Taipei, Friday, December 26, 2014 22:33 (GMT+8)
mostly cloudy
Taipei
15°C
News tagged book-to-bill
  • Last update: Tuesday 23 December 2014 [111 news items]

SEMI, SEAJ book-to-bill ratios stay strong in May 2010

Jun 21, 10:37

Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.13 in May 2010, up from 1.07 in April, according to the Semiconductor Equipment Association...

Japan chip gear book-to-bill slips to 1.07 in April 2010, says SEAJ

May 24, 16:39

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.07 in April 2010, compared to 1.17 in the prior month, according to the Semiconductor Equipment...

North America chip-gear orders up 8% in April 2010, says SEMI

May 21, 14:01

North America-based manufacturers of semiconductor equipment posted US$1.44 billion in orders in April (three-month average basis), up 8.1% from the revised level of US$1.33 billion...

North America chip gear book-to-bill ratio at 1.19 in March 2010, says SEMI

Apr 21, 11:50

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.19 in March 2010, having been above parity for nine months in a row.

Japan chip gear book-to-bill ratio at 1.17 in March 2010, says SEAJ

Apr 20, 11:12

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.17 in March 2010, down from 1.34 in February but up significantly from the record level of 0.30...

Inductor maker Chilisin sees profits up over 200% sequentially in 1Q10

Apr 16, 15:48

Inductor maker Chilisin Electronics has posted net profits of NT$92 million (US$2.93 million) for the first quarter of 2010, up 219% from the previous quarter. The first quarter earnings...

Chip-gear book-to-bill almost flat in February 2010

Mar 21, 15:34

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.22 in February 2010 compared to 1.23 in January, according to SEMI.

Japan chip gear book-to-bill ratio jumps in January 2010, says SEAJ

Feb 23, 15:22

Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 1.36 in January 2010 compared to 1.3 in the prior month and 0.55 a year earlier, according to Semiconductor...

North America chip equipment orders top US$1 billion in January 2010, says SEMI

Feb 22, 10:12

North America-based manufacturers of semiconductor equipment posted US$1.13 billion in orders in January 2010 (three-month average basis) and a book-to-bill ratio of 1.20, according...

North American chip-gear industry posts book-to-bill ratio of 1.03 in December 2009, says SEMI

Jan 22, 12:15

North America-based manufacturers of semiconductor equipment posted US$863.3 million in orders in December 2009 (three-month average basis) and a book-to-bill ratio of 1.03, according...

Japan chip equipment book-to-bill reaches 1.30 in December 2009, says SEAJ

Jan 21, 17:07

Japan-based semiconductor equipment manufacturers posted about 77.39 billion yen (US$844 million) in orders in December 2009 and a book-to-bill ratio of 1.30, according to Semiconductor...

Japan chip gear book-to-bill slips to 1.18 in November 2009

Dec 18, 14:09

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.18 in November 2009 compared to the prior month's level of 1.28, according to Semiconductor Equipment...

North America chip gear book-to-bill ratio at 1.06 in November 2009

Dec 18, 10:19

North America-based manufacturers of semiconductor equipment posted US$790.5 million in orders in November 2009 (three-month average basis) and a book-to-bill ratio of 1.06, according...

MPI probe card shipments recover in November

Dec 11, 16:56

Probe card maker MJC Probe's (MPI's) book-to-bill (B/B) ratio of probe cards used in LCD driver IC manufacturing reached 1.2 in November, the highest level in 2009, thanks to inventory...

North America chip-gear book-to-bill remains above 1.0 in October, says SEMI

Nov 20, 10:49

North America-based semiconductor equipment manufacturers posted US$756.2 million in orders in October 2009 and a book-to-bill ratio of 1.10, according to SEMI. A book-to-bill of...

Japan chip-gear book-to-bill flat in October 2009, says SEAJ

Nov 19, 16:51

Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 1.28 in October 2009, similar to the prior month's level, according to data gathered by the Semiconductor...

North American chip equipment orders return to on-year growth track in September 2009, says SEMI

Oct 21, 10:18

September 2009 appears the first time since May 2007 that on-year bookings have risen and is in-line with the gradually improving capital spending outlook for the remainder of this...

Japan chip equipment orders down 22% on year in September 2009, says SEAJ

Oct 20, 16:27

Japan-based semiconductor equipment manufacturers received 61.567 billion yen (US$682.92 million) in orders in September 2009, down 22.2% from the same period in 2008, according to...

Japan chip equipment orders continue sequential growth in August 2009, says SEAJ

Sep 18, 16:55

Japan-based semiconductor equipment manufacturers posted about 55.46 billion yen (US$608 million) in orders in August 2009 (three-month average basis), and a book-to-bill ratio of...

Chip equipment bookings up for fifth consecutive month, says SEMI

Sep 18, 10:28

North America-based manufacturers of semiconductor equipment posted US$599 million in orders in August 2009 (three-month average basis) and a book-to-bill ratio of 1.03, according...

