JEDEC Solid State Technology Association has announced a broad spectrum of ongoing standards development work related to 3D-ICs.

Hynix Semiconductor will collaborate with engineers in Sematech's 3D Interconnect program at CNSE's Albany NanoTech Complex to address industry infrastructure and technology gaps in materials, equipment, integration and product-related issues for high-volume adoption of through-silicon-vias (TSV).

Nintendo warned that young children shouldn't play three-dimensional games on a hotly anticipated new game device, citing possible health risks and raising concerns about a technology that many hoped would boost the appeal of 3-D entertainment in the home.

Imagination will pay US$27 million cash for Caustic Graphics. The deal comes less than a month after the chip designer agreed a deal to buy US-based HelloSoft for up to US$47m to assist its push into video and voice-over Internet protocol products and expand its WiFi offering.

3D smartphones will soon be a reality--if you live in Japan, that is. Two upcoming Sharp smartphones will offer a 3D-capable display.

Canesta makes chips that, when coupled with a digital camera, give all manner of devices a sense of depth perception for the world around them, letting them "see" in three dimensions.

"New Product sales were led by particularly strong growth from the Virtex-6 and Spartan-6 FPGA families," said Moshe Gavrielov, Xilinx President and CEO. "Combined sales from these families more than doubled sequentially in the September quarter..."