- 2 Nov 2010:While Intel is almost certain to do other foundry deals like the one announced today, we don't see the chipmaker actually pursuing a real foundry model. Rather, Achronix and deals like it will enable Intel to develop new markets with less downside risk, and will ultimately grow the company's IDM business through acquisitions.
- Another source familiar with the situation said the money would likely be used to expand capacity at the company's Beijing plant, specifically to quickly ramp-up production of chips using 65nm technology.
- 21 Oct 2010:Believe it or not, your phone battery's capacity to hold charge is just part of the problem -- a bigger monster lurks within the telecom operator, and the phone having to stay constantly in touch with it.
- 5 Oct 2010:"We're considering various options of outsourcing as well as strengthening our own production capacity because of rising demand," a spokesperson for Sony said. The Nikkei English News recently reported that Sony plans to hire Fujitsu for the bulk of the production process for complementary metal-oxide semiconductor sensors used in digital cameras and camera phones.
- Elpida Memory president and CEO Yukio Sakamoto said in an interview that the company is delaying plans to boost production capacity at its Taiwanese unit. "Through the summer, demand for PC memory didn't rise as much I had expected," Sakamoto said. "If there's no demand, there's no point in adding capacity."
- 21 Sep 2010:Violin Memory has introduced a 40TB capacity flash memory array for enterprises that uses multi-level cell (MLC) NAND and costs less than US$16 per GB.
- 16 Sep 2010:ATIC plans to invest US$6-7 billion in Abu Dhabi chip plant, says CEO (Sep 14) - Wall Street JournalThe executive also said the outlook for chip demand remains solid for the remainder of this year, but cautioned another cyclical downturn could be in store next year as industry capacity continues to increase.
- Rudolph Technologies has received an order for its multiple PrecisionWoRx VX4 probe card test and analysis systems from a customer in Taiwan to facilitate capacity expansion.
- 13 Sep 2010:
- 5 Sep 2010:"We believe Globalfoundries will continue to ramp capacity over the next few quarters despite a weakening macro environment," said an analyst with Needham & Co. LLC, in a report. "We estimate Globalfoundries' capex will grow from about US$2.6 billion in 2010 to US$3.0-4.0 billion in 2011..."
- 26 Aug 2010:Suntech Power China's largest maker of solar panels, said on Thursday that it has signed a deal to develop solar plants in South Africa with up to 100 megawatts in capacity.
- 17 Aug 2010:LDK Solar is planning to build a solar manufacturing facility with 1 gigawatt of solar cell and 500 megawatts of solar module capacity. The manufacturing facility is expected to begin production in the second quarter of 2011, backed by US$368 million in financing for up to three years from a Chinese lender.
- 13 Aug 2010:With semiconductor sales soaring to a possible 30% increase this year, companies are ramping up capacity to meet current and expected demand. But the capital invested during the balance of 2010 will not impact actual capacity until sometime in 2011.
- 6 Aug 2010:Samsung started a 30MW solar cell production line for research and development last September and will incrementally increase capacity to 130MW next year, company spokesman James Chung said today.
- 4 Aug 2010:Chip equipment maker UMS, which counts Applied Materials as its biggest client, will boost capacity utilisation to 85% in the third quarter from 65% in a booming industry.
- 14 Jul 2010:KLA-Tencor has increased its regular quarterly dividend to US$0.25 a share from US$0.15. "KLA-Tencor's strong cash flows and solid balance sheet provide us the financial flexibility to return significant cash to our shareholders while also providing the capacity to fuel our growth initiatives," said CEO Rick Wallace.
- 28 Jun 2010:Hyundai Heavy Industries said it doubles its annual solar module and solar cell production capacity from current 320MW and 370MW to 600MW respectively by early 2011.
- Freescale Semiconductor has introduced its Xtrinsic sensing solutions, which are designed with the combination of high-performance sensing capability, processing capacity and customizable software to help deliver differentiated sensing applications.
- 25 Jun 2010:Toshiba plans to expand manufacturing capacity at its plant in Houston, Texas for production of high-performance drive motors for hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs) and electric vehicles (EVs).
- 15 Jun 2010:Hynix Semiconductor has said it would invest 456 billion won (US$373.4 million) to boost and upgrade its production capacity.
