reported net profits of NT$1.41 billion (US$48.91 million) for the first half of 2011, which translated into an EPS of NT$3.16...

Strong growth for semiconductor equipment in advanced packaging market, says Information Network

Jul 20, 10:28

Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...

Kinsus lands FC CSP substrate orders from Intel, says paper

Newswatch - May 17, 14:12

IC substrate maker Kinsus Interconnect Technology has landed orders for FC CSP (flip-chip chip-scale packaging) substrates from Intel, according to a Chinese-language Commercial...

Unimicron to spend NT$6-7 billion for capacity ramp in 2011

Jan 31, 11:45

Unimicron Technology will invest NT$6-7 billion (US$207-241 million) to ramp up its capacity for HDI boards and flip-chip chip-scale packaging (FC CSP) substrates in 2011 to meet...

Kinsus to commence operation of China plant

Sep 28, 01:00

Taiwan-based IC substrate maker Kinsus Interconnect Technology revealed that construction of a new plant in Suzhou, China is near completion, and production will kick off in the fourth...

Kinsus looks to strong demand for FC CSP and base station substrates in 3Q10

Jul 28, 11:57

IC substrate maker Kinsus Interconnect Technology expects its revenues to grow 5-10% sequentially in the third quarter with flip-chip chip-scale packaging (FC CSP) and base station...

IC substrate maker Kinsus sees order visibility through May

Mar 9, 16:18

Kinsus Interconnect Technology has seen its order visibility extend to May 2010, with new orders focusing on bismaleimide triazine (BT)-based flip-chip chip scale packaging (FC CSP)...

Kinsus share price tumbles as Qualcomm lowers revenue forecast for fiscal 2010

Jan 29, 16:14

Shares of Taiwan-based IC substrate maker Kinsus Interconnect Technology fell the 7% daily limit to close at NT$80 (US$2.49) on the Taiwan Stock Exchange (TSE) on January 28 after...

Kinsus November revenues drop more than 10%

Dec 7, 16:19

IC substrate supplier Kinsus Interconnect Technology saw November revenues drop over 10% to NT$1.07 billion (US$33.37 million), as customers slowed down their orders amid inventory...

Kinsus revenues to drop slightly in November and December; stay flat in 4Q09

Nov 27, 16:58

IC substrate maker Kinsus Interconnect Technology's revenues are estimated to drop 5% sequentially in November and December 2009 due to inventory adjustment at downstream customers,...

NPC expects strong revenues from FC CSP substrates in 2010

Oct 26, 10:22

Nan Ya Printed Circuit Board (NPC) may see its revenues from flip-chip chip scale packaging (FC CSP) substrates double in 2010 because of significant demand from the handset segment,...

NPC FC CSPs

Kinsus to see revenues grow 15-20% sequentially in 3Q09

Sep 10, 16:28

Taiwan-based IC substrate maker Kinsus Interconnect Technology is expected to see its revenues grow 15-20% sequentially in the third quarter, higher than the 15% increase projected...

Kinsus FC CSP substrate utilization rate up on orders from Qualcomm

Aug 18, 14:37

Taiwan-based IC substrate maker Kinsus Interconnect Technology has seen its capacity utilization for flip-chip chip scale packaging (FC CSP) substrates rise to more than 80% and the...

IC substrate maker Kinsus says high-margin products to sustain growth for 2H09

Jun 17, 16:26

Kinsus Interconnect Technology is expected to manage sequential revenue growth from July through December 2009, driven by growing sales of its high-margin product lines, according...

Kinsus chairman
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