Taipei, Wednesday, March 29, 2017 05:57 (GMT+8)
mostly cloudy
Taipei
26°C
News tagged Chipbond
  • Last update: Wednesday 1 March 2017 [158 news items]

SPIL to drop out from LCD driver IC, DRAM segments; sell related equipment to ChipMOS

Mar 1, 11:39

Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...

Chipbond seeing high utilization rates

Feb 26, 16:56

LCD driver IC backend house Chipbond Technology has stated that its utilization rates for the ongoing first quarter has returned to the high levels recorded in the third quarter of...

Chipbond sees January 2010 sales up 24% on month

Feb 11, 16:26

Chipbond Technology has announced revenues for January 2010 grew 23.61% sequentially to NT$608 million (US$18.93 million). The LCD driver IC packaging and testing house projected...

Driver IC backend supply to tighten, says Chipbond chairman

Jan 27, 16:56

Fei-Jain Wu, chairman of driver-IC backend house Chipbond Technology, has predicted that demand for wafer probe testing will exceed supply in March 2010. Wu also believes a similar...

Chipbond chairman Fei-Jain Wu

Chipbond capex to more than double in 2010

Jan 26, 15:07

Chipbond Technology has set a capex goal of NT$1.5 billion (US$47 million) for 2010 compared to NT$700 million allocated for the previous year, according to company chairman Fei-Jain...

Chipbond, IST merger may complete ahead of schedule

Newswatch - Jan 20, 12:17

LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger...

LCD driver IC backend houses considering raising quotes

Jan 13, 11:15

LCD driver IC packaging and testing houses are considering raising their quotes soon in part due to tight production resulting from a surge in demand and in part due to persistent...

Taiwan likely to lift cross-strait ban on backend semiconductor technology soon

Dec 30, 10:14

The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...

Chipbond-IST merger set to complete in June 2010

Stockwatch - Dec 28, 16:34

LCD driver IC packaging house International Semiconductor Technology (IST) has announced that its board of directors on December 25 approved a deal to merge with Chipbond Technology,...

Taiwan IC backend industry to see more consolidation in 2010, says TICP chairman

Dec 17, 16:22

The Taiwan IC packaging and testing industry will continue to consolidate in 2010, in the wake of Chipbond Technology's recently-announced merger with counterpart International Semiconductor...

IST merger to further lighten non-operating investment burden for Compal

Dec 8, 15:21

The merger of Chipbond Technology and International Semiconductor Technology (IST) is expected to help the Compal Group turn its investment in IST from a loss to profit, according...

Chipbond and IST announce merger

Dec 7, 17:00

Driver IC packaging houses Chipbond Technology and International Semiconductor Technology (IST) today (December 7) announced a merger through a stock swap.

Chipbond eyes outsourcing COF substrate orders from Mitsui subsidiary

Dec 2, 14:36

Chipbond Technology has disclosed it is negotiating an outsourcing deal with MCS, a subsidiary of Japan-based Mitsui Kinzoku. Both parties have been evaluating the possibility of...

Chipbond, IST deny merger rumors

Newswatch - Dec 2, 11:47

LCD driver IC packaging and testing houses Chipbond Technology and International Semiconductor Technology (IST) have both dismissed recent rumors that the two companies plan to merge...

Chipbond likely to miss revenue guidance for 4Q09, say watchers

Nov 20, 16:38

LCD driver IC packaging and testing house Chipbond Technology may see fourth-quarter 2009 revenues decline by up to 30% sequentially, as customers' inventory levels are still high,...

One too many LCD driver IC backend service providers in Taiwan, says Chipbond

Nov 19, 14:22

Taiwan-based Chipbond Technology has commented that reducing the number of the local LCD driver IC packaging and testing houses to three through acquisitions or mergers will help...

Chipbond affiliate in China suspends expansion plan pending rule changes

Nov 16, 14:16

Chipbond Technology's China-based affiliate Chipmore Technology has suspended plans to expand capacity for gold bumping, pending possible changes to Taiwan government policies concerning...

Driver IC backend supplier revenues down in October 2009

Nov 6, 16:56

Driver IC backend supplier Chipbond Technology saw its October revenues decline by 25.2% to NT$468 million (US$13.39 million) as customers have slowed down their pace of orders, according...

Chipbond and IST 4Q09 revenues to drop 20% on quarter

Nov 5, 16:23

Chipbond Technology and International Semiconductor Technology (IST) may see sequential revenue drops of almost 20% in the fourth quarter of 2009, in accordance with driver IC design...

Chipbond 3Q09 profits up three-fold

Newswatch - Oct 26, 10:33

LCD driver IC packaging and testing house Chipbond Technology enjoyed a net profit of NT$319 million (US$9.85 million), or NT$1.03 per share in the third quarter of 2009, compared...

Chipbond and IST return to on-year growth in 3Q09

Oct 9, 10:25

LCD driver IC packaging and testing firm Chipbond Technology saw revenues amount to NT$1.88 billion (US$58.4 million) in the third quarter of 2009, a 4.4% on-year increase compared...

Driver IC backend suppliers conservative about 4Q09

Oct 6, 14:38

Chipbond Technology and International Semiconductor Technology (IST) both expect their fourth-quarter 2009 shipments to likely fall by less than 20% sequentially as a result of seasonality...

