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News tagged thermal module
  • Last update: Wednesday 21 June 2017 [15 news items]

Cooling module maker CCI starts production at new factory in China

Jun 21, 14:48

Thermal module maker Chaung Choung Technology (CCI) is moving manufacturing equipment from a factory on lease in Chongqing, western China, to a newly constructed factory nearby. So...

Thermal module maker Sunonwealth reports increased revenues for December

Jan 11, 11:07

Notebook-use heat-dissipation module maker Sunonwealth Electric Machine Industry has reported revenues of NT$1.118 billion, increasing 3.04% from the previous month and 27.1% from...

Notebook-use thermal module makers step into server applications

Apr 29, 12:02

Notebook-use heat-dissipation module makers, including Taiwan-based Auras Technology, Sunonwealth Electric Machine Industry, Asia Vital Components and Cooler Master as well as Japan-based...

Thermal module maker Taisol looks to 10-15% revenue growth in 2015

Jan 30, 14:34

Connector and notebook thermal module supplier Taisol Electronics is expected to see its revenues grow 10-15% in 2014 from NT$2.63 billion (US$83.37 million) recorded a year earlier,...

Notebook cooling module makers eye business opportunities from electric vehicles

Jul 25, 15:13

Notebook cooling module makers including Taiwan-based Chaun-Choung Technology and Japan-based Furukawa Electric, in view of the large potential demand for heat dissipation solutions...

Taiwan cooling module makers to be surpassed by China makers in 2 years

May 23, 12:15

While Taiwan-based cooling module makers have been developing 0.6-0.8mm ultra-thin heat-pipes for smartphones, China-based makers have brought continued competitive pressure through...

Quanta Computer, Pegatron certify China-based thermal module makers

May 9, 12:00

Quanta Computer and Pegatron have given certification to China-based thermal module makers in a bid to minimize component costs, according to Taiwan-based supply chain makers.

Taiwan thermal module makers expanding heat-pipe capacities

Apr 25, 14:11

Major Taiwan-based thermal module makers expect fast growing demand for thin heat-pipes from smartphone and tablet vendors, and are expanding production capacities in preparation...

Taiwan makers look to demand for thin heat-pipes used in smartphones

Apr 8, 19:32

Sony Mobile Communications has adopted thin heat-pipes for its Xperia Z2, and Taiwan-based thermal module makers hope that other smartphone vendors will follow suit, according to...

Demand for thermal modules used in convertible notebooks increasing

Jan 3, 20:33

As Windows 8 has stimulated increasing demand for convertible notebooks, orders for related thermal modules are expected to be on the rise, according to Taiwan-based thermal module...

Asia Vital Components to set up operational base in western China

Nov 25, 10:36

Asia Vital Components (AVC), a maker of thermal solution products, on November 23 signed with the government of Chengdu to set up a production base and R&D center for heat thinks...

Thermal module maker Auras reenters Dell supply chain

Nov 8, 11:24

Auras Technology, a Taiwan-based maker of thermal modules, has become qualified for competition for orders from Dell, and is expected to begin shipments of thermal modules used in...

Chaun Choung looks to ship 40 million notebook cooler modules in 2010

Sep 17, 01:25

Notebook cooler module maker Chaun Choung Technology expects its cooler module shipments to top 40 million units in 2010, accounting for a 20% of the global cooler module market,...

All-in-one PCs could be boon for cooling module makers

Mar 26, 14:50

Major Taiwan-based PC cooling modules makers, Chaun-Choung Technology (CCI) and Auras Technology, expect the booming global sales of all-in-one PCs will boost their performance as...

Japan-based Furukawa Electric sues Taiwan-based CCI for infringement of heat-sink patent

Jan 27, 12:00

Japan-based Furukawa Electric on January 25 filed with Taiwan's Intellectual Property Court charging Chaun-Choung Technology (CCI) with infringement of its Taiwan patent No.121526...

Global notebook shipment forecast, 2017 and beyond
China AMOLED panel capacity expansion forecast, 2016-2020

24-Nov-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.