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News tagged Chipbond
  • Last update: Tuesday 16 August 2016 [147 news items]

Chipbond, KYEC team up for power IC packaging and testing

Mar 3, 01:05

LCD driver-IC packaging and testing firm Chipbond Technology and King Yuan Electronics (KYEC), which specializes in chip probing and final test services, have signed a memorandum...

Chipbond to report strong EPS for 2011, says paper

Stockwatch - Feb 15, 12:03

Taiwan's Chipbond Technology is expected to enjoy substantial growth sequentially in revenues and profits in the first quarter of 2011, thanks to contributions from subsidiary Chipmore...

VIS January revenues up 12% on order rebound

Feb 10, 15:42

With LCD driver IC clients having completed inventory adjustments, specialty IC foundry Vanguard International Semiconductor (VIS) saw revenues increase 12.3% sequentially to NT$1.41...

Chipbond responds to media reports on 1Q11 sales

Stockwatch - Jan 20, 15:28

Chipbond Technology has posted a filing with the Taiwan Stock Exchange (TSE) stating it has not issued revenues guidance for the first quarter of 2011.

Chipbond expects sales to start recovering in December

Dec 16, 01:05

Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, expects December 2010 revenues to grow sequentially after having seen on-month drops over the...

Taiwan-based LCD driver IC designers to adopt 12-inch processes soon

Nov 12, 01:25

LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...

Chipbond expects 10-15% sequential drop in 4Q10 revenues

Nov 11, 01:10

Panel driver IC packaging/testing house Chipbond Technology expects revenues for the fourth quarter of 2010 to fall 10-15%, according to the company. Chipbond's revenues of NT$1.085...

Chipbond cautious about 4Q10

Nov 4, 01:50

Chipbond Technology believes its October 2010 sales may have dropped sequentially. The driver-IC packaging and testing firm also estimated total orders for November may be similar...

Chipbond 3Q10 sales hit record, but miss guidance

Oct 27, 14:32

LCD driver-IC packaging and testing firm Chipbond Technology has announced revenues for the third quarter of 2010 of NT$3.697 billion (US$121 million), which topped its previous record...

Chipbond likely to miss revenue guidance for 3Q10

Sep 24, 01:05

Chipbond Technology will likely see revenues for the third quarter of 2010 remain flat on quarter, missing its guidance of 5-10% growth, according to market watchers. The driver-IC...

Demand rebound for large-size panels to move back from August to October, says Chipbond chairman

Sep 1, 15:38

A demand rebound for large-size LCD panels will take place in the first two weeks of October instead of August as previously expected, Fei-Jain Wu, chairman of driver-IC packaging...

Chipbond posts strong 2Q10 results; gives cautious outlook

Aug 9, 16:12

Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...

Chipbond chairman Fei-Jain Wu

Chipbond expected to post strong profit growth for 2Q10

Newswatch - Aug 3, 14:13

Chipbond Technology is likely to report that second-quarter net profits more than doubled sequentially to NT$800 million (US$25 million), thanks to higher revenues and gross margin,...

Chipbond sees moderate growth in 3Q10

Jul 21, 11:37

LCD driver IC packaging and testing house Chipbond Technology expects July revenues to slightly decrease from June, but overall demand will pick up again in August and September....

Chipbond 2Q10 revenues beat guidance

Jul 12, 16:45

Major Taiwan-based driver IC packaging and testing house Chipbond Technology saw revenues soar 83.5% sequentially in the second quarter of 2010. The significant rise was higher than...

Renesas raises outsourcing to Taiwan partners, says paper

Newswatch - Jul 2, 16:39

Renesas Electronics has raised its orders to Powerchip Technology for its LCD driver ICs, and also grown its outsourcing to backend partner Chipbond Technology, according to a recent...

Chipbond to buy new testers; 2010 capex to reach NT$2 billion

Jun 29, 11:44

Chipbond Technology has announced it plans to spend NT$2 billion (US$62 million) in capex this year, an upward revision from its originally-planned NT$1.5 billion. The LCD driver-IC...

Chipbond chairman Fei-Jain Wu

Chipbond looks to 10% sequential revenue growth in 3Q10

Newswatch - Jun 28, 17:03

LCD driver-IC packaging and testing house Chipbond Technology expects revenues for the third quarter of 2010 to grow by 10% on quarter, chairman Fei-Jain Wu said at the company's...

Driver IC packager Chipbond at almost full capacity on strong demand ahead of holiday season

Jun 23, 11:00

Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers...

Chipbond to raise stake in China affiliate

Jun 7, 14:55

Chipbond Technology has filed an application with the Taiwan government to take up a majority stake in China-based Chipmore Technology, which it now owns almost 20%, according to...

Chipbond sees profits in 1Q10

Apr 23, 15:37

LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...

Chipbond sees 1Q10 revenues beat guidance

Newswatch - Apr 8, 11:11

Chipbond Technology has reported revenues of NT$801 million (US$25 million) for March 2010, with revenues for the first quarter beating its previous estimates. The LCD driver IC packaging...

Prices for LCD driver IC backend services to rise in 2Q10

Apr 2, 15:56

LCD driver IC packaging and testing house Chipbond Technology is integrating the different quotes offered by it and International Semiconductor Technology (IST) before their merger,...

Chipbond completes merger with peer IST

Stockwatch - Apr 1, 15:21

LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...

SPIL to drop out from LCD driver IC, DRAM segments; sell related equipment to ChipMOS

Mar 1, 11:39

Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...

Chipbond seeing high utilization rates

Feb 26, 16:56

LCD driver IC backend house Chipbond Technology has stated that its utilization rates for the ongoing first quarter has returned to the high levels recorded in the third quarter of...

Chipbond sees January 2010 sales up 24% on month

Feb 11, 16:26

Chipbond Technology has announced revenues for January 2010 grew 23.61% sequentially to NT$608 million (US$18.93 million). The LCD driver IC packaging and testing house projected...

Driver IC backend supply to tighten, says Chipbond chairman

Jan 27, 16:56

Fei-Jain Wu, chairman of driver-IC backend house Chipbond Technology, has predicted that demand for wafer probe testing will exceed supply in March 2010. Wu also believes a similar...

Chipbond chairman Fei-Jain Wu

Chipbond capex to more than double in 2010

Jan 26, 15:07

Chipbond Technology has set a capex goal of NT$1.5 billion (US$47 million) for 2010 compared to NT$700 million allocated for the previous year, according to company chairman Fei-Jain...

Chipbond, IST merger may complete ahead of schedule

Newswatch - Jan 20, 12:17

LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger...

LCD driver IC backend houses considering raising quotes

Jan 13, 11:15

LCD driver IC packaging and testing houses are considering raising their quotes soon in part due to tight production resulting from a surge in demand and in part due to persistent...

Taiwan likely to lift cross-strait ban on backend semiconductor technology soon

Dec 30, 10:14

The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...

Chipbond-IST merger set to complete in June 2010

Stockwatch - Dec 28, 16:34

LCD driver IC packaging house International Semiconductor Technology (IST) has announced that its board of directors on December 25 approved a deal to merge with Chipbond Technology,...

Taiwan IC backend industry to see more consolidation in 2010, says TICP chairman

Dec 17, 16:22

The Taiwan IC packaging and testing industry will continue to consolidate in 2010, in the wake of Chipbond Technology's recently-announced merger with counterpart International Semiconductor...

IST merger to further lighten non-operating investment burden for Compal

Dec 8, 15:21

The merger of Chipbond Technology and International Semiconductor Technology (IST) is expected to help the Compal Group turn its investment in IST from a loss to profit, according...

147 items [3/5]
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