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News tagged Chipbond
  • Last update: Tuesday 21 May 2013 [121 news items]

LCD driver IC backend capacity tight on material shortage

May 18, 15:00

LCD driver IC makers are being hit by tight packaging capacity at back-end service suppliers due to a shortage of chip on film (COF) tapes, according to industry sources.

Wu

LCD driver IC backend service suppliers may raise prices on tight supply

May 11, 16:40

Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) may increase the quotes for their driver IC backend services in July 2009...

Chipbond

Chipbond and KYEC post improved April sales

Newswatch - May 7, 12:23

Taiwan-based backend service providers Chipbond Technology and King Yuan Electronics (KYEC) have announced narrower revenue drops on year in April compared to those in the first three...

Driver IC backend suppliers 2Q09 sales expected to rise over 80%

May 6, 14:53

Driver IC packaging and testing companies Chipbond Technology and International Semiconductor Technology (IST) are likely to enjoy revenue growth of more than 80% sequentially in...

Driver IC packaging firms to reach full utilization by end of 2Q09

Apr 8, 16:33

Taiwan-based LCD driver IC packaging and testing houses are expected to see their fabs running at full capacity by the end of the second quarter, as more Japan-based IDMs have begun...

Driver IC packaging firms see capacity utilization improve on China demand

Newswatch - Mar 19, 15:52

Driver IC packaging and testing companies Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) have seen their recently capacity...

Most IC backend service suppliers see siginificant growth in February

Mar 9, 16:44

Most packaging and testing houses, including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL), saw significant increases in sales in February, thanks...

Driver IC backend utilization rate at 20-30%

Feb 20, 12:07

Driver IC packaging and testing companies Chipbond Technology, ChipMOS Technologies and King Yuan Electronics Company (KYEC) recently have been able to receive mostly rush or short-term...

Chipbond to see losses for four straight quarters

Dec 12, 01:15

Driver IC packaging and testing house Chipbond Technology's November sales were only NT$277 million (US$8.32 million), down 36% from October and lower than the company's breakeven...

Chipbond to see losses in 4Q08 with only 50% utilization

Dec 5, 17:01

Backend packaging and testing company Chipbond Technology is facing difficulties with a utilization rate of only 50% currently mainly due to the impact of weak panel demand on the...

Driver IC packaging and testing houses to see utilization drop to 55-66% in 4Q08

Nov 5, 01:00

Driver IC packaging and testing houses Chipbond Technology, International Semiconductor Technology (IST), and ChipMOS Technologies will see their utilization rates drop to 55-60%...

LCD driver IC front and back-end companies report 3Q08 sales decline due to panel output reductions

Oct 7, 17:00

Driver IC maker Novatek Microelectronics has reported decline in third-quarter sales due to reductions in output a panel makers. Chipbond Technology also failed to meet third-quarter...

Weakening LCD panel industry spreads to backend

Aug 11, 12:14

As most upstream LCD panel and LCD driver IC vendors are guiding for a conservative second half of 2008, major LCD driver IC packaging and testing houses' expect to feel the effect...

Chipbond finding it hard to raise packaging and testing quotes for driver ICs amid sluggish panel demand

Jul 2, 01:05

Chipbond Technology is facing stronger resistance from clients to its planned increases in driver IC packaging and testing quotes, as the LCD panel market is turning more conservative...

Chipbond revises down sales guidance

Jun 9, 15:29

Not seeing an anticipated warm-up in LCD driver IC demand from May, Chipbond has revised down its sales guidance to a sequential decline of 1-5% in the second quarter, in contrast...

Chipbond and IST prepare further price raise for gold bumping in 3Q08

May 29, 01:00

Chipbond Technology and International Semiconductor Technology (IST) are preparing to increase gold bumping quotes for the second consecutive quarter in the third quarter in order...

121 items [4/4]
Realtime news
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  • NLT demonstrates latest display technologies, including projective capacitive touch panel technology

    Displays | May 21, 20:15

  • AGC to release new self-adhesive glass for optical bonding used in electronic products

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  • eMagin enters electronic viewfinder market with OLED microdisplay

    Displays | May 21, 19:59

  • New Vision Display exhibits PMVA color display based on Corning Willow Glass

    Displays | May 21, 19:58

  • Lextar expected to see 2Q13 gross margin rise to 13-14%

    LED | May 21, 19:55

  • Samsung to launch complete line up of notebooks in 2H13

    IT + CE | May 21, 19:13

  • Taiwan panel industry output value worth US$7.86 billion in 1Q13, says IEK

    Displays | May 21, 18:13

  • Sharp announces new Ultra HD TVs

    Before Going to Press | May 21, 21:27

  • Nanjing Z-Com developing 4G small cells for China market

    Before Going to Press | May 21, 21:19

  • Shipment proportions of 8- and 10-megapixel lens modules on the rise, say Taiwan makers

    Before Going to Press | May 21, 20:58

  • Telecom operators in China expected to stop placing orders for 3.5-inch smartphones by July 2013

    Before Going to Press | May 21, 20:48

  • Taiwan connector makers worried about competition from China-based makers

    Before Going to Press | May 21, 20:37

  • Taiwan FPCB makers to face renewed competition from rivals in Japan

    Before Going to Press | May 21, 20:36

  • China-based ARM-architecture IC designers to attend 2013 Computex Taipei

    Before Going to Press | May 21, 20:35

  • Taiwan market: Sony to launch Xperia Tablet Z

    Before Going to Press | May 21, 20:03

  • Monitor panel pricing expected to remain stable in May

    Before Going to Press | May 21, 19:00

  • CSOT successfully produces 32-inch Oxide TFT LCD module

    Before Going to Press | May 21, 19:00

  • Windows 8 expected to take up 5-8% of global tablet shipments in 2013, say Taiwan makers

    Before Going to Press | May 21, 18:04

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22-May-2013 09:45 (GMT+8)

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Trends in China LED chip and packaging sector
  • Trends and shipment forecast for 2H 2012 tablet market

    Digitimes Research remains conservative about the prospects for the period, with half-year shipments projected to reach 49.18 million units and whole-year shipments being revised downward to 88.69 million units.

  • Trends in the China video market

    In addition to strong potential video content demand in China, the market has developed rapidly due to government intervention and delays in establishing copyright protections.

  • 4Q12 trends in the Greater China touch panel industry

    In the second half of 2012, the market focus is on the iPhone 5, which uses in-cell touch screen technology. Due to the integration of display panels and touch panel functions, the high technological threshold will mean Taiwan touch panel makers are unable to enter the iPhone supply chain.