- According to Semiconductor Industry Capacity Statistics (SICAS), total industry IC capacity dropped 2.9% in the first quarter of 2010 from the prior quarter.
- 10 Jun 2010:Samsung Electronics has said due to projected heavy demand for its advanced logic chips, it will invest US$3.6 billion to expand capacity at its plant in Austin, Texas, and hire 500 more workers there by 2011.
- 8 Jun 2010:
- 3 Jun 2010:SanDisk's SSD P4 and SSD G4 offer up to 128GB and 256GB of storage, respectively, double the capacities of the company's previous SSD offerings.
- 25 May 2010:
- 24 May 2010:We all know that for the absolute best throughput of storage available to us today, it's in solid-state-drives. The problem with SSDs is cost and the limited storage capacity in comparison to the magnetic solutions. But upcoming solutions from Seagate and Toshiba may be able to come up with something in between.
- "As a result of this successful qualification, we currently expect to ship a significant number of tools to Epistar this year. We are excited that we have been chosen to support their volume capacity ramp in 2010...," said Bill Miller, senior VP, GM of Veeco's MOCVD Operations.
- 20 May 2010:"Applied's stronger second quarter results were led by revenues and profitability gains in our silicon and FPD businesses," said Mike Splinter, chairman and CEO of Applied Materials. "Global demand for computing and consumer electronics is giving our customers the confidence to make significant capacity additions, fueling what we believe will be a multiyear growth cycle..."
- 18 May 2010:Perhaps because of that history major suppliers have not been installing capacity, which indicates that prices will continue to increase until at least the last quarter of 2010, when capacity may again be able to meet demand, according to a Gartner analyst.
- 7 May 2010:Hynix Semiconductor's board has approved the issuance of 557.9 billion won in five-year convertible bonds to secure operating funds and expand production capacity.
- 28 Apr 2010:Texas Instruments said it is ramping up a second phase of expansion at a factory near its Dallas headquarters. The expansion will double the plant's capacity to produce chips that go into products such as cell phones, computers and telecommunications equipment.
- 22 Apr 2010:
- 19 Apr 2010:
- 17 Mar 2010:Ramifications of slowed manufacturing capacity output and a lack of capital expenditure over the past 24 months, combined with increased demand driven by a hot PC market, has resulted in a very positive environment for DRAM pricing.
- 16 Mar 2010:Two of China's top chipmakers and Intel's lone China factory are all running at or near full capacity, as China's sector rebounds more quickly than the rest of the world, according to senior executives at the three firms.
- 15 Mar 2010:Abu Dhabi-backed foundry Globalfoundries is planning to spend US$2.5 billion to increase its 300mm wafer manufacturing capacity by 50% in 2010, according to Udo Nothelfer, company VP and general manager of Fab 1 in Dresden, Germany.
- LCD panel maker LG Display will spend US$1.3 billion to raise output and help meet robust customer demand and is betting on booming premium LCD TV sales to drive strong growth this year.
- 12 Mar 2010:Hynix Semiconductor has said it would invest 465 billion won (US$410 million) to expand and upgrade its production capacity and research and development.
- 11 Mar 2010:Konica Minolta has decided to enhance its production capacity of glass substrates of hard disk drives (HDDs) by adding production line in response to a rapid growth in demand and the accelerated increase in storage density.
- The highly sophisticated tool for protecting from data security vulnerabilities - MEjW TP-400-I
- The Fortrend OGS received U.S. Patent Certificate
- G.SKILL Releases World's Fastest DDR4 3333MHz Memory, Available Now! The Bleeding Edge of Speed Has Arrived!
- Indium Corporation announces new EZ-Pour Gallium Trichloride
- Genesys Logic announces a reference design pairing its USB 3.0 card reader controller GL3221 with NFC transceiver ST95HF from STMicroelectronics
- AccuTouch Five Wire Resistive Touchscreens
- Getting the Most Out Of Your Next Generation Digital Security Surveillance System
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Digitimes Research: Intel to see strong tablet AP shipments in 2H14
- Commentary: Apple Watch pioneering user interface will make around 10% of users Think Different
- Digitimes Research: Asustek detachable devices face size hurdle
- Digitimes Research: Apple refocuses on 9.7-inch iPad in 2H14
- Commentary: Time is running out for console makers to clean up GamerGate
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