CONNECT WITH US
NEWS TAGGED HPC
Wednesday 30 October 2024
Hon Precision secures orders from top US CSPs, riding the CoWoS growth wave
Hon Precision, Inc. (HPI), based in Taiwan, will be listed on the Emerging Stock Board (ESB) on October 31. The company, which specializes in backend semiconductor test handlers and...
Monday 21 October 2024
Southern Taiwan Science Park to see output value hit another record high in 2024
The government-operated Southern Taiwan Science Park (STSP) has capitalized on the global AI surge and the thriving semiconductor sector, generating a record revenue of NT$1.31 trillion...
Friday 18 October 2024
High-spec power supplies for AI computing to drive growth for Liteon
As power management and heat dissipation become increasingly important with the high-performance computing required for generative AI, a trend is emerging in the field of power supplies:...
Thursday 17 October 2024
TSMC expects 13% revenue growth in 4Q24
TSMC has disclosed that its third-quarter revenue and margins surpassed the guidance it provided three months ago. The pure-play foundry anticipates a 13% sequential increase in revenue...
Thursday 17 October 2024
Testing interface sector thrives as AI boom and mobile market fuel demand
The ongoing surge in generative AI is propelling demand for advanced testing technologies, with leading testing interface providers Winway and MPI reporting impressive financial results...
Wednesday 16 October 2024
TCB packaging crucial in AI and HPC applications, says ASMPT
Semiconductor and electronics manufacturing equipment supplier ASMPT sees sustained strong demand for thermocompression bonding (TCB) machines used in advanced packaging, as the trend...
Tuesday 15 October 2024
TSMC outlook and key client orders to garner focus at upcoming investor meeting
TSMC will hold an investor meeting on October 17 to review the company's business and market projections, as well as updates on its capital expenditure strategy for the current yea...
Thursday 3 October 2024
Taiwan wafer foundry industry expected to go up 18% sequentially in 2H24, says DIGITIMES Research
Boosted by short-term orders in the electronics supply chain and shipments of AI and high-performance computing (HPC) chips, Taiwan's wafer foundry industry posted better-than-expected...
Thursday 3 October 2024
Chinese HPC processors struggle to compete as Nvidia maintains edge in local AI market
China's domestically produced HPC processors have advanced; yet, they still struggle to be the preferred option for local cloud and AI companies, according to industry sources.
Tuesday 24 September 2024
TSMC SoIC fab capacity to reportedly boost through to 2026
The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...
Tuesday 10 September 2024
HPC and AI server demand fuels strong growth for connectivity solutions in 2H24
Despite AI servers gaining traction among component suppliers and system assemblers, traditional high-performance computing (HPC) applications continue to be in high demand, according...
Thursday 5 September 2024
CHPT's AI initiative drives revenue growth and innovation in chip-testing solutions
Chunghwa Precision Test Tech (CHPT), a leading provider of chip testing and wafer probing solutions, expects significant growth in revenue and gross margin in the second half of 2024...
Wednesday 4 September 2024
TSMC, other Taiwan firms form alliance to advance SiPh
Silicon photonics technology has become a focal point for the semiconductor industry amid the push for generative AI and high-performance computing (HPC), and TSMC has taken the lead...
Friday 30 August 2024
Samsung's foundry service growth hinges on AI, HPC, and automotive sectors
As the global semiconductor foundry market shows signs of recovery, Samsung Electronics continues to trail significantly behind sector leader TSMC in market share. Additionally, it...
Wednesday 28 August 2024
Henkel Semiconductor capillary underfill enables complex AI and HPC large body advanced packaging designs
Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research