Last update: Monday 23 April 2012 [79 news items]
SEMI book-to-bill rises for sixth straight month
Apr 23, 16:10
The three-month average book-to-bill ratio for North America-based manufacturers of semiconductor equipment rose to 1.13 in March 2012, up for the sixth consecutive month, according...
North America fab tool book-to-bill climbs above parity
Mar 26, 10:22
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.01 in February 2012, above parity for the first time in 17 months, according to figures...
North America fab tool book-to-bill up in January 2012, says SEMI
Feb 24, 12:31
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for January 2012, up from 0.85 in the prior month and scoring the highest since May...
Japan chip gear book-to-bill ratio at 1.06 in January 2012, says SEAJ
Feb 20, 11:33
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.06 in January 2012, down from 1.20 in December but up from 0.99 a year earlier, according to...
Japan fab tool book-to-bill climbs above parity
Jan 31, 15:10
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.20 in December 2011, above parity for the first time in 10 months, according to figures from...
SEMI book-to-bill ratio grows three months in a row
Jan 30, 10:25
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.88 for December 2011, up for the third consecutive month, according to SEMI. A book-to-bill...
Japan fab tool book-to-bill nears 1.0, says SEAJ
Dec 20, 14:33
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for November 2011, up from 0.83 in October, according to new figures from the Semiconductor...
Japan chip gear book-to-bill ratio rises in October, says SEAJ
Nov 21, 16:22
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.83 for October 2011, up from 0.75 in September, according to new figures from the Semiconductor...
North America October chip-gear orders up 1%, says SEMI
Nov 18, 14:51
North America-based manufacturers of semiconductor equipment posted US$939.4 million in orders in October 2011 (on a three-month average basis), up 1.4% from the revised September...
PV equipment book-to-bill crashes to historic low of 0.44, says Solarbuzz
Nov 11, 09:55
In third-quarter 2011, the consolidated PV book-to-bill ratio fell to an all-time low of 0.44, according to Solarbuzz. This effectively signals an end point to the most recent PV...
SEMI book-to-bill falls again in September
Oct 21, 15:12
North America-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September 2011, declining for the fifth month in a row.
Japan fab-tool book-to-bill slips to 0.75 in September, says SEAJ
Oct 20, 11:59
Japan-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September, declining for the third month in a row.
PV equipment book-to-bill ratio drops below parity in 2Q11, says SEMI
Sep 22, 15:55
SEMI has reported that worldwide photovoltaic manufacturing equipment billings reached US$2.03 billion for the quarter ended on June 30, 2011. Billings increased 17% sequentially,...
Japan fab-tool book-to-bill continues slide in August, says SEAJ
Sep 21, 15:48
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.76 in August 2011, compared to 0.84 in July and 0.96 in June, according to new figures from the...
SEMI book-to-bill ratio slips to 0.80 in August
Sep 16, 16:06
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.80 for August 2011, down from 0.85 in July, according to new figures from SEMI. A book-to-bill...
Chip equipment book-to-bill lower in July 2011
Aug 19, 10:30
North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.86 in July, down from 0.94 in June, according to SEMI. Meanwhile, data gathered by the...
North America chip-gear orders slip in June, says SEMI
Jul 21, 01:00
North America-based manufacturers of semiconductor equipment posted US$1.55 billion in orders in June 2011 (three-month average basis), down 4.4% from the revised level of US$1.62...
SEMI book-to-bill ratio slips to 0.97 in May
Jun 17, 16:07
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for May 2011, down from 0.98 in April, according to new figures from SEMI.
PV book-to-bill forecast to dip sharply below parity before rebounding in 4Q11, says Solarbuzz
Jun 2, 14:43
In first quarter of 2011, the consolidated PV book-to-bill ratio posted a three-month average of 1.01, according to Solarbuzz. During the second half of 2011, the PV book-to-bill...
Solar equipment book-to-bill ratio hits 1.13 in 4Q10
May 31, 14:47
According to research reports by international PV associations, the book-to-bill ratio for solar equipment was 1.13 in fourth-quarter 2010 indicating an expansion of the solar mark...
North America chip gear book-to-bill up in April
May 20, 11:05
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.98 for April 2011, up from 0.95 in March, according to new figures from SEMI.
SEMI book-to-bill ratio rises to 0.95 in March
Apr 22, 10:45
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for March 2011, up from 0.87 in February, according to new figures from SEMI.
Japan fab-tool book-to-bill back above parity in February 2011, says SEAJ
Mar 24, 01:00
Japan-based manufacturers of semiconductor equipment posted JPY105.79 billion (US$1.31 billion) in orders in February 2011 (three-month average basis) and a book-to-bill ratio of...
SEMI book-to-bill ratio stays below parity in February 2011
Mar 18, 15:49
North America-based manufacturers of semiconductor equipment posted US$1.58 billion in orders in February 2011 (three-month average basis) and a book-to-bill ratio of 0.87, according...
PV book-to-bill in 4Q10 remains above parity, says Solarbuzz
Mar 11, 10:47
In the fourth quarter of 2010, research firm Solarbuzz's PV book-to-bill analysis posted a three-month average of 1.10. Across the entire year, the 12-month average in 2010 reached...
SEMI book-to-bill ratio slips again
Feb 23, 14:48
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.85 in January 2011, compared to 0.90 in December 2010 and 0.97 in November, according...
