Taipei, Thursday, April 27, 2017 13:31 (GMT+8)
partly cloudy
Taipei
23°C
Thermaltake announces Max4 2.5-inch eSATA and USB combo
Press release, May 3; Eric Mah, DIGITIMES [Thursday 3 May 2007]

Thermaltake recently announced its Max4 2.5-inch eSATA and USB 2.0 interface external enclosure.

The Max4 2.5-inch eSATA and USB 2.0 enclosure fully complies with the eSATA standard capable of delivering up to 3Gb/s of bandwidth for ultra-fast data transfer. Included is a reinforced eSATA cable to further strengthen the unit's ability to guard against EMI (electromagnetic interference) and ESD (electrostatic discharge), noted Thermaltake.

A brushed aluminum body improves thermal dissipation efficiency without the need for additional fans, Thermaltake highlighted, while a proprietary hard drive install and removal mechanism makes it user friendly.

The Max4 2.5-inch eSATA and USB 2.0 enclosure weighs 118g and its compact design allows users to carry it anywhere with ease. An AC Adapter, USB cable, eSATA cable and eSATA PCI adapter bracket all come standard.

The Thermaltake Max4 2.5-inch eSATA & USB combo

The Thermaltake Max4 2.5-inch eSATA and USB2.0 interface external enclosure
Photo: Company

Realtime news
  • Gintech obtains VPC for high-efficiency PV modules in Taiwan

    Green energy | 1h 16min ago

  • LG Display 1Q17 net operating profit hits record

    Displays | 1h 20min ago

  • Nanya to ramp 20m process output

    Bits + chips | 1h 26min ago

  • Cree to set up LED packaging joint venture with San'an Optoelectronics

    LED | 1h 28min ago

  • SPIL posts profit drop in 1Q17

    Bits + chips | 2h 21min ago

  • UMC expects flat performance in 2Q17

    Bits + chips | 2h 23min ago

  • Asia Tech Image profits soar in 1Q17

    Bits + chips - Newswatch | 2h 52min ago

  • Elan sees earnings improve on year in 1Q17

    Bits + chips - Newswatch | 2h 56min ago

  • SMIC reportedly hires former TSMC R&D exec

    Bits + chips | Apr 26, 22:00

  • Magellan, Samsung America to partner on ELD products

    Before Going to Press | Apr 26, 22:10

  • Vivotek works with partners to integrate H.265 technology into software

    Before Going to Press | Apr 26, 22:08

  • Digitimes Research: LCD monitor shipments see around 6-7% drop in 1Q17; will continue to decline in 2Q17

    Before Going to Press | Apr 26, 21:25

  • Elan sees earnings, EPS improve on year in 1Q17

    Before Going to Press | Apr 26, 21:17

  • Taiwan market: Garmin launches new smart bracelets for sport activities, children

    Before Going to Press | Apr 26, 21:15

  • UMC expects flat performance in 2Q17

    Before Going to Press | Apr 26, 21:07

  • CyberLink nets NT$0.39 per share for 1Q17

    Before Going to Press | Apr 26, 21:02

  • Taiwan market: More China vendors to follow Oppo to expand share in local smartphone market

    Before Going to Press | Apr 26, 21:00

  • UMC to roll out 22nm process in 2018

    Before Going to Press | Apr 26, 20:56

Pause
 | 
View more
China smartphone touch-panel industry 2016 forecast
Global AP demand forecast, 2017-2020
The transition to 4k TV - UHD TV market forecast, 2014-2017
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.