Last update: Thursday 23 May 2013 [95 news items]
US fab-tool book-to-bill stays above parity, says SEMI
May 23, 21:44
The book-to-bill ratio for the North America semiconductor equipment industry stayed above parity for the fourth consecutive month in April 2013, according to industry association...
Equipment supplier Csun expects strong 2Q13
Apr 30, 12:13
A rebound in orders lifted Csun Manufacturing's book-to-bill ratio to 1.52 at the end of the first quarter, indicating that the company's shipments and revenues will grow robustly...
Fab took book-to-bill ratios mixed
Apr 22, 14:25
The book-to-bill ratio for North America-based semiconductor equipment manufacturers grew to 1.14 in March 2013, while Japan's ratio slipped below parity.
SEMI, SEAJ book-to-bill ratios almost flat in February 2013
Mar 22, 15:13
Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.17 in February 2013, compared to 1.18 in January, according to the Semiconductor Equipment...
SEMI book-to-bill ratio rises above parity
Feb 22, 16:11
Having stayed below parity for the past seven months, the SEMI book-to-bill ratio for US manufacturers of semiconductor equipment climbed to 1.14 in January 2013.
Equipment maker Csun sees book-to-bill ratio rise
Feb 22, 15:39
Taiwan-based Csun Manufacturing has seen orders for LCD, PCB and semiconductor equipment rebound bringing the company's book-to-bill ratio to 1.5-1.8 recently, according to industry...
North America fab tool book-to-bill continues growth, says SEMI
Jan 28, 14:07
North America-based semiconductor equipment manufacturers posted a book-to-bill ratio of 0.92 in December 2012, up for the third consecutive month, according to SEMI.
SEMI, SEAJ book-to-bill ratios rise
Dec 20, 11:04
North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.79 in November 2012, up from 0.75 in October, ending seven straight months of sequential...
Japan October 2012 chip gear book-to-bill ratio at 0.70, says SEAJ
Nov 19, 22:39
Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 0.70 in October 2012, up from 0.65 in September, according to data gathered by Semiconductor Equipment...
Order cancellations drive solar book-to-bill ratio into negative territory, according to Solarbuzz
Oct 23, 10:25
Production equipment order cancellations and push-outs by solar manufacturers during 2012 exceeded US$3 billion by the end of third-quarter 2012, according to NPD Solarbuzz.
SEMI, SEAJ book-to-bill ratios continue slide
Oct 19, 16:41
Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 0.65 in September 2012, hitting the lowest level since May 2009, according to the Semiconductor...
North America IC equipment industry book-to-bill ratio hits 9-month low, says SEMI
Sep 25, 10:43
The book-to-bill ratio of North American semiconductor equipment makers slid to 0.84 for August 2012, hitting the lowest level since November 2011, according to data compiled by SE...
North America book-to-bill ratio slips again, says SEMI
Aug 20, 14:13
Having slid below parity in June 2012 , the SEMI book-to-bill ratio for US manufacturers of semiconductor equipment continued to slip in July.
SEMI book-to-bill ratio slips below parity
Jul 23, 10:38
The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.94 in June 2012 after having stayed above parity for four months.
North America fab tool book-to-bill continues slide, says SEMI
Jun 22, 14:29
The book-to-bill ratio for North America-made semiconductor equipment slipped for the second consecutive month but remained above one, according to SEMI.
North America fab tool book-to-bill slips in April 2012, says SEMI
May 23, 14:56
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.10 in April 2012, down from 1.12 in March, according to SEMI.
SEMI book-to-bill rises for sixth straight month
Apr 23, 16:10
The three-month average book-to-bill ratio for North America-based manufacturers of semiconductor equipment rose to 1.13 in March 2012, up for the sixth consecutive month, according...
North America fab tool book-to-bill climbs above parity
Mar 26, 10:22
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.01 in February 2012, above parity for the first time in 17 months, according to figures...
North America fab tool book-to-bill up in January 2012, says SEMI
Feb 24, 12:31
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for January 2012, up from 0.85 in the prior month and scoring the highest since May...
Japan chip gear book-to-bill ratio at 1.06 in January 2012, says SEAJ
Feb 20, 11:33
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.06 in January 2012, down from 1.20 in December but up from 0.99 a year earlier, according to...
Japan fab tool book-to-bill climbs above parity
Jan 31, 15:10
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.20 in December 2011, above parity for the first time in 10 months, according to figures from...
SEMI book-to-bill ratio grows three months in a row
Jan 30, 10:25
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.88 for December 2011, up for the third consecutive month, according to SEMI. A book-to-bill...
Japan fab tool book-to-bill nears 1.0, says SEAJ
Dec 20, 14:33
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for November 2011, up from 0.83 in October, according to new figures from the Semiconductor...
Japan chip gear book-to-bill ratio rises in October, says SEAJ
Nov 21, 16:22
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.83 for October 2011, up from 0.75 in September, according to new figures from the Semiconductor...
North America October chip-gear orders up 1%, says SEMI
Nov 18, 14:51
North America-based manufacturers of semiconductor equipment posted US$939.4 million in orders in October 2011 (on a three-month average basis), up 1.4% from the revised September...
PV equipment book-to-bill crashes to historic low of 0.44, says Solarbuzz
Nov 11, 09:55
In third-quarter 2011, the consolidated PV book-to-bill ratio fell to an all-time low of 0.44, according to Solarbuzz. This effectively signals an end point to the most recent PV...
