- 22 Apr 2010:
- 19 Apr 2010:
- 17 Mar 2010:Ramifications of slowed manufacturing capacity output and a lack of capital expenditure over the past 24 months, combined with increased demand driven by a hot PC market, has resulted in a very positive environment for DRAM pricing.
- 16 Mar 2010:Two of China's top chipmakers and Intel's lone China factory are all running at or near full capacity, as China's sector rebounds more quickly than the rest of the world, according to senior executives at the three firms.
- 15 Mar 2010:Abu Dhabi-backed foundry Globalfoundries is planning to spend US$2.5 billion to increase its 300mm wafer manufacturing capacity by 50% in 2010, according to Udo Nothelfer, company VP and general manager of Fab 1 in Dresden, Germany.
- LCD panel maker LG Display will spend US$1.3 billion to raise output and help meet robust customer demand and is betting on booming premium LCD TV sales to drive strong growth this year.
- 12 Mar 2010:Hynix Semiconductor has said it would invest 465 billion won (US$410 million) to expand and upgrade its production capacity and research and development.
- 11 Mar 2010:Konica Minolta has decided to enhance its production capacity of glass substrates of hard disk drives (HDDs) by adding production line in response to a rapid growth in demand and the accelerated increase in storage density.
- 10 Mar 2010:Abu Dhabi government-owned Advanced Technology Investment Company (ATIC) plans to spend US$2-3 billion this year in capacity expansion as it eyes a larger share of the global contract chip industry.
- 20 Jan 2010:We closed the year as planned with improved sales and strong bookings, as the semiconductor business recovers driven by technology and capacity buys from major Foundry customers and the memory market segments, according to ASML president and CEO Eric Meurice.
- 7 Jan 2010:A recent research by SEMI indicates China is committed to narrow the gap between its IC production and consumption. "In addition to investments in the macro economy, the Chinese government also remains the biggest investor in the semiconductor industry in China..."
- 9 Dec 2009:Hynix is slated to boost its production capacity of NAND flash memory at its 12-inch, Cheongju fab (M11) to 90,000 wafers per month in 2010 from the current level of 45,000 units, according to industry sources.
- 25 Nov 2009:DuPont Apollo has announced the opening of its silicon based thin-film photovoltaic module manufacturing facility. The 538,000-square-feet facility will have an annual capacity of up to 50 megawatts with a thin-film-on-glass PV module production line. Full-scale commercial production is slated for the first quarter of 2010.
- 16 Nov 2009:Suntech Power has announced that its first US manufacturing plant for the growing North American market would be located in the Greater Phoenix, Arizona area. The plant will have an initial production capacity of 30 megawatts (MW) and is expected to begin production in the third quarter of 2010.
- 12 Nov 2009:Besides adding manufacturing capacity through ATIC's acquisition of Chartered and the construction of a new plant in New York, Globalfoundries is counting on advanced process technologies to help it win customers and compete with rivals like TSMC.
- 11 Nov 2009:Intel will release a US$120 solid-state disk (SSD) drive positioned as a server "boot drive" with only 40GB of capacity, but the drive could also be used in low-end laptops PCs and netbooks.
- 28 Oct 2009:
- 6 Oct 2009:As China primes its energy market for explosive growth, the country could see one gigawatt of solar power generation capacity by 2011, said a new report by GTM Research.
- 19 Aug 2009:Eli Harari, founder, chairman and chief executive of SanDisk, made the predications during a keynote. He also warned that the NAND industry is at the "crossroads," as there is a "disconnect" between future capacity requirements and demand.
- 13 Aug 2009:"During the boom, there were significant capacity increases. There were also, by the way, significant announcements of capacity that may or may not have happened..."
- 7 Aug 2009:Toshiba has begun volume shipments of solid-state drives ranging up to 512GB in size. The drives are built on a 43nm manufacturing process using multi-level cell (MLC) technology.
- 5 Aug 2009:OCZ Technology has confirmed it will release its Colossus solid-state drive (SSD) in the next couple of weeks, delivering the first 3.5-inch form factor SSD with 1TB of capacity.
- 10 Jul 2009:
- 9 Jul 2009:
- 13 May 2009:New technology brings significant increase in mobile network capacity and phone battery life (May 12) - Company releaseFinnish operator Elisa and Nokia Siemens Networks have successfully demonstrated a new technology that allows operators to simply and cost effectively increase voice capacity of their 3G networks, potentially up to 100%.
- 18 Dec 2008:"We are taking advantage of the company-wide vacation period starting in late December to achieve the cuts," a Hynix spokeswoman told Reuters. "We will reevaluate our decision early next year depending on the market situation."
- 10 Dec 2008:"The bottom is yet to come," said Jae H. Lee, an analyst at Daiwa Securities. "Oversupply is a given fact until next year and chip companies will have to cut down capacity." "We currently see no reason to be invested in the memory sector," said Robert Lea, an analyst with UBS. "We believe the industry recovery has been pushed out to 2010."
- 13 Nov 2008:Leading chip-equipment maker Applied Materials warned that profit in the current quarter would fall far short of Wall Street expectations due to the weakening global economy. The company also said on Wednesday it would slash 1,800 jobs, or 12 percent of its workforce, to generate annual savings of $400 million.
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