Taipei, Thursday, April 17, 2014 21:42 (GMT+8)
partly cloudy
Taipei
25°C
News tagged book-to-bill
  • Last update: Monday 24 February 2014 [105 news items]

PV equipment book-to-bill crashes to historic low of 0.44, says Solarbuzz

Nov 11, 09:55

In third-quarter 2011, the consolidated PV book-to-bill ratio fell to an all-time low of 0.44, according to Solarbuzz. This effectively signals an end point to the most recent PV...

SEMI book-to-bill falls again in September

Oct 21, 15:12

North America-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September 2011, declining for the fifth month in a row.

Japan fab-tool book-to-bill slips to 0.75 in September, says SEAJ

Oct 20, 11:59

Japan-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September, declining for the third month in a row.

PV equipment book-to-bill ratio drops below parity in 2Q11, says SEMI

Sep 22, 15:55

SEMI has reported that worldwide photovoltaic manufacturing equipment billings reached US$2.03 billion for the quarter ended on June 30, 2011. Billings increased 17% sequentially,...

Japan fab-tool book-to-bill continues slide in August, says SEAJ

Sep 21, 15:48

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.76 in August 2011, compared to 0.84 in July and 0.96 in June, according to new figures from the...

SEMI book-to-bill ratio slips to 0.80 in August

Sep 16, 16:06

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.80 for August 2011, down from 0.85 in July, according to new figures from SEMI. A book-to-bill...

Chip equipment book-to-bill lower in July 2011

Aug 19, 10:30

North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.86 in July, down from 0.94 in June, according to SEMI. Meanwhile, data gathered by the...

North America chip-gear orders slip in June, says SEMI

Jul 21, 01:00

North America-based manufacturers of semiconductor equipment posted US$1.55 billion in orders in June 2011 (three-month average basis), down 4.4% from the revised level of US$1.62...

SEMI book-to-bill ratio slips to 0.97 in May

Jun 17, 16:07

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for May 2011, down from 0.98 in April, according to new figures from SEMI.

PV book-to-bill forecast to dip sharply below parity before rebounding in 4Q11, says Solarbuzz

Jun 2, 14:43

In first quarter of 2011, the consolidated PV book-to-bill ratio posted a three-month average of 1.01, according to Solarbuzz. During the second half of 2011, the PV book-to-bill...

Solar equipment book-to-bill ratio hits 1.13 in 4Q10

May 31, 14:47

According to research reports by international PV associations, the book-to-bill ratio for solar equipment was 1.13 in fourth-quarter 2010 indicating an expansion of the solar mark...

North America chip gear book-to-bill up in April

May 20, 11:05

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.98 for April 2011, up from 0.95 in March, according to new figures from SEMI.

SEMI book-to-bill ratio rises to 0.95 in March

Apr 22, 10:45

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for March 2011, up from 0.87 in February, according to new figures from SEMI.

Japan fab-tool book-to-bill back above parity in February 2011, says SEAJ

Mar 24, 01:00

Japan-based manufacturers of semiconductor equipment posted JPY105.79 billion (US$1.31 billion) in orders in February 2011 (three-month average basis) and a book-to-bill ratio of...

SEMI book-to-bill ratio stays below parity in February 2011

Mar 18, 15:49

North America-based manufacturers of semiconductor equipment posted US$1.58 billion in orders in February 2011 (three-month average basis) and a book-to-bill ratio of 0.87, according...

PV book-to-bill in 4Q10 remains above parity, says Solarbuzz

Mar 11, 10:47

In the fourth quarter of 2010, research firm Solarbuzz's PV book-to-bill analysis posted a three-month average of 1.10. Across the entire year, the 12-month average in 2010 reached...

SEMI book-to-bill ratio slips again

Feb 23, 14:48

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.85 in January 2011, compared to 0.90 in December 2010 and 0.97 in November, according...

Japan fab tool book-to-bill slips below parity in January 2011

Feb 18, 15:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.99 in January 2011, down from 1.07 in December and the lowest since May 2009, according to the...

SEMI, SEAJ book-to-bill ratios slip in December 2010

Jan 21, 14:06

North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.90 in December, down from 0.97 in November, according to SEMI. Meanwhile, data gathered...

North America fab tool book-to-bill slips to 0.96 in November 2010, says SEMI

Dec 17, 16:11

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.96 in November 2010 compared to 0.98 in October and 1.06 a year ago, according to SEMI...

