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News tagged book-to-bill
  • Last update: Wednesday 25 May 2016 [129 news items]

North America chip gear book-to-bill up in April

May 20, 11:05

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.98 for April 2011, up from 0.95 in March, according to new figures from SEMI.

SEMI book-to-bill ratio rises to 0.95 in March

Apr 22, 10:45

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for March 2011, up from 0.87 in February, according to new figures from SEMI.

Japan fab-tool book-to-bill back above parity in February 2011, says SEAJ

Mar 24, 01:00

Japan-based manufacturers of semiconductor equipment posted JPY105.79 billion (US$1.31 billion) in orders in February 2011 (three-month average basis) and a book-to-bill ratio of...

SEMI book-to-bill ratio stays below parity in February 2011

Mar 18, 15:49

North America-based manufacturers of semiconductor equipment posted US$1.58 billion in orders in February 2011 (three-month average basis) and a book-to-bill ratio of 0.87, according...

PV book-to-bill in 4Q10 remains above parity, says Solarbuzz

Mar 11, 10:47

In the fourth quarter of 2010, research firm Solarbuzz's PV book-to-bill analysis posted a three-month average of 1.10. Across the entire year, the 12-month average in 2010 reached...

SEMI book-to-bill ratio slips again

Feb 23, 14:48

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.85 in January 2011, compared to 0.90 in December 2010 and 0.97 in November, according...

Japan fab tool book-to-bill slips below parity in January 2011

Feb 18, 15:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.99 in January 2011, down from 1.07 in December and the lowest since May 2009, according to the...

SEMI, SEAJ book-to-bill ratios slip in December 2010

Jan 21, 14:06

North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.90 in December, down from 0.97 in November, according to SEMI. Meanwhile, data gathered...

North America fab tool book-to-bill slips to 0.96 in November 2010, says SEMI

Dec 17, 16:11

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.96 in November 2010 compared to 0.98 in October and 1.06 a year ago, according to SEMI...

Japan chip gear book-to-bill continues to slide on-month

Nov 22, 13:41

The book-to-bill ratio for Japan-based semiconductor equipment manufacturers slipped to 1.12 in October 2010 from 1.14 in the prior month, according to the Semiconductor Equipment...

SEMI book-to-bill ratio drops below parity in October 2010

Nov 19, 16:09

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.98 in October 2010 from 1.03 in the prior month.

IC capacity utilization drops to 95.2% in 3Q10, SICAS figures show

Nov 19, 12:15

Global IC industry capacity utilization dropped to 95.2% in the third quarter of 2010 from 95.6% in the second, according to the latest data from Semiconductor Industry Capacity Statistics...

SEMI book-to-bill ratio drops to 1.03 in September 2010

Oct 22, 14:07

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 1.03 in September 2010, compared to 1.17 in August and 1.23 in July.

Japan September 2010 fab tool book-to-bill slips to 1.14, says SEAJ

Oct 21, 14:35

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.14 in September 2010, down from 1.38 in August, according to new figures from the Semiconductor...

North America chip gear book-to-bill ratio up in July 2010, says SEMI

Aug 20, 15:27

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.23 in July 2010, compared to 1.18 in June, according to SEMI. The book-to-bill of 1.23...

Japan chip gear book-to-bill climbs to 1.53 in July 2010, says SEAJ

Aug 19, 11:51

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.53 in July 2010, compared to 1.40 in the prior month, according to the Semiconductor Equipment...

Chip gear book-to-bill ratios climb in June 2010

Jul 21, 11:52

Japan's semiconductor production equipment manufacturers have reported a book-to-bill ratio of 1.40 for June, up from 1.13 in May, according to the Semiconductor Equipment Association...

WLAN chip vendors cutting prices to clear inventories

Jun 29, 11:32

International WLAN chip vendors have recently lowered their prices in order to jack up sales to help reduce inventories while also aiming to grab more design-in orders in the third...

