The production value of Taiwan's IC testing and packaging industry is expected to grow 5.9% in 2014, higher than the 4.9% growth posted a year earlier, as well as the 4.2% growth projected for the global IC backend industry in 2014, according to Digitimes Research.
The production value generated by Taiwan's IC backend service companies reached US$14.01 billion in 2013 compared to NT$13.36 billion a year earlier, said Digitimes Research. In 2013, the global IC testing and packaging industry grew by 3.5%.
Efforts by Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) to ramp up their bumping, flip chip (FC), wafer-level package (WLP) and SiP packaging capacity have allowed them to cash in on the fast growth of the global smartphone and tablet markets, commented Digitimes Research.
With the global IC inventory having already dropped to an 8-quarter low of US$15.88 billion in the fourth quarter of 2013 and falling further in the first quarter of 2014, major chipset suppliers are likely to begin to replenish their inventories in the second quarter of 2014, which will fuel the growth of Taiwan's IC backend service companies.
Content from this blog post was provided by the Digitimes Research Tracking team, which focuses on shipment data and market trends in the global mobile device supply chain. Digitimes Research provides quarterly tracking services for market sectors such as Global Tablet, China Smartphone, China Smartphone AP, China Touch Panel, Taiwan ICT and Taiwan FPD. Click here for more information about Digitimes Research Tracking services.