SEMI book-to-bill falls again in September
Oct 21, 15:12
North America-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September 2011, declining for the fifth month in a row.
Japan fab-tool book-to-bill slips to 0.75 in September, says SEAJ
Oct 20, 11:59
Japan-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September, declining for the third month in a row.
PV equipment book-to-bill ratio drops below parity in 2Q11, says SEMI
Sep 22, 15:55
SEMI has reported that worldwide photovoltaic manufacturing equipment billings reached US$2.03 billion for the quarter ended on June 30, 2011. Billings increased 17% sequentially,...
Japan fab-tool book-to-bill continues slide in August, says SEAJ
Sep 21, 15:48
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.76 in August 2011, compared to 0.84 in July and 0.96 in June, according to new figures from the...
SEMI book-to-bill ratio slips to 0.80 in August
Sep 16, 16:06
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.80 for August 2011, down from 0.85 in July, according to new figures from SEMI. A book-to-bill...
Chip equipment book-to-bill lower in July 2011
Aug 19, 10:30
North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.86 in July, down from 0.94 in June, according to SEMI. Meanwhile, data gathered by the...
North America chip-gear orders slip in June, says SEMI
Jul 21, 01:00
North America-based manufacturers of semiconductor equipment posted US$1.55 billion in orders in June 2011 (three-month average basis), down 4.4% from the revised level of US$1.62...
SEMI book-to-bill ratio slips to 0.97 in May
Jun 17, 16:07
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for May 2011, down from 0.98 in April, according to new figures from SEMI.
PV book-to-bill forecast to dip sharply below parity before rebounding in 4Q11, says Solarbuzz
Jun 2, 14:43
In first quarter of 2011, the consolidated PV book-to-bill ratio posted a three-month average of 1.01, according to Solarbuzz. During the second half of 2011, the PV book-to-bill...
Globalfoundries lands wafer start orders from China-based Rockchip
Bits + chips | 8h 36min ago
Everlight Electronics expects increases in revenue proportion of LED backlights, lighting in 2013
LED | 8h 55min ago
Prices of smartphone and tablet solutions to drop 10-20% in 2H13
Bits + chips | 8h 59min ago
NPC 2013 capex to focus on FC CSP substrates, says president
Bits + chips | 9h 9min ago
Samsung offers subsidies, Asustek cuts prices to promote tablet sales in Brazil, say local channels
IT + CE | 10h 1min ago
China-based TV vendors to procure over 30 million panels from Taiwan makers, says CVIA vice president
Displays | 10h 56min ago
Connector makers worried about price competition arising from Foxconn spinning off NWInG
Before Going to Press | 9h 46min ago
DRAM shortages to continue for 3 years, says Inotera executive
Before Going to Press | 9h 58min ago
Chin-Poon expanding share in global automobile board market
Before Going to Press | 10h 38min ago
Taiwan vendors, ODMs turn conservative about 2H13 notebook shipments
Before Going to Press | 10h 50min ago
Lite-On IT to start production of LED light bulbs in 3Q13
Before Going to Press | 11h 4min ago
Taiwan market: ViewSonic to launch Full HD projectors by end of 2013
Before Going to Press | 11h 10min ago
Foxconn to start production of 70-inch Ultra HD TVs in 1Q14
Before Going to Press | 11h 11min ago
China has no schedule for hiking customs duty on TV panels, says CVIA vice president
Before Going to Press | 11h 12min ago
JDI, CPT, Innolux see increased orders for large-size panels from smartphone vendors, say Taiwan makers
Before Going to Press | 11h 17min ago
- First-tier players may release smartphones that adopt heat pipes by the end of the year
- Chipbond ramping up testing capacity for advanced driver ICs
- Wintek to benefit from Google and Amazon touch panel orders
- CVIA: China to purchase 30 million TV panels from Taiwan makers
- Taiwan makers see booming orders for smartphone tablet accessories
- Taiwan IC design houses reducing exposure in NAND flash controller market
- Taiwan LED Lighting Industry Alliance to propose Taiwan-China common standards for LED lighting
- Panel supply shortage likely to affect second-tier handset shipments
- China smartphone shipments grow 117% on year in 1Q13, says IDC
- Kinsus sets 2013 capex at record NT$4.5-5 billion
- Taiwan market: Handset shipments in 1Q13 hit record, says IDC
- Asustek expects 10% sequential drop in 2Q13 notebook and tablet shipments
- Taiwan market: Taiwan Mobile to launch VoIP at M+
- Mixed-signal technology to dominate global chipset market: Q&A with Dialog Semiconductor CEO Jalal Bagherli
- Taiwan market: Tablet sales in 2013 to reach nearly 2 million units, says FET executive
- SPIL expanding capacity for high-end ICs
- OLED TVs to be similarly priced as LCD TVs by 2016, say observers
- Global output of LED light bulbs to reach 600 million units in 2013, says Epistar chairman
- Epistar to issue 250 million new shares for private placement
- Unity Opto profits double in 2012
- New Csun solar manufacturing facility in Turkey opens door for maker
- Digitimes Research: South Korea firms mixed on solar business developments
- AMD unveils upcoming server strategy and roadmap
- Connector maker UDE to benefit from games console orders
- Digitimes Research: China touch panel makers expand their influence in the market
- Releases
- White papers
- Bulletin
- Advantech Releases 6U CompactPCI Board with 4th Generation Intel Core i7 Processor
- Advantech to Support CompactPCI PlusIO and Serial Standards
- ABB to showcase leading-edge power distribution technologies at CIRED
- Fanless In-Vehicle Systems with Intel Core i7
- FIC partners with Cluster Wireless to deliver Intelligent M2M Solutions
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
18-Jun-2013 markets closed
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| TSE electronic | 302.28 | +1.82 | +0.61% |

