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News tagged Chipbond
  • Last update: Tuesday 7 April 2015 [132 news items]

Renesas raises outsourcing to Taiwan partners, says paper

Newswatch - Jul 2, 16:39

Renesas Electronics has raised its orders to Powerchip Technology for its LCD driver ICs, and also grown its outsourcing to backend partner Chipbond Technology, according to a recent...

Chipbond to buy new testers; 2010 capex to reach NT$2 billion

Jun 29, 11:44

Chipbond Technology has announced it plans to spend NT$2 billion (US$62 million) in capex this year, an upward revision from its originally-planned NT$1.5 billion. The LCD driver-IC...

Chipbond chairman Fei-Jain Wu

Chipbond looks to 10% sequential revenue growth in 3Q10

Newswatch - Jun 28, 17:03

LCD driver-IC packaging and testing house Chipbond Technology expects revenues for the third quarter of 2010 to grow by 10% on quarter, chairman Fei-Jain Wu said at the company's...

Driver IC packager Chipbond at almost full capacity on strong demand ahead of holiday season

Jun 23, 11:00

Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers...

Chipbond to raise stake in China affiliate

Jun 7, 14:55

Chipbond Technology has filed an application with the Taiwan government to take up a majority stake in China-based Chipmore Technology, which it now owns almost 20%, according to...

Chipbond sees profits in 1Q10

Apr 23, 15:37

LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...

Chipbond sees 1Q10 revenues beat guidance

Newswatch - Apr 8, 11:11

Chipbond Technology has reported revenues of NT$801 million (US$25 million) for March 2010, with revenues for the first quarter beating its previous estimates. The LCD driver IC packaging...

Prices for LCD driver IC backend services to rise in 2Q10

Apr 2, 15:56

LCD driver IC packaging and testing house Chipbond Technology is integrating the different quotes offered by it and International Semiconductor Technology (IST) before their merger,...

Chipbond completes merger with peer IST

Stockwatch - Apr 1, 15:21

LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...

SPIL to drop out from LCD driver IC, DRAM segments; sell related equipment to ChipMOS

Mar 1, 11:39

Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...

Chipbond seeing high utilization rates

Feb 26, 16:56

LCD driver IC backend house Chipbond Technology has stated that its utilization rates for the ongoing first quarter has returned to the high levels recorded in the third quarter of...

Chipbond sees January 2010 sales up 24% on month

Feb 11, 16:26

Chipbond Technology has announced revenues for January 2010 grew 23.61% sequentially to NT$608 million (US$18.93 million). The LCD driver IC packaging and testing house projected...

Driver IC backend supply to tighten, says Chipbond chairman

Jan 27, 16:56

Fei-Jain Wu, chairman of driver-IC backend house Chipbond Technology, has predicted that demand for wafer probe testing will exceed supply in March 2010. Wu also believes a similar...

Chipbond chairman Fei-Jain Wu

Chipbond capex to more than double in 2010

Jan 26, 15:07

Chipbond Technology has set a capex goal of NT$1.5 billion (US$47 million) for 2010 compared to NT$700 million allocated for the previous year, according to company chairman Fei-Jain...

Chipbond, IST merger may complete ahead of schedule

Newswatch - Jan 20, 12:17

LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger...

LCD driver IC backend houses considering raising quotes

Jan 13, 11:15

LCD driver IC packaging and testing houses are considering raising their quotes soon in part due to tight production resulting from a surge in demand and in part due to persistent...

Taiwan likely to lift cross-strait ban on backend semiconductor technology soon

Dec 30, 10:14

The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...

Chipbond-IST merger set to complete in June 2010

Stockwatch - Dec 28, 16:34

LCD driver IC packaging house International Semiconductor Technology (IST) has announced that its board of directors on December 25 approved a deal to merge with Chipbond Technology,...

Taiwan IC backend industry to see more consolidation in 2010, says TICP chairman

Dec 17, 16:22

The Taiwan IC packaging and testing industry will continue to consolidate in 2010, in the wake of Chipbond Technology's recently-announced merger with counterpart International Semiconductor...

