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News tagged Chipbond
  • Last update: Wednesday 21 September 2016 [150 news items]

Chipbond-IST merger set to complete in June 2010

Stockwatch - Dec 28, 16:34

LCD driver IC packaging house International Semiconductor Technology (IST) has announced that its board of directors on December 25 approved a deal to merge with Chipbond Technology,...

Taiwan IC backend industry to see more consolidation in 2010, says TICP chairman

Dec 17, 16:22

The Taiwan IC packaging and testing industry will continue to consolidate in 2010, in the wake of Chipbond Technology's recently-announced merger with counterpart International Semiconductor...

IST merger to further lighten non-operating investment burden for Compal

Dec 8, 15:21

The merger of Chipbond Technology and International Semiconductor Technology (IST) is expected to help the Compal Group turn its investment in IST from a loss to profit, according...

Chipbond and IST announce merger

Dec 7, 17:00

Driver IC packaging houses Chipbond Technology and International Semiconductor Technology (IST) today (December 7) announced a merger through a stock swap.

Chipbond eyes outsourcing COF substrate orders from Mitsui subsidiary

Dec 2, 14:36

Chipbond Technology has disclosed it is negotiating an outsourcing deal with MCS, a subsidiary of Japan-based Mitsui Kinzoku. Both parties have been evaluating the possibility of...

Chipbond, IST deny merger rumors

Newswatch - Dec 2, 11:47

LCD driver IC packaging and testing houses Chipbond Technology and International Semiconductor Technology (IST) have both dismissed recent rumors that the two companies plan to merge...

Chipbond likely to miss revenue guidance for 4Q09, say watchers

Nov 20, 16:38

LCD driver IC packaging and testing house Chipbond Technology may see fourth-quarter 2009 revenues decline by up to 30% sequentially, as customers' inventory levels are still high,...

One too many LCD driver IC backend service providers in Taiwan, says Chipbond

Nov 19, 14:22

Taiwan-based Chipbond Technology has commented that reducing the number of the local LCD driver IC packaging and testing houses to three through acquisitions or mergers will help...

Chipbond affiliate in China suspends expansion plan pending rule changes

Nov 16, 14:16

Chipbond Technology's China-based affiliate Chipmore Technology has suspended plans to expand capacity for gold bumping, pending possible changes to Taiwan government policies concerning...

Driver IC backend supplier revenues down in October 2009

Nov 6, 16:56

Driver IC backend supplier Chipbond Technology saw its October revenues decline by 25.2% to NT$468 million (US$13.39 million) as customers have slowed down their pace of orders, according...

Chipbond and IST 4Q09 revenues to drop 20% on quarter

Nov 5, 16:23

Chipbond Technology and International Semiconductor Technology (IST) may see sequential revenue drops of almost 20% in the fourth quarter of 2009, in accordance with driver IC design...

Chipbond 3Q09 profits up three-fold

Newswatch - Oct 26, 10:33

LCD driver IC packaging and testing house Chipbond Technology enjoyed a net profit of NT$319 million (US$9.85 million), or NT$1.03 per share in the third quarter of 2009, compared...

Chipbond and IST return to on-year growth in 3Q09

Oct 9, 10:25

LCD driver IC packaging and testing firm Chipbond Technology saw revenues amount to NT$1.88 billion (US$58.4 million) in the third quarter of 2009, a 4.4% on-year increase compared...

Driver IC backend suppliers conservative about 4Q09

Oct 6, 14:38

Chipbond Technology and International Semiconductor Technology (IST) both expect their fourth-quarter 2009 shipments to likely fall by less than 20% sequentially as a result of seasonality...

Chipbond and IST revenues to fall less than 20% sequentially in 4Q09

Sep 15, 15:19

Chipbond Technology and International Semiconductor Technology (IST), two major Taiwan-based LCD driver IC packaging and testing houses, have both estimated September 2009 revenues...

Chipbond August 2009 revenues hit high

Newswatch - Sep 8, 14:39

Driver IC packaging and testing firm Chipbond Technology saw its monthly revenues hit a record of NT$640 million (US$19.5 million) in August, representing a 52.5% increase from NT$420...

Driver IC backend suppliers upbeat about 3Q09

Sep 2, 14:29

Chipbond Technology is performing better than previously expected in the third quarter of 2009, thanks to growing demand from IDM customers, according to the company. The driver IC...

