- 12 Sep 2016:Chipmakers plan to significantly expand capacity in China, with total investment expected to reach US$50 billion in the next five years, more than double what they spent during the preceding five years, according to a Nikkei survey.
- 29 Jul 2016:We note that Intel has been building new capacity at Dalian - it could be cheaper for Intel to buy NAND capacity from Micron than to invest in expanding new capacity at Dalian.
- 17 Mar 2016:Kyocera will spend about JPY15 billion (US$132 million) to double production capacity for flip-chip chip scale package (FC CSP)substrates. These items carry the central processing unit, communication modules and sensors, and connect to the printed circuit board which holds other components such as resistors.
- 21 Oct 2015:Intel to spend at least $3.5 billion converting China plant for memory chips (Oct 20) - Marketwatch.com (Dow Jones)Intel's move comes as the chip industry undergoes a wave of consolidation and China steps up efforts to build local technology manufacturing capacity.
- 25 Sep 2015:AMD contracts TSMC to produce Zen at 16nm amidst concerns over 14nm woes at Globalfoundries (Sep 24) - WCCF TechAMD has allegedly decided to delegate the responsibility of producing its hotly anticipated Zen CPU chips to TSMC on its 16nm FinFET process. This development has allegedly unfolded amidst AMD fears of Globalfoundries' slow 14nm FinFET yield and capacity progress.
- 18 Aug 2015:Skyworks Solutions has announced that it is expanding production capacity in Japan to meet the growing demand for its filter technology.
- 13 Jul 2015:Sony said it expects to raise as much as JPY300 billion (US$2.4 billion) after setting a price for new common shares it is selling to raise money for boosting chipmaking capacity.
- 2 Jun 2015:A new low-power, high-speed memory technology on the horizon could replace solid-state drives, hard drives and DRAM in PCs, and bring higher levels of storage capacity to mobile devices and wearables.
- But company officials and market experts say if the two raise their production capacity, the long-term supply growth will remain constrained due to technological complexity.
- 24 Apr 2015:Samsung Electronics is set to spend at least another 10 trillion won (US$9.2 billion) to boost capacity at a new South Korean chip plant, a 64% increase over announced investment plans, domestic online news service MoneyToday reported.
- 27 Feb 2014:JEDEC Solid State Technology Association has announced the publication of Release 6 of the DDR3 Serial Presence Detect (SPD) document. The updated standard describes new memory timing parameters and enables higher capacity memory modules.
- 10 Jan 2014:Canon is shifting capacity back to Japan in an apparent vindication of Prime Minister Shinzo Abe's yen-weakening policies, which have made it more profitable for some Japanese manufacturers to produce and export from home.
- 14 Oct 2013:Dongbu HiTek is not exactly a household name in the foundry business like TSMC, Globalfoundries and Samsung. But Dongbu, a company described by some as the industry's best kept secret, has been sharpening its strategy, honing its skills, and steadily expanding capacity in South Korea under Chang-Sik Choi, who became its president and CEO a year and a half ago.
- 16 Aug 2013:"We are seeing a near-term slowdown in investment by our foundry customers as they focus on ramping (production using) new capacity installed over the past two quarters," said Applied CEO Michael Splinter.
- 15 Jul 2013:If Apple owned capacity at a fab, it would give the company the kind of control over both design and chip manufacturing that Intel has.
- 27 Jun 2013:With Toshiba's existing chip facilities now running at full capacity, the company may spend some of a 38% hike in its capex budget this year on extending a factory, the company's incoming president, Hisao Tanaka, said in a recent interview.
- 6 Jun 2013:Contract chipmaker Globalfoundries will spend US$4.5 billion to boost production capacity in 2013, anticipating a burst in orders for chips used in low-cost smartphones.
- 21 May 2013:RFMD will phase out manufacturing in its UK-based GaAs pHEMT facility and transition most GaAs manufacturing to its GaAs HBT manufacturing facility in Greensboro, NC. RFMD will also partner with leading GaAs HBT foundries for additional capacity.
- 11 Jan 2013:New Micron and Crucial M500 SSDs offer affordable, high-capacity storage (January 10) - Company releaseThe M500 SSD utilizes Micron's 20nm multilevel cell (MLC) NAND flash to achieve terabyte-class capacity and enable a new level of SSD price competitiveness; the 960GB Crucial M500 SSD will be initially priced under US$600.
- 26 Jun 2012:Sony has announced plans to invest in Sony Semiconductor's Nagasaki Technology Center from the first half of the fiscal year ending March 31, 2013 through the first half of the fiscal year ending March 31, 2014, to increase the production capacity for stacked CMOS image sensors.
- 28 Mar 2012:EV Group (EVG) announced that Himax Technologies has placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system. The IQ Aligner will be used by Himax to support the company's capacity increase in the production of wafer-level cameras used in mobile phones, notebook computers and other consumer electronic devices.
