Sony said it expects to raise as much as JPY300 billion (US$2.4 billion) after setting a price for new common shares it is selling to raise money for boosting chipmaking capacity.

A new low-power, high-speed memory technology on the horizon could replace solid-state drives, hard drives and DRAM in PCs, and bring higher levels of storage capacity to mobile devices and wearables.

But company officials and market experts say if the two raise their production capacity, the long-term supply growth will remain constrained due to technological complexity.

Samsung Electronics is set to spend at least another 10 trillion won (US$9.2 billion) to boost capacity at a new South Korean chip plant, a 64% increase over announced investment plans, domestic online news service MoneyToday reported.

JEDEC Solid State Technology Association has announced the publication of Release 6 of the DDR3 Serial Presence Detect (SPD) document. The updated standard describes new memory timing parameters and enables higher capacity memory modules.

Canon is shifting capacity back to Japan in an apparent vindication of Prime Minister Shinzo Abe's yen-weakening policies, which have made it more profitable for some Japanese manufacturers to produce and export from home.

Dongbu HiTek is not exactly a household name in the foundry business like TSMC, Globalfoundries and Samsung. But Dongbu, a company described by some as the industry's best kept secret, has been sharpening its strategy, honing its skills, and steadily expanding capacity in South Korea under Chang-Sik Choi, who became its president and CEO a year and a half ago.

"We are seeing a near-term slowdown in investment by our foundry customers as they focus on ramping (production using) new capacity installed over the past two quarters," said Applied CEO Michael Splinter.

If Apple owned capacity at a fab, it would give the company the kind of control over both design and chip manufacturing that Intel has.

With Toshiba's existing chip facilities now running at full capacity, the company may spend some of a 38% hike in its capex budget this year on extending a factory, the company's incoming president, Hisao Tanaka, said in a recent interview.

Contract chipmaker Globalfoundries will spend US$4.5 billion to boost production capacity in 2013, anticipating a burst in orders for chips used in low-cost smartphones.

RFMD will phase out manufacturing in its UK-based GaAs pHEMT facility and transition most GaAs manufacturing to its GaAs HBT manufacturing facility in Greensboro, NC. RFMD will also partner with leading GaAs HBT foundries for additional capacity.

The M500 SSD utilizes Micron's 20nm multilevel cell (MLC) NAND flash to achieve terabyte-class capacity and enable a new level of SSD price competitiveness; the 960GB Crucial M500 SSD will be initially priced under US$600.

Sony has announced plans to invest in Sony Semiconductor's Nagasaki Technology Center from the first half of the fiscal year ending March 31, 2013 through the first half of the fiscal year ending March 31, 2014, to increase the production capacity for stacked CMOS image sensors.

EV Group (EVG) announced that Himax Technologies has placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system. The IQ Aligner will be used by Himax to support the company's capacity increase in the production of wafer-level cameras used in mobile phones, notebook computers and other consumer electronic devices.

The company has sent requests for proposals to banks to borrow as much as US$1 billion to expand production capacity at its factory in Austin, Texas, said James Chung, a Seoul-based spokesman for Samsung. The bonds will be issued by Samsung's US unit and may have maturities of five years.

Marvell Friday launched what it's calling the industry's first PCI Express (PCIe) NAND flash controller, which it describes as a building block that allows solid state drive (SSD) and system manufacturers to scale products up or down in capacity and performance using commodity hardware.

After several years of rapid capacity expansion driven by high-brightness LED used in TV backlighting applications, a 40% decline in world metal organic chemical vapor deposition (MOCVD) purchases in 2012 will reduce overall LED equipment spending for the first time in over five years.

Innovation Network Corp. of Japan is making final arrangements to buy a liquid crystal display panel plant from Panasonic Corp. to boost the production capacity of a joint LCD venture it is forming with three manufacturers, sources said Friday.

ASML has said orders in the fourth quarter will increase from the third-quarter level as customers add capacity and shift to more advanced-technology machines.

Fusion-io has released the first upgrade to its in-server NAND flash card, the ioDrive2, doubling the card's speed, bandwidth and density, while maintaining its resiliency and endurance.

