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News tagged Chipbond
  • Last update: Wednesday 21 September 2016 [150 news items]

UMC rolls out thick-plated copper process for PWM ICs

Jan 17, 10:28

United Microelectronics (UMC) has developed a thick-plated copper process, in collaboration with packaging house Chipbond Technology, for power management IC applications.

Chipbond posts record sales in 4Q, 2012

Jan 14, 20:19

Consolidated revenues at Taiwan-based Chipbond Technology, a packaging and testing house specializing in LCD driver ICs, climbed to an all-time high of NT$4.17 billion (US$144.1 million)...

Chipbond to post better-than-expected 4Q12 sales

Dec 6, 15:31

LCD-driver-IC packaging and testing house Chipbond Technology is expected to report an up to 5% sequential increase in consolidated revenues for the fourth quarter of 2012, bucking...

Chipbond posts profit growth on record revenues in 3Q12

Oct 30, 14:42

Chipbond Technology has reported net profits of NT$729 million (US$24.9 million) on consolidated revenues of NT$3.88 billion for the third quarter of 2012. The earnings and sales...

Chipbond 4Q12 sales likely to drop 5%

Oct 18, 22:14

LCD-driver-IC packaging and testing house Chipbond Technology is expected to post a sales drop of about 5% sequentially in the fourth quarter of 2012, compared to the double-digit...

Chipbond 12-inch gold bumping lines to operate at full capacity in September

Sep 11, 16:33

LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...

Chipbond 3Q12 sales driven by demand for small-size panel driver ICs

Aug 21, 01:15

Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...

Chipbond revenues hit two-year high in July 2012

Aug 10, 14:15

LCD driver IC packaging and testing firm Chipbond Technology has announced consolidated revenues of NT$1.27 billion (US$42.3 million) for July 2012 - the highest monthly result since...

Chipbond 3Q12 sales to grow up to 5%

Jul 13, 12:03

LCD-driver-IC packaging and testing house Chipbond Technology is expected to report sales growth of up to 5% sequentially for the third quarter of 2012, according to market sources...

ASE, SPIL post sales drops in June

Jul 10, 01:05

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported decreases in June consolidated revenues from the previous month of 1.7% and 5.9%,...

Most backend firms give positive 3Q12 outlook

Jul 4, 01:25

With shipments from upstream chipmakers rising, most Taiwan-based packaging and testing houses are expected to post sequential growth in third-quarter sales.

Chipbond gold bumping capacity booked for iPhones, says report

Newswatch - Jun 29, 12:37

Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...

Chipbond, ChipMOS 2Q12 sales to grow 10%

Jun 25, 15:45

Second-quarter sales at Chipbond Technology and ChipMOS Technologies, two major driver IC packaging and testing houses, are set to register 10% sequential growth driven by brisk demand...

Chipbond sees positive outlook for 2012

Jun 18, 14:54

Chipbond Technology is optimistic about the business prospects for 2012, according to the LCD driver IC packaging and testing specialist. The firm added it would continue to build...

Major Taiwan IC backend firms to post over 5% sales growth in 2Q12

Jun 11, 12:27

Major Taiwan-based IC packaging and testing houses including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Chipbond...

Chipbond lands orders for driver ICs used in new iPhone and Samsung TFT-LCD panels

Jun 5, 01:50

Driver IC packaging testing service provider Chipbond Technology has obtained orders for COG (chip on glass) chips used in screens for a new version of the iPhone, and 8-inch gold...

Chipbond lands 8-inch gold bumping orders from Samsung, says paper

Newswatch - Jun 4, 14:23

LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...

Chipbond, ChipMOS 2Q12 sales expected to grow

May 7, 15:41

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales register single-digit growth sequentially thanks...

Rising demand for small-size driver ICs to boost revenues for Chipbond, ChipMOS

Apr 17, 14:55

LCD driver IC packaging and testing firms Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales rise driven by growing demand for small-size...

Chipbond, ChipMOS see sequential growth in March revenues

Apr 11, 01:25

LCD driver IC packaging and testing service providers Chipbond Technology reported March revenues of NT$1.172 billion (US$39.7 million), an increase of 7.8% on month. The firm reported...

SPIL

Chipmore to benefit from more panels produced in China

Apr 3, 14:54

With China adjusting upward its import tariffs for 32-inch and larger LCD panels, the country's self-sufficiency for panels targeted mainly at TVs is expected to rise significantly...

Chipbond sees flat growth in 1Q12 sales

Mar 13, 14:22

Chipbond Technology, which provides packaging and testing services for driver ICs used mainly in TV and handset panels, expects its consolidated revenues to register flat sequential...

Chipbond sales to rise 5% in 1Q12, says paper

Newswatch - Feb 10, 14:21

LCD driver IC packaging and testing specialist Chipbond Technology is expected to see its consolidated revenues increase as much as 5% sequentially in the first quarter of 2012, beating...

Some Taiwan LCD driver IC designers release orders to South Korea-, Japan-based packaging/testing firms

Jan 18, 01:05

Some Taiwan-based LCD driver IC design houses, in order to spread risks, have placed orders for 8-inch bumping packaging and testing services with South Korea- and Japan-based providers,...

Chipbond, ChipMOS develop alternative to gold bumping

Jan 3, 11:53

Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...

LCD market to rebound in 2Q12, says Chipbond

Dec 22, 01:05

Chipbond Technology has expressed caution about the company's business outlook for the rest of 2011 and first-quarter 2012, as generally weak demand continues to plague the LCD panel...

Chipbond launches share buyback program

Stockwatch - Nov 3, 16:15

LCD driver IC packaging and testing house Chipbond Technology has announced plans to repurchase 10 million, or 1.68%, of the company's outstanding shares, at between NT$22 (US$0.73)...

Chipbond expects flat or slight growth in 4Q11 sales

Nov 3, 01:05

Chipbond Technology, which provides backend services to LCD driver IC suppliers such as Japan's Renesas Electronics, Taiwan-based Novatek Microelectronics and ILi Technology (Ilitek),...

Chipbond 3Q11 profit rises on forex gain

Oct 26, 10:00

Driver-IC packaging and testing house Chipbond Technology has announced financial figures for the third quarter of 2011 with net profits hiking almost 80% sequentially, as recent...

VIS, Chipbond post drops in 3Q11 revenues

Oct 11, 12:08

Vanguard International Semiconductor (VIS), a major LCD driver IC foundry service provider, and driver-IC packaging and testing specialist Chipbond Technology both saw their third-quarter...

Chipbond responds to reports of price reductions

Stockwatch - Oct 4, 13:58

Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports...

Chipbond 2Q11 profits halved

Aug 24, 17:07

LCD driver IC packaging and testing firm Chipbond Technology has reported net income of NT$254 million (US$8.7 million) on revenues of NT$3.445 billion for the second quarter of 2011...

Chipbond, ChipMOS expect flat revenues in 3Q11

Jul 26, 15:37

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies, in view of stagnant demand for LCD panels, expect their revenues for the third quarter of...

Chipbond conservative about 3Q11

Jul 13, 16:03

LCD driver IC packaging and testing firm Chipbond Technology has expressed uncertainty about the outlook for the third quarter due to low order visibility.

Improved demand for LCD panels to boost Chipbond 2Q11 performance

May 23, 15:55

The market of large-size LCD panels have been improving recently. LCD driver IC packaging and testing firm Chipbond Technology has stated the possibility of a better second quarter...

150 items [2/5]
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Display panels for wearable devices

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