12-inch wafer
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110 news items tagged 12-inch wafer

  • Taiwan-based Winbond Electronics, a provider of specialty DRAM and flash memory, has announced plans to budget an additional capex of NT$6.28 billion (US$207.7 million) for buying...
  • Globalfoundries+CEO
    Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...
  • NSIG hires former MEMC CEO

    Monday 10 July 2017
    China's National Silicon Industry Group (NSIG) has hired Nabeel Gareeb, former CEO of MEMC Electronic Materials, to help it establish a materials eco-system in China.
  • Globalfoundries+22FDX+obtains+orders+in+China
    Globalfoundries' 22nm FD-SOI process, dubbed 22FDX, has obtained orders from Shanghai Fudan Microelectronics, according to industry sources.
  • Powerchip Technology is looking to become the second foundry partner of Illumina following Taiwan Semiconductor Manufacturing Company (TSMC), according to industry sources.
  • New+Winbond+NOR+flash+for+IoT
    Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of its lowest-voltage SpiFlash memories to date. At 1.2 and 1.5V, and in 8-pin...
  • GlobalWafers+chairperson+Doris+Hsu
    Taiwan-based GlobalWafers is teaming up with Ferrotec to ramp up new 8-inch wafer capacity, according to company chairperson Doris Hsu.
  • winbond
    Winbond Electronics plans to expand its 12-inch fab capacity to 48,000 wafers per month by the end of 2017 from the current 44,000 units, according to the memory maker. The monthly...
  • Hefei Chang Xin's ambition to grow its DRAM business has seen some progress though the China-based firm has now chosen to keep a low profile. The company has been quietly renamed...
  • Specialty DRAM and NOR flash memory maker Winbond Electronics is planning a new 12-inch wafer plant which will be located in Tainan, southern Taiwan or Singapore.
  • UMC expects flat performance in 2Q17

    Thursday 27 April 2017
    United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the second quarter of 2017, when the foundry chipmaker's capacity utilization rate...
  • United Microelectronics' (UMC) recently-opened 12-inch wafer fab in Xiamen, China has obtained 40nm chip orders from MediaTek and Spreadtrum Communications, according to industry...
  • Winbond Electronics has been approached by the Singapore government to set up a manufacturing site locally, and the Taiwan-based maker of specialty DRAM and flash memory is considering...
  • Globalfoundries' plan to construct a new 300mm wafer fab in Chengdu, China to satisfy demand for the foundry's 22FDX technology is well on track, with production at the facility set...
  • Faraday Technology has announced its 55nm eFlash-based ASIC solution is ready to support better MCU performance, and has already achieved multiple design wins for products such as...
  • With Siltronic reportedly drawing interest from China's state-backed industry group, the global silicon wafer industry is expected to go through a period of consolidation in 2017.
  • wafer
    Chipmakers including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Micron Technology have been informed by their upstream suppliers that prices...
  • Spreadtrum Communications has placed 40nm chip orders with United Microelectronics' (UMC) recently-opened 12-inch wafer fab in Xiamen, China, according to industry sources.
  • United Microelectronics (UMC) has purchased NT$562.88 million (US$17.42 million) worth of equipment from ASML for its 12-inch wafer fab in Xiamen, according to a company filing with...
  • The Investment Commission of Taiwan's Ministry of Economic Affairs (MOEA) has approved TSMC's proposal to set up a 12-inch wafer fab and a design service center in Nanjing, China...
  • United Microelectronics (UMC) has purchased a total of NT$1.96 billion (US$58.4 million) worth of equipment from Lam Research and Tokyo Electron for its 12-inch wafer fab in Xiamen,...
  • United Microelectronics (UMC) has purchased a total of NT$1.98 billion (US$59.5 million) worth of equipment from Murata Machinery and Applied Materials for its 12-inch wafer fab in...
  • UMC orders equipment for Xiamen fab

    Wednesday 6 January 2016
    United Microelectronics (UMC) has purchased NT$1.05 billion (US$31.8 million) worth of equipment from KLA-Tencor for its 12-inch wafer fab in Xiamen, according to a company filing...
  • TSMC today submitted an application to the Investment Commission of Taiwan's Ministry of Economic Affairs for an investment project to build a wholly-owned 12-inch wafer manufacturing...
  • Operations at United Microelectronics' (UMC) 12-inch wafer fab in Xiamen are expected to kick off as early as third-quarter 2016, according to a report from Japan's Nikkei Asian...
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Related photos
Winbond+SpiStack+memories

Winbond SpiStack memories

Photo: Company, Wednesday 30 March 2016

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Altatech AltaSight SL300 inspection system

Photo: Company, Tuesday 29 June 2010

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