Taipei, Wednesday, August 23, 2017 16:32 (GMT+8)
thunderstorms
Taipei
35°C
Thermaltake announces Max4 2.5-inch eSATA and USB combo
Press release, May 3; Eric Mah, DIGITIMES [Thursday 3 May 2007]

Thermaltake recently announced its Max4 2.5-inch eSATA and USB 2.0 interface external enclosure.

The Max4 2.5-inch eSATA and USB 2.0 enclosure fully complies with the eSATA standard capable of delivering up to 3Gb/s of bandwidth for ultra-fast data transfer. Included is a reinforced eSATA cable to further strengthen the unit's ability to guard against EMI (electromagnetic interference) and ESD (electrostatic discharge), noted Thermaltake.

A brushed aluminum body improves thermal dissipation efficiency without the need for additional fans, Thermaltake highlighted, while a proprietary hard drive install and removal mechanism makes it user friendly.

The Max4 2.5-inch eSATA and USB 2.0 enclosure weighs 118g and its compact design allows users to carry it anywhere with ease. An AC Adapter, USB cable, eSATA cable and eSATA PCI adapter bracket all come standard.

The Thermaltake Max4 2.5-inch eSATA & USB combo

The Thermaltake Max4 2.5-inch eSATA and USB2.0 interface external enclosure
Photo: Company

WCIT 2017
Global AP demand forecast, 2017-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.