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News tagged Chipbond
  • Last update: Tuesday 12 May 2015 [133 news items]

Chipbond raises capex

Newswatch - Sep 2, 12:03

Driver IC testing and packaging house Chipbond Technology has raised its capex budget for 2009 by 40% to NT$700 million (US$21.28 million), according to the company. The additional...

Driver IC backend supplier Chipbond enjoys strong July profits

Aug 25, 17:07

Chipbond Technology has posted net profits of NT$81 million (US$2.46 million) for July 2009 roughly equal to its net profits of NT$81.65 million for the second quarter.

Chipbond and IST urge relaxation of driver-IC backend restrictions in China

Aug 14, 16:04

Chipbond Technology and International Semiconductor Technology (IST) have called for Taiwan to relax restrictions on LCD driver IC packaging and testing production in China. They...

Chipbond sales up 40% in July

Aug 12, 15:53

LCD driver IC backend supplier Chipbond Technology saw revenues climb 40.4% to NT$610 million (US$18.6 million) in July 2009, marking an end to its run of on-year drops over the past...

LCD driver IC backend suppliers expected to enjoy revenue growth through August

Newswatch - Jul 23, 12:14

Taiwan-based LCD driver IC backend service providers are expected to see their revenues hit the year's highs in August, thanks to increased demand on seasonality, according to market...

Casio reportedly looking to sell gold-bumping equipment

Newswatch - Jul 20, 16:30

Casio Micronics is looking to sell its gold-bumping equipment, as the Japan-based company already suspended operation of its gold bumping lines in April 2009 amid difficult times,...

Chipbond, IST 2Q09 sales jump over 100% sequentially

Jul 13, 16:18

Chipbond Technology and International Semiconductor Technology (IST) saw revenues for second-quarter 2009 increase 110.4% and 152.9%, respectively, compared to their revenue results...

Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu

Jun 30, 17:03

Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...

Chipbond chairman Fei-Jain Wu

Japan IDMs outsourcing IC backend production to Chipbond

Jun 22, 12:26

Renesas Technology is closing production lines and plans to release bump and chip on glass (COG) orders to Chipbond Technology, while NEC Electronics already started releasing chip...

chipbond

Driver IC testing, COF prices raised by 10-30%

Jun 12, 16:38

IC packaging and testing companies have indicated that some driver IC customers have suggested raising backend manufacturing prices to speed up production. Chipbond Technology and...

chipbod

Driver IC backend suppliers May sales up on improved utilization

Newswatch - Jun 9, 16:41

Taiwan-based LCD driver IC backend service providers Chipbond Technology and International Semiconductor Technology (IST) both enjoyed double-digit sequential growths in revenues...

Chipbond production line

Driver IC backend suppliers see order visibility extend to October as panel demand increases in China

Newswatch - Jun 5, 15:17

Taiwan's LCD driver IC backend service suppliers have seen order visibility extend to October, driven by increased orders from China's LCD TV market due to the government's expanded...

LCD driver IC backend capacity tight on material shortage

May 18, 15:00

LCD driver IC makers are being hit by tight packaging capacity at back-end service suppliers due to a shortage of chip on film (COF) tapes, according to industry sources.

Wu

LCD driver IC backend service suppliers may raise prices on tight supply

May 11, 16:40

Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) may increase the quotes for their driver IC backend services in July 2009...

Chipbond

Chipbond and KYEC post improved April sales

Newswatch - May 7, 12:23

Taiwan-based backend service providers Chipbond Technology and King Yuan Electronics (KYEC) have announced narrower revenue drops on year in April compared to those in the first three...

Driver IC backend suppliers 2Q09 sales expected to rise over 80%

May 6, 14:53

Driver IC packaging and testing companies Chipbond Technology and International Semiconductor Technology (IST) are likely to enjoy revenue growth of more than 80% sequentially in...

Driver IC packaging firms to reach full utilization by end of 2Q09

Apr 8, 16:33

Taiwan-based LCD driver IC packaging and testing houses are expected to see their fabs running at full capacity by the end of the second quarter, as more Japan-based IDMs have begun...

Driver IC packaging firms see capacity utilization improve on China demand

Newswatch - Mar 19, 15:52

Driver IC packaging and testing companies Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) have seen their recently capacity...

Most IC backend service suppliers see siginificant growth in February

Mar 9, 16:44

Most packaging and testing houses, including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL), saw significant increases in sales in February, thanks...

Driver IC backend utilization rate at 20-30%

Feb 20, 12:07

Driver IC packaging and testing companies Chipbond Technology, ChipMOS Technologies and King Yuan Electronics Company (KYEC) recently have been able to receive mostly rush or short-term...

Chipbond to see losses for four straight quarters

Dec 12, 01:15

Driver IC packaging and testing house Chipbond Technology's November sales were only NT$277 million (US$8.32 million), down 36% from October and lower than the company's breakeven...

Chipbond to see losses in 4Q08 with only 50% utilization

Dec 5, 17:01

Backend packaging and testing company Chipbond Technology is facing difficulties with a utilization rate of only 50% currently mainly due to the impact of weak panel demand on the...

Driver IC packaging and testing houses to see utilization drop to 55-66% in 4Q08

Nov 5, 01:00

Driver IC packaging and testing houses Chipbond Technology, International Semiconductor Technology (IST), and ChipMOS Technologies will see their utilization rates drop to 55-60%...

LCD driver IC front and back-end companies report 3Q08 sales decline due to panel output reductions

Oct 7, 17:00

Driver IC maker Novatek Microelectronics has reported decline in third-quarter sales due to reductions in output a panel makers. Chipbond Technology also failed to meet third-quarter...

Weakening LCD panel industry spreads to backend

Aug 11, 12:14

As most upstream LCD panel and LCD driver IC vendors are guiding for a conservative second half of 2008, major LCD driver IC packaging and testing houses' expect to feel the effect...

Chipbond finding it hard to raise packaging and testing quotes for driver ICs amid sluggish panel demand

Jul 2, 01:05

Chipbond Technology is facing stronger resistance from clients to its planned increases in driver IC packaging and testing quotes, as the LCD panel market is turning more conservative...

Chipbond revises down sales guidance

Jun 9, 15:29

Not seeing an anticipated warm-up in LCD driver IC demand from May, Chipbond has revised down its sales guidance to a sequential decline of 1-5% in the second quarter, in contrast...

Chipbond and IST prepare further price raise for gold bumping in 3Q08

May 29, 01:00

Chipbond Technology and International Semiconductor Technology (IST) are preparing to increase gold bumping quotes for the second consecutive quarter in the third quarter in order...

133 items [4/4]
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