SEMI, SEAJ book-to-bill ratios stay strong in May 2010

Jun 21, 10:37

Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.13 in May 2010, up from 1.07 in April, according to the Semiconductor Equipment Association...

Japan chip gear book-to-bill slips to 1.07 in April 2010, says SEAJ

May 24, 16:39

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.07 in April 2010, compared to 1.17 in the prior month, according to the Semiconductor Equipment...

North America chip-gear orders up 8% in April 2010, says SEMI

May 21, 14:01

North America-based manufacturers of semiconductor equipment posted US$1.44 billion in orders in April (three-month average basis), up 8.1% from the revised level of US$1.33 billion...

North America chip gear book-to-bill ratio at 1.19 in March 2010, says SEMI

Apr 21, 11:50

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.19 in March 2010, having been above parity for nine months in a row.

Japan chip gear book-to-bill ratio at 1.17 in March 2010, says SEAJ

Apr 20, 11:12

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.17 in March 2010, down from 1.34 in February but up significantly from the record level of 0.30...

Inductor maker Chilisin sees profits up over 200% sequentially in 1Q10

Apr 16, 15:48

Inductor maker Chilisin Electronics has posted net profits of NT$92 million (US$2.93 million) for the first quarter of 2010, up 219% from the previous quarter. The first quarter earnings...

Chip-gear book-to-bill almost flat in February 2010

Mar 21, 15:34

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.22 in February 2010 compared to 1.23 in January, according to SEMI.

Japan chip gear book-to-bill ratio jumps in January 2010, says SEAJ

Feb 23, 15:22

Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 1.36 in January 2010 compared to 1.3 in the prior month and 0.55 a year earlier, according to Semiconductor...

North America chip equipment orders top US$1 billion in January 2010, says SEMI

Feb 22, 10:12

North America-based manufacturers of semiconductor equipment posted US$1.13 billion in orders in January 2010 (three-month average basis) and a book-to-bill ratio of 1.20, according...

North American chip-gear industry posts book-to-bill ratio of 1.03 in December 2009, says SEMI

Jan 22, 12:15

North America-based manufacturers of semiconductor equipment posted US$863.3 million in orders in December 2009 (three-month average basis) and a book-to-bill ratio of 1.03, according...

Japan chip equipment book-to-bill reaches 1.30 in December 2009, says SEAJ

Jan 21, 17:07

Japan-based semiconductor equipment manufacturers posted about 77.39 billion yen (US$844 million) in orders in December 2009 and a book-to-bill ratio of 1.30, according to Semiconductor...

Japan chip gear book-to-bill slips to 1.18 in November 2009

Dec 18, 14:09

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.18 in November 2009 compared to the prior month's level of 1.28, according to Semiconductor Equipment...

North America chip gear book-to-bill ratio at 1.06 in November 2009

Dec 18, 10:19

North America-based manufacturers of semiconductor equipment posted US$790.5 million in orders in November 2009 (three-month average basis) and a book-to-bill ratio of 1.06, according...

MPI probe card shipments recover in November

Dec 11, 16:56

Probe card maker MJC Probe's (MPI's) book-to-bill (B/B) ratio of probe cards used in LCD driver IC manufacturing reached 1.2 in November, the highest level in 2009, thanks to inventory...

North America chip-gear book-to-bill remains above 1.0 in October, says SEMI

Nov 20, 10:49

North America-based semiconductor equipment manufacturers posted US$756.2 million in orders in October 2009 and a book-to-bill ratio of 1.10, according to SEMI. A book-to-bill of...

Japan chip-gear book-to-bill flat in October 2009, says SEAJ

Nov 19, 16:51

Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 1.28 in October 2009, similar to the prior month's level, according to data gathered by the Semiconductor...

North American chip equipment orders return to on-year growth track in September 2009, says SEMI

Oct 21, 10:18

September 2009 appears the first time since May 2007 that on-year bookings have risen and is in-line with the gradually improving capital spending outlook for the remainder of this...

129 items [3/4]
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