Chipbond raises capex

Newswatch - Sep 2, 12:03

Driver IC testing and packaging house Chipbond Technology has raised its capex budget for 2009 by 40% to NT$700 million (US$21.28 million), according to the company. The additional...

Driver IC backend supplier Chipbond enjoys strong July profits

Aug 25, 17:07

Chipbond Technology has posted net profits of NT$81 million (US$2.46 million) for July 2009 roughly equal to its net profits of NT$81.65 million for the second quarter.

Chipbond and IST urge relaxation of driver-IC backend restrictions in China

Aug 14, 16:04

Chipbond Technology and International Semiconductor Technology (IST) have called for Taiwan to relax restrictions on LCD driver IC packaging and testing production in China. They...

Chipbond sales up 40% in July

Aug 12, 15:53

LCD driver IC backend supplier Chipbond Technology saw revenues climb 40.4% to NT$610 million (US$18.6 million) in July 2009, marking an end to its run of on-year drops over the past...

LCD driver IC backend suppliers expected to enjoy revenue growth through August

Newswatch - Jul 23, 12:14

Taiwan-based LCD driver IC backend service providers are expected to see their revenues hit the year's highs in August, thanks to increased demand on seasonality, according to market...

Casio reportedly looking to sell gold-bumping equipment

Newswatch - Jul 20, 16:30

Casio Micronics is looking to sell its gold-bumping equipment, as the Japan-based company already suspended operation of its gold bumping lines in April 2009 amid difficult times,...

Chipbond, IST 2Q09 sales jump over 100% sequentially

Jul 13, 16:18

Chipbond Technology and International Semiconductor Technology (IST) saw revenues for second-quarter 2009 increase 110.4% and 152.9%, respectively, compared to their revenue results...

Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu

Jun 30, 17:03

Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...

Chipbond chairman Fei-Jain Wu

Japan IDMs outsourcing IC backend production to Chipbond

Jun 22, 12:26

Renesas Technology is closing production lines and plans to release bump and chip on glass (COG) orders to Chipbond Technology, while NEC Electronics already started releasing chip...

chipbond

Driver IC testing, COF prices raised by 10-30%

Jun 12, 16:38

IC packaging and testing companies have indicated that some driver IC customers have suggested raising backend manufacturing prices to speed up production. Chipbond Technology and...

chipbod

Driver IC backend suppliers May sales up on improved utilization

Newswatch - Jun 9, 16:41

Taiwan-based LCD driver IC backend service providers Chipbond Technology and International Semiconductor Technology (IST) both enjoyed double-digit sequential growths in revenues...

Chipbond production line

Driver IC backend suppliers see order visibility extend to October as panel demand increases in China

Newswatch - Jun 5, 15:17

Taiwan's LCD driver IC backend service suppliers have seen order visibility extend to October, driven by increased orders from China's LCD TV market due to the government's expanded...

LCD driver IC backend capacity tight on material shortage

May 18, 15:00

LCD driver IC makers are being hit by tight packaging capacity at back-end service suppliers due to a shortage of chip on film (COF) tapes, according to industry sources.

Wu

LCD driver IC backend service suppliers may raise prices on tight supply

May 11, 16:40

Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) may increase the quotes for their driver IC backend services in July 2009...

Chipbond

Chipbond and KYEC post improved April sales

Newswatch - May 7, 12:23

Taiwan-based backend service providers Chipbond Technology and King Yuan Electronics (KYEC) have announced narrower revenue drops on year in April compared to those in the first three...

Driver IC backend suppliers 2Q09 sales expected to rise over 80%

May 6, 14:53

Driver IC packaging and testing companies Chipbond Technology and International Semiconductor Technology (IST) are likely to enjoy revenue growth of more than 80% sequentially in...

Driver IC packaging firms to reach full utilization by end of 2Q09

Apr 8, 16:33

Taiwan-based LCD driver IC packaging and testing houses are expected to see their fabs running at full capacity by the end of the second quarter, as more Japan-based IDMs have begun...

Driver IC packaging firms see capacity utilization improve on China demand

Newswatch - Mar 19, 15:52

Driver IC packaging and testing companies Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) have seen their recently capacity...

150 items [4/5]
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