Global chip equipment billings down 66% on year in 2Q09, says SEMI

Sep 9, 10:09

Worldwide semiconductor manufacturing equipment billings reached US$2.69 billion in the second quarter of 2009, representing decreases of 13% sequentially and 66% on year, according...

Japan chip equipment book-to-bill reaches 1.34 in July, says SEAJ

Aug 20, 16:23

Japan-based semiconductor equipment manufacturers posted about 43.78 billion yen (US$464 million) in orders in July 2009 (three-month average basis) and a book-to-bill ratio of 1.34,...

North America chip equipment orders up 62% sequentially in July, says SEMI

Aug 19, 12:04

North America-based manufacturers of semiconductor equipment posted US$569.7 million in orders in July 2009 (three-month average basis) and a book-to-bill ratio of 1.06, according...

Japan chip equipment bookings rise 37% in June, says SEAJ

Jul 23, 17:00

Japan-based semiconductor equipment manufacturers posted about 35.58 billion yen (US$377.32 million) in orders in June 2009 (three-month average basis) and a book-to-bill ratio of...

Chip equipment market bogged down by used equipment, says The Information Network

Jun 26, 16:15

Rises in the book-to-bill ratio for the North America and Japan semiconductor equipment sectors is giving optimism the industry downturn has bottomed out, but The Information Network...

North American chip equipment orders continue rising, says SEMI

Jun 19, 12:27

North America-based manufacturers of semiconductor equipment posted US$288.5 million in orders in May 2009 (three-month average basis) and a book-to-bill ratio of 0.74, according...

Japan chip equipment bookings up 45% sequentially in May, says SEAJ

Jun 18, 12:04

Japan-based semiconductor equipment manufacturers posted about 25.97 billion yen (US$268.76 million) in orders in May 2009 (three-month average basis) and a book-to-bill ratio of...

Japan chip equipment bookings end sequential drops in April

May 22, 16:06

Japan-based semiconductor equipment manufacturers posted 17,945 million yen (US$556.7 million) in orders in April 2009 (three-month average basis) and a book-to-bill ratio of 0.44,...

North American semiconductor equipment bookings up 3pp sequentially in April, says SEMI

May 22, 13:56

North America-based manufacturers of semiconductor equipment posted US$253 million in orders in April 2009 (three-month average basis) and a book-to-bill ratio of 0.65, according...

Flexible PCB shipment book-to-bill ratio drops to 0.87 in North America in March, says IPC

May 8, 09:47

Rigid PCB shipments were down 30.5% and bookings were down 39.8% in March 2009 from March 2008, according to IPC. Year to date, rigid PCB shipments were down 24.6% and bookings were...

North American semiconductor equipment bookings up 8% in March, says SEMI

Apr 17, 09:58

North America-based manufacturers of semiconductor equipment posted US$278.9 million in orders in March 2009 (three-month average basis) and a book-to-bill ratio of 0.61, according...

North American semiconductor equipment book-to-bill ratio remains low in February, says SEMI

Mar 20, 17:10

North America-based manufacturers of semiconductor equipment posted US$263.5 million in orders in February 2009 (three-month average basis) and a book-to-bill ratio of 0.48, according...

North American semiconductor equipment book-to-bill ratio slides to 0.48 in January

Feb 20, 17:05

North America-based manufacturers of semiconductor equipment posted US$285.6 million in orders in January 2009 (three-month average basis) and a book-to-bill ratio of 0.48, according...

Rigid PCB book-to-bill ratio falls to 0.89 in North America in December 2008, says IPC

Feb 4, 11:38

IPC has announced that rigid PCB shipments in North America were down 14.2% and bookings were down 24.5% on year in December 2008. For 2008, rigid PCB shipments were up 0.9%and bookings...

North American semiconductor equipment industry posts book-to-bill ratio of 0.93 in Dec 2008, says SEMI

Jan 21, 17:12

North America-based manufacturers of semiconductor equipment posted US$668.7 million in orders in December 2008 (three-month average basis) and a book-to-bill ratio of 0.93, according...

111 items [3/4]
Advantest
Analysis of China revised domestic semiconductor industry goals

26-Dec-2014 markets closed

 LastChange

TAIEX (TSE)9158.7-27.48-0.3% 

TSE electronic363.54-1.16-0.32% 

GTSM (OTC)137.3-0.18-0.13% 

OTC electronic175.13+0.13+0.07% 

Trends and developments in the OTT market
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • Greater China touch panel shipment forecast through 2015

    This Special Report provides forecasts through 2015 for Greater China touch panel shipments with breakdowns based on technology (glass, film, resistive), application (smartphone, NB and tablet) and by firm.

  • 2014 global tablet demand forecast

    This report analyzes the main players, their strategies and shipments forecasts for 2014, as well as other factors contributing to either growth or decline in various segments within the tablet market, with a particular focus on Apple, Google, Samsung, and Microsoft, along with whitebox vendors.