Taipei, Friday, October 20, 2017 04:07 (GMT+8)
cloudy
Taipei
23°C
CES 2011: TI announces DLP Pico HD chipset
Press release, January 6; Yvonne Yu, DIGITIMES [Thursday 6 January 2011]

At the International Consumer Electronics Show (CES), Texas Instruments (TI) has unveiled a new era for portable high definition (HD) entertainment with the new DLP Pico HD chipset. Born out of years of research, the latest chip to feature DLP Pico technology showcases HD (WXGA) video and images on nearly any surface, with more brightness and greater energy efficiency than ever before, TI said.

"The new DLP Pico HD chipset provides the ultimate combination of the best image quality in the smallest size, and is poised to revolutionize the worlds of consumer entertainment and mobile enterprise solutions," said Frank Moizio, manager, DLP Pico projection. "Never again will mobile professionals be caught without the ability to share their vision, as this new chipset enables the brightest projection products that can be easily stored and carried in a laptop bag. Even more exciting is that it opens tremendous opportunities in the world of entertainment - from greater than 100-inch HD video from the palm of your hand - to a wide variety of new entertainment devices that allow consumers to enjoy big picture HD experiences in a snap, anywhere, anytime."

Multiple manufacturers and brands will be at CES showing products with DLP Pico technology inside. Among them are Acer, Dell, LG, Optoma, and ViewSonic, who will be showing the first products based on the new HD chipset, TI said.

TI's CES 2011 events:

• Pepcom's Digital Experience! – Wed. January 5, 7pm PT (Caesars Palace)
• DLP Pico demo suite – January 6-7

Texas Instruments (TI) showcasing new DLP Pico HD chipset at CES 2011

TI's new DLP Pico HD chipset
Photo: Company

Realtime news
  • Asustek, Gigabyte reorganization efforts to bear fruit in 1Q18

    IT + CE | 10h 24min ago

  • White-box smartphone vendors highlight innovation in their new products

    Before Going to Press | 5h 54min ago

  • ProLogium, WM Motor partner to develop LCB-powered vehicle

    Before Going to Press | 6h 2min ago

  • Leadframe maker SDI resumes production at China plant

    Before Going to Press | 6h 3min ago

  • Backend houses expect rising memory demand for servers and datacenters

    Before Going to Press | 6h 4min ago

  • UREC seeking partnerships with local silicon wafer suppliers

    Before Going to Press | 6h 7min ago

  • Taiwan foundries enjoying rising orders from fabless firms

    Before Going to Press | 6h 10min ago

  • White-box notebook makers showcasing ultra-thin and 2-in-1 devices in Hong Kong

    Before Going to Press | 6h 14min ago

  • Taiwan analog IC firms to enjoy strong 4Q17

    Before Going to Press | 6h 15min ago

  • Epistar sues All Star Lighting Supplies for patent infrigement

    Before Going to Press | 6h 16min ago

  • TSMC raises IC market forecast for 2017

    Before Going to Press | 6h 18min ago

Pause
 | 
View more
UMC
Global AP demand forecast, 2017-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.