One reason for the delay in both Q1 and Q2 could have been uncertainty on how to record the loss of manufacturing capacity, and capacity utilization, at Japanese companies affected by the aftermath of the great earthquake and tsunami that struck northern Japan on March 11. This will have had a small but significant effect in the first quarter but is likely to have had a much bigger effect in the second quarter.

Applied Materials announced that Toshiba has purchased its SmartSched predictive scheduling software to improve the capacity and efficiency of its photolithography operations. Installation of the first phase of this breakthrough software solution began in August at Toshiba's Fab 4 facility in Yokkaichi, Japan.

Samsung's total capacity is expected to be eight million 4-inch OLED panels per month by the end of 2011. But the display maker is also said to have delayed investments for larger screen sizes of 6 inches to 9 inches until 2012.

STMicroelectronics plans to significantly increase its MEMS production capacity to more than 3 million sensors a day by the end of 2011 to sustain exploding demand.

TSMC has said it won't start using three-dimensional transistors to produce semiconductors before the capacity of 2D chips reaches its limit, adding the infrastructure for the next generation of transistors is still "immature."

Last fall, industry analysts predicted there would be an oversupply of manufacturing capacity due to a market correction following the strong revenue posted in 2010, but following the earthquake, tsunami, and now nuclear crisis in Japan, the landscape looks different.

LDK Solar has announced a business investment of approximately US$40 million to establish a new manufacturing plant in Nanchang City, Jiangxi Province (China). This new manufacturing facility will have capacity to supply two million 2-inch equivalent pieces of sapphire wafers per year and be positioned to capture the growing opportunities in the LED industry.

South Korea's LG Chem on April 6 completed what it described as the world's largest battery plant for electric cars and vowed to become a major producer by 2015. The company said the factory in Ochang, south of Seoul, has enough capacity to produce lithium-ion batteries for 100,000 of the green autos a year.

TowerJazz has signed a non-binding term sheet contemplating its purchase of Micron Technology's fabrication facility in Nishiwaki City, Hyogo, Japan. The proposed purchase would nearly double TowerJazz's current internal manufacturing capacity, increasing production by 60,000 wafers per month.

Although more flash production capacity is coming online, SanDisk CEO Sanjay Mehrotra downplayed the risk that oversupply will hurt prices this year.

On Semiconductor plans to invest more than US$30 million to expand capacity and capabilities at its 8-inch wafer manufacturing facility in Gresham, Oregon. The facility remains the company's most advanced wafer fab - with current production technologies down to 0.11-micron.

"Leading-edge capacity excess, driven by Globalfoundries' expansion primarily, means pricing is going to come down," said Intel CEO Paul Otellini. "As leading-edge pricing comes down, so does the trailing-edge [pricing], hollowing out the business. That means real trouble for Globalfoundries and TSMC over the next few years." He conceded that Samsung was a different case with its memory and logic operations.

When a final agreement is reached, Powerchip will phase out the sales of own branded DRAMs and Elpida will purchase all PC DRAMs from Powerchip to sell them as its own branded products. Powerchip currently has 80,000 wafers per month capacity for commodity DRAM production.

Sony has announced plans to invest approximately 100 billion yen (US$1.2 billion) over the fiscal year ending March 31, 2012, to double its production capacity for CCD and CMOS image sensors. The investment plan includes the transfer of a plant from Toshiba.

Sony plans to buy back a Nagasaki semiconductor plant from Toshiba for about 50 billion yen (US$597.2 million) to double output capacity for image sensors used in smartphones and other devices, the Nikkei business daily reported recently.

China aims to bring online at least 1 gigawatt of solar power capacity annually from 2013 under its "Golden Sun" pilot program, aided by increases in subsidies to boost the domestic solar industry, the Ministry of Finance said

Sharp will spend 15 billion yen to add a new assembly line for mass-producing highly efficient solar cells at its Sakai plant this fiscal year. The line will be able to churn out the equivalent of 200,000kw a year, driving up Sharp's total annual solar cell output capacity more than 20% to 1.07 million kilowatts.

The investment will be spent by the end of December, the company told the stock exchange.

Solar panel producer Suntech Power Holdings Co. said Wednesday it is buying 375 megawatts of wafer manufacturing capacity in China for $127 million.