Sematech has announced the completion of its 300mm 3D IC pilot line. Operating at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex, the pilot line includes all processes and test vehicles necessary to demonstrate the viability of the via-mid technology in conjunction with advanced CMOS.

STATS ChipPAC also indicated it is actively developing next-generation eWLB technology to enable larger package sizes, higher I/O density and 3D PoP solutions to address a wider application market.