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Innolux to launch semiconductor advanced packaging mass-production 2H24

Rebecca Kuo, Taipei; Julie Chang, DIGITIMES Asia Tuesday 26 December 2023 0

Credit: DIGITIMES

Industry sources indicate that Taiwan-based panel maker Innolux has received orders occupying the entire capacity of its first-phase chip-first advanced fan-out panel level packaging (FOPLP) process. Mass production and shipments for the process are...

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