- 18 Mar 2011:
- 16 Mar 2011:Rambus has renewed its patent license agreement with Toshiba. This five year agreement covers Toshiba's products with DRAM memory controllers for SDR, DDR, DDR2, DDR3, and other DRAM devices. Rambus will receive royalty payments based on the shipment of these memory controllers.
- 15 Mar 2011:
- Toshiba to scale back activities, cut power consumption in response to earthquake (Mar 14) - Company releaseToshiba said it will cooperate with Tokyo Electric Power Company's (TEPCO) request to cut electricity consumption by operating only those of its businesses related to provision of essential services required for social and economic activities.
- 13 Mar 2011:Apple's next-generation iPad contains chips made by Toshiba, Broadcom and Texas Instruments, according to an initial tear-down report by gadget-repair site iFixit. Toshiba supplied the device's storage chips, iFixit said, while Broadcom made the chips used for wireless Internet access. TI chips were used to control the iPad's touchscreen.
- 12 Mar 2011:The two Toshiba-SanDisk JV semiconductor manufacturing plants, Fab 3 and Fab 4, were down for a short period of time due to the earthquake and were back up and operational as of Friday morning, Pacific Time. SanDisk's current assessment is that there has been minimal immediate impact on wafer output due to the earthquake.
- Japan's biggest-ever earthquake halted production briefly at Toshiba's chip plants on Friday and could delay crucial shipments. Toshiba and SanDisk share cutting-edge facilities in Yokkaichi, where they make NAND chips increasingly in demand by Apple and other mobile device makers.
- 4 Mar 2011:
- 23 Feb 2011:Toshiba has developed a new flip-flop circuit using 40nm CMOS process that the company claims will reduce power consumption in mobile equipment. Measured data verifies that the power dissipation of the new flip-flop is up to 77% less than that of a conventional flip-flop and that it achieves a 24% reduction in total power consumption when applied to a wireless LAN chip.
- 11 Feb 2011:
- 3 Feb 2011:The profit gain was largely due to "a significantly improved performance in electronic devices, driven mainly by the return to profit of the LCD business and demand expansion in NAND flash memories," Toshiba said in a statement.
- 25 Jan 2011:Toshiba is hammering out a deal to outsource fabrication of advanced system chips to Globalfoundries, the Nikkei business daily reported, citing company sources.
- 14 Jan 2011:
- 5 Jan 2011:"It'll come out in the spring of 2011 and the price, we haven't decided yet," said Chris Casper, a group manager at Toshiba's digital products division.
- 29 Dec 2010:Toshiba announced it has acquired Fujitsu's shareholding in Toshiba Storage Device and turned the JV its wholly-owned subsidiary. Toshiba and Fujitsu merged their HDD businesses in October 2009.
- 27 Dec 2010:Sony has announced plans to invest approximately 100 billion yen (US$1.2 billion) over the fiscal year ending March 31, 2012, to double its production capacity for CCD and CMOS image sensors. The investment plan includes the transfer of a plant from Toshiba.
- 26 Dec 2010:As part of the strategy for transforming the system LSI business and securing an asset light business model, Toshiba has signed a MoU with Sony, expressing the intent to dissolve Nagasaki Semiconductor Manufacturing (NSM) and to transfer 300mm wafer fabrication lines there from Toshiba to Sony.
- 24 Dec 2010:
- Toshiba will outsource fabrication of system chips to South Korea's Samsung Electronics, freeing up resources for its memory chip operations, the Nikkei business daily has reported.
- 23 Dec 2010:Sony plans to buy back a Nagasaki semiconductor plant from Toshiba for about 50 billion yen (US$597.2 million) to double output capacity for image sensors used in smartphones and other devices, the Nikkei business daily reported recently.
- 22 Dec 2010:The upgrade reflects improving 2011 prospects for NAND flash memory demand, driven by tablets, smartphones and solid-state drives. The improving demand picture offsets concerns about higher supply due to new NAND fabs from Samsung, Toshiba and Micron expanding production in 2011.
- 17 Dec 2010:
- 16 Dec 2010:
- 14 Dec 2010:Toshiba will spend about US$1.19 billion to build a new fabrication plant to produce the panels for Apple.
- 9 Dec 2010:Toshiba's shipments of NAND flash memory chips may fall as much as 20% in January and February because of a power outage at a plant, the company said.
- 7 Dec 2010:
- 18 Nov 2010:Toshiba will shut its No.2 plant in Yokkaichi, central Japan, by the end of December and phase out low-end chips used in products such as memory sticks. The company will also farm out production of so-called logic chips next year to cut costs at a business that's "barely breaking even."
- 2 Nov 2010:Intel, Toshiba and Samsung Electronics will join hands to develop technologies that could more than halve semiconductor line widths to nearly 10 nanometers by 2016, the Nikkei daily reported.
- 26 Oct 2010:Toshiba made 48% of its products in Japan in the period from April to September 2009 and bought 45% of its components from Japan-based suppliers. By the same period this year, the ratios were down to 44% and 42%, respectively. The change added 4.2 billion yen to Toshiba's operating profits in the half to September, or 700 million yen for each one-yen increase in the Japanese currency's value against the dollar.
- 22 Oct 2010:
- Rambus saw its results improve in the third quarter of 2010 thanks to a licensing deal signed earlier this year with former legal opponent Samsung Electronics. It is negotiating to renew deals with Toshiba and Renesas Electronics after their patent licenses expired.
- 20 Oct 2010:Toshiba's operating profits for the April-September period is set to come to more than 100 billion yen (US$1.2 billion), beating the company's forecast of 70 billion yen, according to the Nikkei business daily. Booming global sales of smartphones have boosted demand for the company's flash memory chips and small LCD panels.
- 6 Oct 2010:
- 1 Oct 2010:Toshiba plans to scrap plans to mass-produce OLED panels at its unit Toshiba Mobile Display and focus on high-demand LCD panels instead.
- 16 Sep 2010:
- 7 Sep 2010:
- 3 Sep 2010:
- 30 Aug 2010:
- 25 Aug 2010:
- GIGABYTE is the exclusive motherboard sponsor of IEM
- Indium Corporation features NC-SMQ75 die-attach solder paste at Productronica China
- Advantest opens registration for VOICE 2015 developer conference May 12-14
- G.SKILL releases the fastest DDR4-3400MHz memory kit
- Toes Opto-Mechatronics launches flexible thin-film battery, seizing smart wearable application opportunities
- AccuTouch Five Wire Resistive Touchscreens
- Getting the Most Out Of Your Next Generation Digital Security Surveillance System
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Digitimes Research: Windows 10 unlikely to bring dramatic changes to mobile device market in 2015
- Digitimes Research: China smartphone industry to report shipment growth of 8.6% for 4Q14
- Digitimes Research: Qualcomm Snapdragon 810 ships as scheduled for Xiaomi and LG product launches
- Digitimes Research: TSMC SSL merger to enhance Epistar in the LED market
- Digitimes Research: Ultra HD BD players not likely to be available until end of 2015
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