Bits + chips
Kinsus to perform strongly in 1Q13 on steady demand for FC CSP substrates
Ingrid Lee, Taipei; Steve Shen, DIGITIMES

Kinsus Interconnect Technology will perform relatively strongly in the first quarter of 2013, buoyed by shipments of FC CSP (flip-chip chip-scale package) substrates to clients including Qualcomm and MediaTek, according to industry sources.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.