Taipei, Thursday, August 28, 2014 00:12 (GMT+8)
partly cloudy
Taipei
28°C
News tagged book-to-bill
  • Last update: Wednesday 27 August 2014 [107 news items]

North American semiconductor equipment industry posts book-to-bill ratio of 1.07 in July, says SEMI

8h 31min ago

North America-based manufacturers of semiconductor equipment posted US$1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07,...

North America semiconductor equipment industry posts book-to-bill ratio of 1.09 in June, says SEMI

Jul 24, 11:34

North America-based manufacturers of semiconductor equipment posted US$1.47 billion in orders worldwide in June 2014 (three-month average basis) and a book-to-bill ratio of 1.09,...

North American semiconductor equipment industry posts January 2014 book-to-bill ratio of 1.04, says SEMI

Feb 24, 15:42

North America-based semiconductor equipment manufacturers posted US$1.28 billion in orders in January 2014 (three-month average basis) and a book-to-bill ratio of 1.04, according...

North America semiconductor equipment industry posts book-to-bill ratio of 1.02 in December 2013, says SEMI

Jan 24, 14:56

North America-based semiconductor equipment manufacturers posted US$1.38 billion in orders in December 2013 (three-month average basis) and a book-to-bill ratio of 1.02, according...

North America semiconductor equipment industry posts book-to-bill ratio of 1.11 in November 2013, says SEMI

Dec 20, 12:08

North America-based semiconductor equipment manufacturers posted US$1.24 billion in orders in November 2013 (three-month average basis) and a book-to-bill ratio of 1.11, according...

US fab tool book-to-bill rises above parity, says SEMI

Nov 21, 14:10

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment rose to 1.05 in October 2013 from 0.97 in the prior month.

North America fab tool book-to-bill continues slide, says SEMI

Oct 22, 14:14

The three-month average book-to-bill ratio for North America-based manufacturers of semiconductor equipment slid to 0.97 in September 2013, down for the third consecutive month, according...

US fab tool book-to-bill ratio slips below parity, says SEMI

Sep 23, 14:03

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.98 in August 2013 after having stayed above parity for seven months.

North American equipment industry posts book-to-bill ratio of 1.00 in July 2013, says SEMI

Aug 22, 14:23

North America-based manufacturers of semiconductor equipment posted US$1.16 billion in orders in July 2013 (three-month average basis) and a book-to-bill ratio of 1.00, according...

SEMI book-to-bill ratio rises to 1.10 for June

Jul 19, 11:13

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.10 in June, up from 1.08 in May, according to the Semiconductor Equipment and Materials...

IC manufacturing equipment spending to slip 5% in 2013, says Gartner

Jun 21, 15:51

Worldwide semiconductor manufacturing equipment spending is projected to total US$35.8 billion in 2013, a 5.5% decrease from 2012 spending of US$37.8 billion, according to Gartner.

US fab tool book-to-bill stays above parity in May 2013, says SEMI

Jun 21, 15:07

The book-to-bill ratio for North America-made semiconductor equipment was unchanged in May 2013 from the previous month's level, but remained above one for the fifth consecutive month,...

US fab-tool book-to-bill stays above parity, says SEMI

May 23, 21:44

The book-to-bill ratio for the North America semiconductor equipment industry stayed above parity for the fourth consecutive month in April 2013, according to industry association...

Equipment supplier Csun expects strong 2Q13

Apr 30, 12:13

A rebound in orders lifted Csun Manufacturing's book-to-bill ratio to 1.52 at the end of the first quarter, indicating that the company's shipments and revenues will grow robustly...

Fab tool book-to-bill ratios mixed

Apr 22, 14:25

The book-to-bill ratio for North America-based semiconductor equipment manufacturers grew to 1.14 in March 2013, while Japan's ratio slipped below parity.

SEMI, SEAJ book-to-bill ratios almost flat in February 2013

Mar 22, 15:13

Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.17 in February 2013, compared to 1.18 in January, according to the Semiconductor Equipment...

SEMI book-to-bill ratio rises above parity

Feb 22, 16:11

Having stayed below parity for the past seven months, the SEMI book-to-bill ratio for US manufacturers of semiconductor equipment climbed to 1.14 in January 2013.

Equipment maker Csun sees book-to-bill ratio rise

Feb 22, 15:39

Taiwan-based Csun Manufacturing has seen orders for LCD, PCB and semiconductor equipment rebound bringing the company's book-to-bill ratio to 1.5-1.8 recently, according to industry...

North America fab tool book-to-bill continues growth, says SEMI

Jan 28, 14:07

North America-based semiconductor equipment manufacturers posted a book-to-bill ratio of 0.92 in December 2012, up for the third consecutive month, according to SEMI.

SEMI, SEAJ book-to-bill ratios rise

Dec 20, 11:04

North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.79 in November 2012, up from 0.75 in October, ending seven straight months of sequential...

Japan October 2012 chip gear book-to-bill ratio at 0.70, says SEAJ

Nov 19, 22:39

Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 0.70 in October 2012, up from 0.65 in September, according to data gathered by Semiconductor Equipment...

Order cancellations drive solar book-to-bill ratio into negative territory, according to Solarbuzz

Oct 23, 10:25

Production equipment order cancellations and push-outs by solar manufacturers during 2012 exceeded US$3 billion by the end of third-quarter 2012, according to NPD Solarbuzz.

