Taipei, Tuesday, June 28, 2016 22:13 (GMT+8)
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Taiwan makers look to demand for thin heat-pipes used in smartphones - related content
Aaron Lee, Taipei; Adam Hwang, DIGITIMES [Tuesday 8 April 2014]
Realtime news
  • China market: Subor Electronics teams up with AMD to develop VR gaming chip, says report

    Bits + chips | 48min ago

  • TCL sees smartphone shipments decline nearly 13% on year in May

    Mobile + telecom | 1h 24min ago

  • Digitimes Research: Samsung Display AMOLED panel shipments to increase to 560 million units in 2019

    Displays | 1h 41min ago

  • Commentary: Samsung Display to continue dominating AMOLED market until 2H17

    Displays | 1h 44min ago

  • IC design houses allocating 28/40nm orders to UMC, SMIC

    Before Going to Press | 1h 36min ago

  • Fingerprint sensor startup raises nearly NT$200 million

    Before Going to Press | 1h 50min ago

  • China market: Foxconn plans to resume retail deployment

    Before Going to Press | 1h 56min ago

  • Qualcomm aims to roll out 5G SoC solutions in 2018-2019

    Before Going to Press | 1h 59min ago

  • SAS not seeing rebound in China market

    Before Going to Press | 2h ago

  • Arcadyan Technology to deal out 2015 dividend of NT$1.60

    Before Going to Press | 2h 4min ago

  • LTE Cat-M1, LTE Cat-NB1 to become mainstream IoT technology, says Qualcomm at MWC Shanghai 2016

    Before Going to Press | 2h 5min ago

  • Hiwin Technologies to deal out 2015 dividend of NT$2.30

    Before Going to Press | 2h 6min ago

  • Wafer Works to not deal out 2015 dividend

    Before Going to Press | 2h 7min ago

  • InterServ International to not deal out 2015 dividend

    Before Going to Press | 2h 8min ago

  • Egis fingerprint sensor adopted by Samsung

    Before Going to Press | 2h 9min ago

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28-Jun-2016 markets closed

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GTSM (OTC)125.75+0.81+0.65% 

OTC electronic159.97+1.39+0.88% 

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