Japan chip gear book-to-bill continues to slide on-month

Nov 22, 13:41

The book-to-bill ratio for Japan-based semiconductor equipment manufacturers slipped to 1.12 in October 2010 from 1.14 in the prior month, according to the Semiconductor Equipment...

SEMI book-to-bill ratio drops below parity in October 2010

Nov 19, 16:09

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.98 in October 2010 from 1.03 in the prior month.

IC capacity utilization drops to 95.2% in 3Q10, SICAS figures show

Nov 19, 12:15

Global IC industry capacity utilization dropped to 95.2% in the third quarter of 2010 from 95.6% in the second, according to the latest data from Semiconductor Industry Capacity Statistics...

SEMI book-to-bill ratio drops to 1.03 in September 2010

Oct 22, 14:07

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 1.03 in September 2010, compared to 1.17 in August and 1.23 in July.

Japan September 2010 fab tool book-to-bill slips to 1.14, says SEAJ

Oct 21, 14:35

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.14 in September 2010, down from 1.38 in August, according to new figures from the Semiconductor...

North America chip gear book-to-bill ratio up in July 2010, says SEMI

Aug 20, 15:27

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.23 in July 2010, compared to 1.18 in June, according to SEMI. The book-to-bill of 1.23...

Japan chip gear book-to-bill climbs to 1.53 in July 2010, says SEAJ

Aug 19, 11:51

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.53 in July 2010, compared to 1.40 in the prior month, according to the Semiconductor Equipment...

Chip gear book-to-bill ratios climb in June 2010

Jul 21, 11:52

Japan's semiconductor production equipment manufacturers have reported a book-to-bill ratio of 1.40 for June, up from 1.13 in May, according to the Semiconductor Equipment Association...

WLAN chip vendors cutting prices to clear inventories

Jun 29, 11:32

International WLAN chip vendors have recently lowered their prices in order to jack up sales to help reduce inventories while also aiming to grab more design-in orders in the third...

SEMI, SEAJ book-to-bill ratios stay strong in May 2010

Jun 21, 10:37

Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.13 in May 2010, up from 1.07 in April, according to the Semiconductor Equipment Association...

Japan chip gear book-to-bill slips to 1.07 in April 2010, says SEAJ

May 24, 16:39

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.07 in April 2010, compared to 1.17 in the prior month, according to the Semiconductor Equipment...

North America chip-gear orders up 8% in April 2010, says SEMI

May 21, 14:01

North America-based manufacturers of semiconductor equipment posted US$1.44 billion in orders in April (three-month average basis), up 8.1% from the revised level of US$1.33 billion...

North America chip gear book-to-bill ratio at 1.19 in March 2010, says SEMI

Apr 21, 11:50

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.19 in March 2010, having been above parity for nine months in a row.

Japan chip gear book-to-bill ratio at 1.17 in March 2010, says SEAJ

Apr 20, 11:12

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.17 in March 2010, down from 1.34 in February but up significantly from the record level of 0.30...

Inductor maker Chilisin sees profits up over 200% sequentially in 1Q10

Apr 16, 15:48

Inductor maker Chilisin Electronics has posted net profits of NT$92 million (US$2.93 million) for the first quarter of 2010, up 219% from the previous quarter. The first quarter earnings...

105 items [2/3]
Realtime news
  • Flat panel industry expected to see annual growth decline from 20% to 5%

    Displays | 8min ago

  • TSMC looks to post 21-23% sequential revenue gains in 2Q14

    Bits + chips | 19min ago

  • Digitimes Research: China panel makers showing increased interest in large-size segment

    Displays | 1h 51min ago

  • TSMC looks to post 21-23% sequential revenue gains in 2Q14

    Before Going to Press | 1h 6min ago

  • MediaTek 2Q14 revenues to increase

    Before Going to Press | 1h 14min ago

  • Taiwan memory chipmakers advised to develop customized chips for clients

    Before Going to Press | 1h 27min ago

Pause
 | 
View more
Global tablet tracker
China smartphone tracker

17-Apr-2014 markets closed

 LastChange

TAIEX (TSE)8944.16+20.34+0.23% 

TSE electronic340.92+0.90+0.26% 

GTSM (OTC)145.09+1.08+0.75% 

OTC electronic180.04+0.83+0.46% 

2014 global mobile application processor market forecast