SEMI, SEAJ book-to-bill ratios continue slide

Oct 19, 16:41

Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 0.65 in September 2012, hitting the lowest level since May 2009, according to the Semiconductor...

North America IC equipment industry book-to-bill ratio hits 9-month low, says SEMI

Sep 25, 10:43

The book-to-bill ratio of North American semiconductor equipment makers slid to 0.84 for August 2012, hitting the lowest level since November 2011, according to data compiled by SE...

North America book-to-bill ratio slips again, says SEMI

Aug 20, 14:13

Having slid below parity in June 2012 , the SEMI book-to-bill ratio for US manufacturers of semiconductor equipment continued to slip in July.

SEMI book-to-bill ratio slips below parity

Jul 23, 10:38

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.94 in June 2012 after having stayed above parity for four months.

North America fab tool book-to-bill continues slide, says SEMI

Jun 22, 14:29

The book-to-bill ratio for North America-made semiconductor equipment slipped for the second consecutive month but remained above one, according to SEMI.

North America fab tool book-to-bill slips in April 2012, says SEMI

May 23, 14:56

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.10 in April 2012, down from 1.12 in March, according to SEMI.

SEMI book-to-bill rises for sixth straight month

Apr 23, 16:10

The three-month average book-to-bill ratio for North America-based manufacturers of semiconductor equipment rose to 1.13 in March 2012, up for the sixth consecutive month, according...

North America fab tool book-to-bill climbs above parity

Mar 26, 10:22

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.01 in February 2012, above parity for the first time in 17 months, according to figures...

North America fab tool book-to-bill up in January 2012, says SEMI

Feb 24, 12:31

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for January 2012, up from 0.85 in the prior month and scoring the highest since May...

Japan chip gear book-to-bill ratio at 1.06 in January 2012, says SEAJ

Feb 20, 11:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.06 in January 2012, down from 1.20 in December but up from 0.99 a year earlier, according to...

Japan fab tool book-to-bill climbs above parity

Jan 31, 15:10

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.20 in December 2011, above parity for the first time in 10 months, according to figures from...

SEMI book-to-bill ratio grows three months in a row

Jan 30, 10:25

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.88 for December 2011, up for the third consecutive month, according to SEMI. A book-to-bill...

Japan fab tool book-to-bill nears 1.0, says SEAJ

Dec 20, 14:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for November 2011, up from 0.83 in October, according to new figures from the Semiconductor...

107 items [1/4]
Realtime news
  • Innolux notebook panel supply currently faces 20% shortage

    Displays | 1h 29min ago

  • Motherboard price competition expands to Europe

    IT + CE | 1h 39min ago

  • AUO, Innolux have order visibility until 4Q14

    Displays | 2h 9min ago

  • LTPS to become mainstream in handset industry, says CEO of Taiwan Display

    Before Going to Press | 2h 39min ago

  • EPA loosen environmental protection requirements for TSMC planned 18-inch fab

    Before Going to Press | 3h ago

  • Touch Taiwan 2014: GIS displays new whiteboard products

    Before Going to Press | 3h 7min ago

  • HTC to launch HTC Desire 820 in 4Q14

    Before Going to Press | 3h 37min ago

  • LED driver IC vendors look to flat performance in 3Q14

    Before Going to Press | 3h 50min ago

  • VMware may look to form deeper partnerships with Taiwan white-box server players

    Before Going to Press | 3h 51min ago

  • Panel makers see increased orders for vehicle applications

    Before Going to Press | 3h 54min ago

  • AUO to expand in public and commercial segments with new lineup of Ultra HD displays

    Before Going to Press | 3h 56min ago

  • Handset brands launching more Android Wear-based devices

    Before Going to Press | 3h 58min ago

  • China TV vendors changing product mixes to focus more on high-end units for 2H14

    Before Going to Press | 4h 15min ago

  • Production schedules at 12-inch fabs begin to loosen

    Before Going to Press | 4h 23min ago

  • Digitimes Research: China small- to medium-size panel shipments to increase 12.9% in 2H14

    Before Going to Press | 4h 24min ago

Pause
 | 
View more
Analysis of China revised domestic semiconductor industry goals
Media news email alerts

27-Aug-2014 markets closed

 LastChange

TAIEX (TSE)9393.96+3.34+0.04% 

TSE electronic368.03+0.07+0.02% 

GTSM (OTC)139.22+1.39+1.01% 

OTC electronic176.56+1.65+0.94% 

Greater China touch panel shipment forecast through 2015
  • 2014 global high brightness LED market, trends and shipment forecast

    For the global LED lighting market, the market size will reach US$25.82 billion in 2014 or a market penetration rate of 23.4%. This is attributable to exponential shipment growth for light bulbs, tubes, and directional lamps.

  • Greater China touch panel shipment forecast through 2015

    This Special Report provides forecasts through 2015 for Greater China touch panel shipments with breakdowns based on technology (glass, film, resistive), application (smartphone, NB and tablet) and by firm.

  • 2014 global tablet demand forecast

    This report analyzes the main players, their strategies and shipments forecasts for 2014, as well as other factors contributing to either growth or decline in various segments within the tablet market, with a particular focus on Apple, Google, Samsung, and Microsoft, along with whitebox vendors.