Japan fab tool book-to-bill slips below parity in January 2011
Feb 18, 15:33
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.99 in January 2011, down from 1.07 in December and the lowest since May 2009, according to the...
SEMI, SEAJ book-to-bill ratios slip in December 2010
Jan 21, 14:06
North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.90 in December, down from 0.97 in November, according to SEMI. Meanwhile, data gathered...
North America fab tool book-to-bill slips to 0.96 in November 2010, says SEMI
Dec 17, 16:11
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.96 in November 2010 compared to 0.98 in October and 1.06 a year ago, according to SEMI...
Japan chip gear book-to-bill continues to slide on-month
Nov 22, 13:41
The book-to-bill ratio for Japan-based semiconductor equipment manufacturers slipped to 1.12 in October 2010 from 1.14 in the prior month, according to the Semiconductor Equipment...
SEMI book-to-bill ratio drops below parity in October 2010
Nov 19, 16:09
The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.98 in October 2010 from 1.03 in the prior month.
IC capacity utilization drops to 95.2% in 3Q10, SICAS figures show
Nov 19, 12:15
Global IC industry capacity utilization dropped to 95.2% in the third quarter of 2010 from 95.6% in the second, according to the latest data from Semiconductor Industry Capacity Statistics...
SEMI book-to-bill ratio drops to 1.03 in September 2010
Oct 22, 14:07
The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 1.03 in September 2010, compared to 1.17 in August and 1.23 in July.
Japan September 2010 fab tool book-to-bill slips to 1.14, says SEAJ
Oct 21, 14:35
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.14 in September 2010, down from 1.38 in August, according to new figures from the Semiconductor...
North America chip gear book-to-bill ratio up in July 2010, says SEMI
Aug 20, 15:27
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.23 in July 2010, compared to 1.18 in June, according to SEMI. The book-to-bill of 1.23...
LED industry enjoys high capacity utilization rates in 2Q12
LED | 27min ago
Solar wafer firms inclined to follow solar cell firms to increase quotes
Green energy | 45min ago
Silicon Power Computer & Communications to list on OTC
Bits + chips | 55min ago
Eris Technology to list on OTC at the end of June
Bits + chips | 1h 26min ago
Compal lands notebook ODM orders from Samsung
IT + CE | 2h 34min ago
Weltrend expects to turn into profitability in 2Q12
Before Going to Press | 1min ago
Price key to popularity of Thunderbolt, say Taiwan motherboard makers
Before Going to Press | 53min ago
TPK to see revenue growth in 3Q12
Before Going to Press | 1h 21min ago
China government focuses on illegal imports of waste materials that carry polysilicon
Before Going to Press | 2h 5min ago
Three Taiwan IC distributors deny Samsung plans to withdraw sales agent rights
Before Going to Press | 2h 6min ago
Taiwan market: China-based vendors competing in entry-level to mid-range smartphone segment
Before Going to Press | 2h 31min ago
TSMC sequential growth in 3Q12 revenues may fall to 5% due to declining book/bill ratio
Before Going to Press | 2h 48min ago
- Asustek, Acer to see 10% of notebook shipments in 2012 feature touchscreen panels
- Acer, Asustek to launch netbooks with upgraded Atom processor in 3Q12
- CMI, AUO see decreasing production costs due to declining equipment depreciation costs
- Intel pushes new battery solutions to reduce ultrabook cost
- International smartphones vendors worried about insufficient LTE chip supply
- AMD prepares low-voltage CPUs for Windows 8 tablet PCs
- Some China solar cell makers looking for Taiwan partnerships
- Taiwan solar firms fear turning into OEM firms for China
- Career to ramp up FPCB capacity by 30% in 2H12
- Hermes Microvision lists on OTC market
- GET refutes production suspension of thin-film solar products
- Packaging and testing firms see mobile DRAM orders rise
- Rexchip shares at stake between Micron-Elpida deal, say sources
- Taiwan market: WiMAX operator Global Mobile obtains NT$640 million loan
- Mighty Bright showcasing LED lighting lineup at the National Stationery Show in New York
- Taiwan LED manufacturers to use silicon substrates for producing LED chips
- China TV makers to further expand products abroad
- China market: 6.8 million iPhones shipped in 1Q12, says Digitimes Research
- BOE may roll out AMOLED panels at Ordos line in 2014
- Overall value of lighting market to shrink as LEDs displace conventional technology, says Pike Research
- MediaTek lands 2.5G handset solution orders from Nokia, say sources
- US solar firms may request duties on China-made solar modules
- Taiwan solar cell makers plan to increase quotes due to expected order increases from China
- Taiwan 1Q12 display production value down 7.7%, says IEK
- Korean vendors compete for OLED market
- Digitimes Research: Embedded and standalone integration in NFC IC development
- Digitimes Research: Solar spot prices in Greater China freeze before final verdict of anti-dumping and anti-subsidy investigation
- Digitimes Research: Solar spot prices in Greater China remain flat despite continuous demand from Europe
- Digitimes Research: April 1 solar FIT cuts in Germany to negatively impact solar spot prices
- Releases
- White papers
- Bulletin
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Fujitsu converts Fujitsu Toshiba Mobile Communications into a wholly owned subsidiary
- NEC reaks the speed barriers of microwave transmission with ultra high modulations
- ATO Solution to launch 256Mb SLC NAND Flash - for the first time in fabless industry
- LSI completes acquisition of SandForce
- NEC develops super-resolution technologies for fine magnification of surveillance camera images
22-May-2012 markets closed
| Last | Change |
| TAIEX (TSE) | 7274.89 | +82.66 | +1.15% |