| GTSM (OTC) | 119.63 | +0.78 | +0.66% |

| OTC electronic | 143.95 | +0.94 | +0.66% |

- IBM starts American job cuts, say reports (June 13) - NASDAQ.com
- NHK to air documentary on Taiwanese semiconductor giant (June 6) - Focus Taiwan news channel
- Slow global GDP growth weighs on IC market (May 29) - IC Insights
- Infineon ships security chips to Taiwan electronic passport program (May 23) - Company release
- Apple 'among largest tax avoiders in US' - Senate committee (May 21) - BBC News
- Weak eurozone growth hits euro (May 15) - The Financial Times
- German factory orders rise for second month (May 7) - Bloomberg
- Eurozone retail sales fall for second consecutive month (May 6) - BBC News
- Lose the switch, lose the loss: Cavendish Kinetics leverages MEMS for tunable RF components
- Cavendish Kinetics announces RF MEMS technology for improving wireless performance
- Solar trade dispute spreads to wine industry; gets personal
- Analogix eyes link between smartphones and HD displays
- Strong reaction from China, EU members over solar trade row

Dialog Semiconductor has managed to land solution orders from first-tier smartphone vendors in the...

Lose the switch, lose the loss: Cavendish Kinetics leverages MEMS for tunable RF components
Cavendish Kinetics recently announced the availability of production samples of its tunable RF capacitors...

Taiwan-based Chimei Group, once a major LCD panel maker, now focuses on providing upstream components...

Eight years ago, the Metro Ethernet Forum (MEF) defined the first carrier class networks and services...
- Smartphone and tablet industry: The view from Taiwan - May 2012
Taiwan-based companies have a long and successful history of involvement in the supply chain for mobile devices, which for the purposes of this article consist...
- Taiwan motherboard industry overview - May 2012
The year 2011 saw the motherboard industry reverse its trend of declining shipments year-on-year, to post a slight 0.2% growth. This upturn in fortunes was expected...
- Notebook market overview - Jun 2011
The notebook industry in 2010 experienced several major events that significantly changed the industry's ecosystem for the year and the industry is also believed...
- LCD TV overview - Jun 2011
Growth of the global LCD TV market was not as strong as expected in 2010 as the market continued to feel the aftershocks of the economic recession that had hit...
- 2H 2012 global TFT panel market forecast
Digitimes Research predicts there will be a total of 389 million large-sized TFT LCD panels shipped in 2H12, with 195 million in the third quarter and 194 million in the fourth quarter - with the total representing a 7.6% increase over the first half of this year.
- Trends and shipment forecast for 2H 2012 smartphone market
Smartphone shipments in 2010 and 2011 both enjoyed growth of more than 60%. Growth will decelerate in 2012 due to the high base, as well as a slowdown in consumer spending in Western Europe.
- Trends in Asia LED chip manufacturing industry
Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.

















