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AMD to adopt TSMC 3D SoIC tech in gaming notebook processors, say sources

Julian Ho, Taipei; Rodney Chan, DIGITIMES Asia Thursday 3 August 2023 0

AMD plans to incorporate TSMC's 3D SoIC (system on integrated circuits) stacking and chiplet packaging technology into its gaming notebook processors, following the company's implementation of this technology in its high-end AI accelerators and desktop...

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