- 17 Jan 2012:Samsung Electronics may issue first overseas bond since 1997 (January 16) - Bloomberg (via Businessweek)The company has sent requests for proposals to banks to borrow as much as US$1 billion to expand production capacity at its factory in Austin, Texas, said James Chung, a Seoul-based spokesman for Samsung. The bonds will be issued by Samsung's US unit and may have maturities of five years.
- 7 Jan 2012:Marvell Friday launched what it's calling the industry's first PCI Express (PCIe) NAND flash controller, which it describes as a building block that allows solid state drive (SSD) and system manufacturers to scale products up or down in capacity and performance using commodity hardware.
- 6 Jan 2012:After several years of rapid capacity expansion driven by high-brightness LED used in TV backlighting applications, a 40% decline in world metal organic chemical vapor deposition (MOCVD) purchases in 2012 will reduce overall LED equipment spending for the first time in over five years.
- 24 Oct 2011:Innovation Network Corp. of Japan is making final arrangements to buy a liquid crystal display panel plant from Panasonic Corp. to boost the production capacity of a joint LCD venture it is forming with three manufacturers, sources said Friday.
- 12 Oct 2011:ASML has said orders in the fourth quarter will increase from the third-quarter level as customers add capacity and shift to more advanced-technology machines.
- 7 Oct 2011:Fusion-io has released the first upgrade to its in-server NAND flash card, the ioDrive2, doubling the card's speed, bandwidth and density, while maintaining its resiliency and endurance.
- 5 Oct 2011:One reason for the delay in both Q1 and Q2 could have been uncertainty on how to record the loss of manufacturing capacity, and capacity utilization, at Japanese companies affected by the aftermath of the great earthquake and tsunami that struck northern Japan on March 11. This will have had a small but significant effect in the first quarter but is likely to have had a much bigger effect in the second quarter.
- 28 Sep 2011:Toshiba selects Applied Materials solution to boost lithography efficiency (September 27) - Company releaseApplied Materials announced that Toshiba has purchased its SmartSched predictive scheduling software to improve the capacity and efficiency of its photolithography operations. Installation of the first phase of this breakthrough software solution began in August at Toshiba's Fab 4 facility in Yokkaichi, Japan.
- 30 May 2011:Samsung's total capacity is expected to be eight million 4-inch OLED panels per month by the end of 2011. But the display maker is also said to have delayed investments for larger screen sizes of 6 inches to 9 inches until 2012.
- 27 May 2011:STMicroelectronics plans to significantly increase its MEMS production capacity to more than 3 million sensors a day by the end of 2011 to sustain exploding demand.
- 11 May 2011:TSMC has said it won't start using three-dimensional transistors to produce semiconductors before the capacity of 2D chips reaches its limit, adding the infrastructure for the next generation of transistors is still "immature."
- 13 Apr 2011:Last fall, industry analysts predicted there would be an oversupply of manufacturing capacity due to a market correction following the strong revenue posted in 2010, but following the earthquake, tsunami, and now nuclear crisis in Japan, the landscape looks different.
- 8 Apr 2011:LDK Solar has announced a business investment of approximately US$40 million to establish a new manufacturing plant in Nanchang City, Jiangxi Province (China). This new manufacturing facility will have capacity to supply two million 2-inch equivalent pieces of sapphire wafers per year and be positioned to capture the growing opportunities in the LED industry.
- 7 Apr 2011:South Korea's LG Chem on April 6 completed what it described as the world's largest battery plant for electric cars and vowed to become a major producer by 2015. The company said the factory in Ochang, south of Seoul, has enough capacity to produce lithium-ion batteries for 100,000 of the green autos a year.
- 6 Apr 2011:TowerJazz expected to nearly double capacity with proposed acquisition of Micron plant (Apr 4) - Company releaseTowerJazz has signed a non-binding term sheet contemplating its purchase of Micron Technology's fabrication facility in Nishiwaki City, Hyogo, Japan. The proposed purchase would nearly double TowerJazz's current internal manufacturing capacity, increasing production by 60,000 wafers per month.
- 25 Feb 2011:Although more flash production capacity is coming online, SanDisk CEO Sanjay Mehrotra downplayed the risk that oversupply will hurt prices this year.
- On Semiconductor plans to invest more than US$30 million to expand capacity and capabilities at its 8-inch wafer manufacturing facility in Gresham, Oregon. The facility remains the company's most advanced wafer fab - with current production technologies down to 0.11-micron.
- 21 Feb 2011:"Leading-edge capacity excess, driven by Globalfoundries' expansion primarily, means pricing is going to come down," said Intel CEO Paul Otellini. "As leading-edge pricing comes down, so does the trailing-edge [pricing], hollowing out the business. That means real trouble for Globalfoundries and TSMC over the next few years." He conceded that Samsung was a different case with its memory and logic operations.
- 1 Feb 2011:When a final agreement is reached, Powerchip will phase out the sales of own branded DRAMs and Elpida will purchase all PC DRAMs from Powerchip to sell them as its own branded products. Powerchip currently has 80,000 wafers per month capacity for commodity DRAM production.
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