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News tagged TI
  • Last update: Tuesday 27 March 2012 [69 news items]

STMicro challenges TI in 2011 MEMS market, says Yole Developpement

Mar 27, 11:16

The MEMS market reached US$10.2 billion in 2011, up 17%, according to Yole Developpement. STMicroelectronics saw its MEMS sales rise 42% to more than US$900 million on exploding demand...

Samsung in-house-developed smartphone processor may impact Qualcomm, TI, Nvidia

Mar 21, 16:06

Samsung Electronics' in-house development of an ARM-architecture processor, Exynos, for use in its Galaxy S III smartphone signals Samsung's stepping into development of ARM processors...

Samsung aggressives in developing in-house made processor

Intel to adopt TI, Broadcom wireless chips for Medfield, Clover Trail-W platforms

Dec 30, 12:24

Intel will adopt the Texas Instruments-developed (TI) WL1283 Wi-Fi/Bluetooth/GPS chips for its Medfield platform to be launched in the second quarter of 2012 and Broadcom-developed...

A tablet PC that features Android OS and Intel processor

Unimicron lands orders from TI and Apple, says paper

Newswatch - Sep 9, 11:54

Unimicron Technology will soon begin to ship its FC CSP (flip-chip chip-scale-packaging) substrates to Texas Instruments (TI) for the production of ARM-based OMAP3 CPU lineups, according...

Japan earthquake continues to inflate analog IC prices, says IHS iSuppli

Jul 1, 10:08

Supply disruptions spurred by the Japan earthquake are continuing to cause pricing increases for general-purpose analog components that are used in most types of electronic equipment...

Insyde brings UEFI BIOS to TI OMAP platform supporting next-version Windows

Jun 29, 17:00

Insyde Software has announced the delivery of UEFI BIOS and engineering services to customers designing ultra-thin laptops, tablets and mobile internet devices based on the ARM-based...

TI reportedly cuts wafer starts at TSMC, UMC

Jun 15, 16:49

Texas Instruments (TI) has cut its orders to Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), according to sources in the industry...

TSMC receives more requests to produce analog chips using 12-inch, advanced processes

May 13, 01:10

A number of international analog IC companies have been in talks with Taiwan Semiconductor Manufacturing Company (TSMC) for allocation of 12-inch wafer production capacity to put...

TI remains largest power IC supplier but competition is fierce, says IMS

May 12, 16:57

Texas Instruments (TI) remained the largest supplier in the power management and driver IC market in 2010, a year in which most suppliers experienced an exploding market but struggled...

TI certifies 8-inch wafers from SAS, says paper

Newswatch - Apr 15, 11:36

Eight-inch epitaxy wafers by Taiwan-based Sino-American Silicon Products (SAS) has been certified by Texas Instruments (TI), according to a Chinese-language Commercial Times...

TI announces first USB-IF certified four-port host controller

Apr 13, 10:34

Texas Instruments (TI) has announced that it is the first semiconductor company to receive certification from the USB Implementer's Forum (USB-IF) for its SuperSpeed USB (USB 3.0)...

Commentary: TI triggers new competition in analog IC market

Apr 7, 11:00

After dedicating its own 12-inch wafer fab to the production of analog ICs, TI has taken over National Semiconductor (NS), with the aim of boosting its share in the global market...

TI to acquire National Semiconductor for US$6.5 billion

Apr 6, 11:21

Texas Instruments (TI) has signed a definitive agreement to purchase National Semiconductor in an all-cash transaction of about US$6.5 billion. Both companies will operate independently...

Digitimes Insight: Sony, Renesas, TI impacted by earthquake for supply of ODD components

Mar 23, 12:12

Sony, Renesas Electronics and Texas Instruments (TI), among makers of components of optical disc drives (ODDs) in Japan, have suffered the most impact of the large earthquake hitting...

Sony, Renesas, TI impacted by earthquake for supply of ODD components

Nvidia launches new 3D Vision glasses and entry-level GPU

Mar 17, 01:25

Nvidia recently launched a new 3D Vision bundle priced US$149, lower than US$199 of the previous 3D Vision bundle, to boost demand for 3D applications, according to the company.

Japan earthquake damages factories, says TI

Mar 15, 13:35

Texas Instruments (TI) has said that its manufacturing site in Miho, Japan, about 40 miles northwest of Tokyo, suffered substantial damage during the recent earthquake.

Standalone application processors are wining in mobility markets, says Petrov Group (part 1)

Mar 8, 15:40

Several years ago there was a widely accepted expectation that application mobile processors would be fully integrated with baseband processors on a single chip. However, today we...

Taiwan analog IC prices affected by TI 12-inch fab going on-line

Mar 2, 01:00

With Texas Instrument's (TI) 12-inch fab to soon commence production of analog ICs and the company lowering prices since the second half of 2010, a new analog IC price war is expected...

USB 3.0 interface to become mainstream sooner or later: Q&A with Dan Harmon, interface product marketing manager, Texas Instruments

Feb 23, 15:32

Texas Instruments (TI) is actively venturing into the USB 3.0 interface market for notebooks, desktops and smartphones as rival Renesas Electronics is still thriving in the segment...

Dan Harmon, interface product marketing manager, TI

Switch to 8-inch wafers to provide sufficient capacity and inventory flexibility for analog IC design houses

Jan 26, 01:45

With the imminent entry of Texas Instrument's (TI) 12-inch analog IC process, Taiwan-based analog IC design houses have looked to transition to 8-inch wafers since the second half...