Chipbond and IST revenues to fall less than 20% sequentially in 4Q09

Sep 15, 15:19

Chipbond Technology and International Semiconductor Technology (IST), two major Taiwan-based LCD driver IC packaging and testing houses, have both estimated September 2009 revenues...

Chipbond August 2009 revenues hit high

Newswatch - Sep 8, 14:39

Driver IC packaging and testing firm Chipbond Technology saw its monthly revenues hit a record of NT$640 million (US$19.5 million) in August, representing a 52.5% increase from NT$420...

Driver IC backend suppliers upbeat about 3Q09

Sep 2, 14:29

Chipbond Technology is performing better than previously expected in the third quarter of 2009, thanks to growing demand from IDM customers, according to the company. The driver IC...

Chipbond raises capex

Newswatch - Sep 2, 12:03

Driver IC testing and packaging house Chipbond Technology has raised its capex budget for 2009 by 40% to NT$700 million (US$21.28 million), according to the company. The additional...

Driver IC backend supplier Chipbond enjoys strong July profits

Aug 25, 17:07

Chipbond Technology has posted net profits of NT$81 million (US$2.46 million) for July 2009 roughly equal to its net profits of NT$81.65 million for the second quarter.

Chipbond and IST urge relaxation of driver-IC backend restrictions in China

Aug 14, 16:04

Chipbond Technology and International Semiconductor Technology (IST) have called for Taiwan to relax restrictions on LCD driver IC packaging and testing production in China. They...

Chipbond sales up 40% in July

Aug 12, 15:53

LCD driver IC backend supplier Chipbond Technology saw revenues climb 40.4% to NT$610 million (US$18.6 million) in July 2009, marking an end to its run of on-year drops over the past...

LCD driver IC backend suppliers expected to enjoy revenue growth through August

Newswatch - Jul 23, 12:14

Taiwan-based LCD driver IC backend service providers are expected to see their revenues hit the year's highs in August, thanks to increased demand on seasonality, according to market...

Casio reportedly looking to sell gold-bumping equipment

Newswatch - Jul 20, 16:30

Casio Micronics is looking to sell its gold-bumping equipment, as the Japan-based company already suspended operation of its gold bumping lines in April 2009 amid difficult times,...

Chipbond, IST 2Q09 sales jump over 100% sequentially

Jul 13, 16:18

Chipbond Technology and International Semiconductor Technology (IST) saw revenues for second-quarter 2009 increase 110.4% and 152.9%, respectively, compared to their revenue results...

Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu

Jun 30, 17:03

Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...

Chipbond chairman Fei-Jain Wu

Japan IDMs outsourcing IC backend production to Chipbond

Jun 22, 12:26

Renesas Technology is closing production lines and plans to release bump and chip on glass (COG) orders to Chipbond Technology, while NEC Electronics already started releasing chip...

chipbond

Driver IC testing, COF prices raised by 10-30%

Jun 12, 16:38

IC packaging and testing companies have indicated that some driver IC customers have suggested raising backend manufacturing prices to speed up production. Chipbond Technology and...

chipbod
158 items [4/5]
Realtime news
  • ECS suffers net loss per share of NT$1.70 for 2016

    Before Going to Press | 6h 56min ago

  • HTC teams up with Qingdao Publishing to tap educational VR market in China

    Before Going to Press | 6h 57min ago

  • Compal expects to ship 40 million PCs in 2017

    Before Going to Press | 6h 58min ago

  • Digitimes Research: Sony launches Bravia OLED TVs, Samsung beefs up marketing of QLED TVs in March

    Before Going to Press | 6h 58min ago

  • MediaTek to merge with affiliate Airoha

    Before Going to Press | 6h 59min ago

  • Lenovo talking with Fujitsu about buying PC business, says Nikkei

    Before Going to Press | 7h 9min ago

  • Mitac Holdings to deal out 2016 dividend of NT$2.50

    Before Going to Press | 7h 42min ago

  • Quanta to deal out 2016 dividend of NT$3.50

    Before Going to Press | 7h 48min ago

  • PChome Online to deal out 2016 dividend of NT$5.583

    Before Going to Press | 7h 53min ago

  • Clevo to hand out 2016 dividend of NT$0.70

    Before Going to Press | 7h 59min ago

  • Competition in AI platform market intensifying

    Before Going to Press | 8h 4min ago

  • Inventec expects 10% growth in 2017 revenue from servers

    Before Going to Press | 8h 21min ago

  • Hua Hong seeing robust smart card chip demand

    Before Going to Press | 8h 22min ago

  • Invetec net profits stay flat in 2016

    Before Going to Press | 8h 22min ago

  • Twinhead International to not hand out 2016 dividend

    Before Going to Press | 8h 23min ago

  • Unitech Computer to deal out 2016 dividend of NT$1.30

    Before Going to Press | 8h 23min ago

Pause
 | 
View more
Global notebook shipment forecast, 2017 and beyond
Wireless broadband developments in Southeast Asia markets

28-Mar-2017 markets closed

 LastChange

TAIEX (TSE)9876.45-0.32-0% 

TSE electronic403.18+0.39+0.1% 

GTSM (OTC)134.19-1.71-1.26% 

OTC electronic188.63-2.17-1.14% 

Analysis of China revised domestic semiconductor industry goals
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.