| TSE electronic | 277.63 | +3.99 | +1.46% |

| GTSM (OTC) | 104.57 | +2.00 | +1.95% |

| OTC electronic | 134.14 | +2.91 | +2.22% |

- Thousands protest Taiwan leader's inauguration (May 19) - AP (via Google)
- 40% of employees in Asia/Pacific will be mobile workers by 2015, says IDC (May 14) - IDC
- Globalfoundries welcomes President Barack Obama (May 4) - Company release
- India gives 4G to Qualcomm at last (May 8) - Tech Eye.net
- Abu Dhabi fund Mubadala plans US$5.5 billion spending in 2012 (May 9) - Reuters
- French, Greek voters say no to austerity (May 7) - Washington Post
- SK Hynix won't bid for Elpida (May 3) - Wall Street Journal
- Google, authors go head to head over digital books (May 3) - Reuters
- Commentary: A Micron-Elpida merger would improve DRAM industry health
- Simon Sze and his invention of floating-gate NVM
- Commentary: Long-term solar material supply contracts increase losses during industry downturns
- Commentary: Grid parity in India may happen sooner than expected
- Commentary: US protectionism on domestic solar industry may backfire

Keeping industrial interesting: Q&A with analog and mixed signal solution provider Maxim
According to analog and mixed-signal semiconductor maker Maxim Integrated Products, the industrial...

Over the next 30 years, the world's middle class (defined as per capita income of more than US$8,000...

Turning C code into silicon in 8-16 weeks: Q&A with semi startup Algotochip
Silicon Valley startup Algotochip specializes in architecting and implementing all aspects of a complete...

The rise of China Star Optoelectronics Technology: Q&A with CEO He Chengming
The ramping-up of 8.5G production at China-based BOE Technology and China Star Optoelectronics Technology...
- Notebook market overview - Jun 2011
The notebook industry in 2010 experienced several major events that significantly changed the industry's ecosystem for the year and the industry is also believed...
- LCD TV overview - Jun 2011
Growth of the global LCD TV market was not as strong as expected in 2010 as the market continued to feel the aftershocks of the economic recession that had hit...
- Taiwan motherboard industry overview - Jun 2011
The motherboard industry began 2010 with optimism and expected to see a reversal of the previous two years' declines in revenues and shipments as the impact of...
- Taiwan DRAM module industry overview - Jun 2011
The year 2010 represented a peak in recent years for the DRAM module industry. Optimism surfaced in the second half of 2009 thanks to a return of demand on the...
- Overview of the Greater China small- to medium-size TFT LCD industry
This DIGITIMES Research Special Report provides a comprehensive overview of the players and market direction of panel makers in the Greater China region, as well as outlining the potential market influence of OLEDs.
- Standards and scale of Asia LED lighting markets
Digitimes Research projects marked growth in LED markets across Asia over the next five years. This Digitimes Research Special Report provides an overview of the standards in the major LED lighting markets in Asia.
- Development of electronics manufacturing bases in China central and western regions
The recently published 12th Five Year Plan clearly states the intention to reform the industrial structure. Central government policy has succeeded in making the central and western regions the most important manufacturing sites for the coming decade.

















