China firms to invest CNY18 billion to develop 19nm DRAM technology

Josephine Lien, Taipei; Willis Ke, DIGITIMES Asia Tuesday 31 October 2017 0

China-based GigaDevice Semiconductor and Hefei RuiLi Integrated Circuit Manufacture (formerly Hefei ChangXin IC) will team up to develop 19nm DRAM process technology for the production of 12-inch wafers at a total investment of CNY18 billion (US$2.71...

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