CES 2011: TI announces DLP Pico HD chipset

Jan 6, 13:08

At the International Consumer Electronics Show (CES), Texas Instruments (TI) has unveiled a new era for portable high definition (HD) entertainment with the new DLP Pico HD chipset...

CES 2011: DLP Pico technology lights up new, on-the-go possibilities

Jan 6, 13:07

Texas Instruments (TI) DLP Products has announced that more than 30 DLP Pico-enabled products, covering a wide variety of useful and unique form factors, will be on display by the...

Outsourcing of IC backend services growing

Dec 30, 12:38

IDMs including Microchip Technology, NXP Semiconductors, STMicroelectronics and Texas Instruments (TI) have all increased outsourcing for their backend production since the fourth...

TI capacity expansion to benefit wafer probing company Ardentec

Dec 28, 01:00

More than 50% of Ardentec's revenues now come from IDM clients, especially from major client Texas Instruments (TI). Ardentec, a wafer probing service provider, indicated that orders...

Leveraging flexible pricing: Q&A with TI Taiwan GM Robin Chen

Nov 19, 16:29

Speculation has circulated in Taiwan that Texas Instruments' (TI) 12-inch wafer foundry plant, which is about to enter volume production for analog chips, will allow the chip vendor...

TI Taiwan GM Robin Chen

Li-Ion/Poly batteries drive high growth of battery management ICs from headsets to electric vehicles, says Petrov Group

Oct 21, 16:10

The requirement for power-efficient and high performance solutions in Li-Ion/Poly battery-powered devices and equipment continues to open profitable growth opportunities for existing...

TI announces first wafer plant in China

Oct 15, 15:55

Texas Instruments (TI) has announced the opening of its first wafer plant in China, an 8-inch manufacturing facility located in the Chengdu High-tech Zone.

TI reportedly to slash analog IC prices

Oct 15, 14:25

Texas Instruments (TI) reportedly plans to cut prices for its analog ICs again soon following a reduction launched in August – a move which is design to counter the aggressive...

TI expects shipments of DLP 3D Ready chips to reach 2-3 million units in 2011

Sep 2, 17:01

Texas Instruments (TI) vice president of DLP business Kent Novak at a conference has commented that the company's shipments of DLP 3D Ready chips will increase to 2-3 million units...

Texas Instruments (TI) vice president of DLP business Kent Novak

Spansion and TI ink foundry deal

Sep 1, 14:21

Spansion has entered into a foundry services agreement with Texas Instruments (TI), which recently acquired two wafer fabs and equipment from the NOR flash maker's former subsidiary...

Thirty billion power conversion ICs enable power management applications, says Petrov Group

Aug 24, 13:53

The analog power conversion IC segment dominates the power management market; it accounts for about 30 billion units and US$11 billion revenues with a forecast average growth rate...

Power management ICs in portable devices represent nearly 40% of total analog IC revenues, says Petrov Group

Aug 10, 15:20

The annual unit growth rate for portable devices is estimated at more than 12%, from about two billion in 2008 to over 3.4 billion devices in 2013. These devices have an increasing...

STM is the market share leader in ESD and EMI protection devices, says Petrov Group

Aug 2, 15:03

The market for electro-static discharge (ESD) and electromagnetic interference (EMI) protection devices is nearly invisible. However, it is a large (US$6 billion and 16+ billion unit...

UMC buys 12-inch tools from TI

Jul 16, 10:30

United Microelectronics Corporation (UMC) has announced that it is looking to further increase its production capacity with the purchase of numerous 12-inch CMOS chip manufacturing...

TI buys fab from Spansion Japan, continues analog production expansion

Jul 15, 16:39

Texas Instruments (TI) has acquired two wafer fabs and manufacturing equipment located in Aizu-Wakamatsu, Japan, from Spansion Japan for an undisclosed sum, according to the company...

69 items [1/2]
Realtime news
  • Solar wafer maker GET reports full capacity

    Green energy | 1h 16min ago

  • TXC to increase TCXO capacity by 200%

    Bits + chips | 1h 20min ago

  • MILC to enjoy growth in both worldwide and Taiwan sales

    IT + CE | 1h 23min ago

  • Taiwan market: HTC recaptures top handset vendor ranking in April

    Mobile + telecom | 1h 28min ago

  • Sony to ship in-cell touch panels for next-generation iPhone, say sources

    Displays | 1h 42min ago

  • Asustek to launch three new ZenBook models in June

    IT + CE | 1h 47min ago

  • PC shipments may only see slight sequential growth in 2Q12

    IT + CE | 2h 8min ago

  • TXC optimistic about 2Q12 revenues

    Bits + chips | 2h 26min ago

  • Google 7-inch tablet PC to ship in June with initial volume of 600,000 units

    IT + CE | 2h 32min ago

  • Computex 2012: ViewSonic to unveil 21.5-inch touch screen monitor

    Before Going to Press | 2h 41min ago

  • NAND flash faces oversupply and falling contract prices in May

    Before Going to Press | 2h 51min ago

  • Taiwan market: Four operators to begin marketing HTC WiMAX-enabled phone in June

    Before Going to Press | 2h 53min ago

  • Taiwan market: LG aims to take up 8% in local smartphone segment

    Before Going to Press | 2h 54min ago

  • Touch IC orders in May are mostly short-term orders, says EETI

    Before Going to Press | 3h 47min ago

  • PTC conservative about 2012 revenue growth

    Before Going to Press | 4h 6min ago

  • Taiwan LCD driver IC design houses expect lower revenue growth in 2Q12

    Before Going to Press | 4h 8min ago

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