IST merger to further lighten non-operating investment burden for Compal

Dec 8, 15:21

The merger of Chipbond Technology and International Semiconductor Technology (IST) is expected to help the Compal Group turn its investment in IST from a loss to profit, according...

Chipbond and IST announce merger

Dec 7, 17:00

Driver IC packaging houses Chipbond Technology and International Semiconductor Technology (IST) today (December 7) announced a merger through a stock swap.

Chipbond eyes outsourcing COF substrate orders from Mitsui subsidiary

Dec 2, 14:36

Chipbond Technology has disclosed it is negotiating an outsourcing deal with MCS, a subsidiary of Japan-based Mitsui Kinzoku. Both parties have been evaluating the possibility of...

Chipbond, IST deny merger rumors

Newswatch - Dec 2, 11:47

LCD driver IC packaging and testing houses Chipbond Technology and International Semiconductor Technology (IST) have both dismissed recent rumors that the two companies plan to merge...

Chipbond likely to miss revenue guidance for 4Q09, say watchers

Nov 20, 16:38

LCD driver IC packaging and testing house Chipbond Technology may see fourth-quarter 2009 revenues decline by up to 30% sequentially, as customers' inventory levels are still high,...

One too many LCD driver IC backend service providers in Taiwan, says Chipbond

Nov 19, 14:22

Taiwan-based Chipbond Technology has commented that reducing the number of the local LCD driver IC packaging and testing houses to three through acquisitions or mergers will help...

Chipbond affiliate in China suspends expansion plan pending rule changes

Nov 16, 14:16

Chipbond Technology's China-based affiliate Chipmore Technology has suspended plans to expand capacity for gold bumping, pending possible changes to Taiwan government policies concerning...

Driver IC backend supplier revenues down in October 2009

Nov 6, 16:56

Driver IC backend supplier Chipbond Technology saw its October revenues decline by 25.2% to NT$468 million (US$13.39 million) as customers have slowed down their pace of orders, according...

Chipbond and IST 4Q09 revenues to drop 20% on quarter

Nov 5, 16:23

Chipbond Technology and International Semiconductor Technology (IST) may see sequential revenue drops of almost 20% in the fourth quarter of 2009, in accordance with driver IC design...

Chipbond 3Q09 profits up three-fold

Newswatch - Oct 26, 10:33

LCD driver IC packaging and testing house Chipbond Technology enjoyed a net profit of NT$319 million (US$9.85 million), or NT$1.03 per share in the third quarter of 2009, compared...

Chipbond and IST return to on-year growth in 3Q09

Oct 9, 10:25

LCD driver IC packaging and testing firm Chipbond Technology saw revenues amount to NT$1.88 billion (US$58.4 million) in the third quarter of 2009, a 4.4% on-year increase compared...

Driver IC backend suppliers conservative about 4Q09

Oct 6, 14:38

Chipbond Technology and International Semiconductor Technology (IST) both expect their fourth-quarter 2009 shipments to likely fall by less than 20% sequentially as a result of seasonality...

Chipbond and IST revenues to fall less than 20% sequentially in 4Q09

Sep 15, 15:19

Chipbond Technology and International Semiconductor Technology (IST), two major Taiwan-based LCD driver IC packaging and testing houses, have both estimated September 2009 revenues...

Chipbond August 2009 revenues hit high

Newswatch - Sep 8, 14:39

Driver IC packaging and testing firm Chipbond Technology saw its monthly revenues hit a record of NT$640 million (US$19.5 million) in August, representing a 52.5% increase from NT$420...

Driver IC backend suppliers upbeat about 3Q09

Sep 2, 14:29

Chipbond Technology is performing better than previously expected in the third quarter of 2009, thanks to growing demand from IDM customers, according to the company. The driver IC...

Chipbond raises capex

Newswatch - Sep 2, 12:03

Driver IC testing and packaging house Chipbond Technology has raised its capex budget for 2009 by 40% to NT$700 million (US$21.28 million), according to the company. The additional...

132 items [3/4]
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