- 25 Jun 2013:The China-based company already has a manufacturing base in Sorocaba (92km from São Paulo city) which produces telecommunications equipment and employs about 3,000 staff.
- 21 Jun 2013:The manufacturing and export sectors play a huge part in driving growth in China.
- 19 Jun 2013:Both Toshiba and Taiwan Semiconductor Manufacturing Company (TSMC) have developed mask read-only memories (MROMs) that can offer greater data density by storing multiple bits per cell.
- 6 Jun 2013:With the return of PC manufacturing to the US, the company is adding 115 new manufacturing jobs in North Carolina and is on track to fully ramp up production by the end of June.
- 21 May 2013:RFMD will phase out manufacturing in its UK-based GaAs pHEMT facility and transition most GaAs manufacturing to its GaAs HBT manufacturing facility in Greensboro, NC. RFMD will also partner with leading GaAs HBT foundries for additional capacity.
- 3 May 2013:Intel hasn't signaled a change in strategy with the appointment of Brian Krzanich to CEO, but it is likely that the company will take steps to outrun its foundry competition by opening its industry-leading manufacturing facilities to more third parties.
- 26 Mar 2013:Semiconductor Manufacturing International (SMIC), for the first time in a long time, has a good story to tell.
- 22 Mar 2013:Manufacturing activity in China picked up speed in March, an initial HSBC survey has indicated, adding to hopes of a sustained recovery in its economy.
- 26 Feb 2013:Growth in the giant China manufacturing sector in February withdrew from the highest point in nearly two years despite a fourth consecutive month of expansion, a private survey showed Monday, as foreign demand remained unsteady.
- 4 Feb 2013:The contraction of manufacturing across the eurozone slowed in January amid signs that the worst may be over, according to a survey.
- 28 Jan 2013:Samsung plans to invest US$1.7 billion in expanding and fitting out its operations in Kunshan, a fast-growing manufacturing hub west of Shanghai, the Xinhua news agency said on Sunday.
- 22 Jan 2013:Intel has presented Professor Stephen Hawking with a birthday gift, a 300mm wafer with the message "Happy Birthday Stephen Hawking" inscribed hundreds of times in copper letters defined using Intel's 32nm manufacturing procress.
- 28 Dec 2012:Some local residents and council representatives showed up December 26 at a meeting to protest against Taiwan Semiconductor Manufacturing Co.'s plan to build its first 450mm wafer fab plant at the Central Taiwan Science Park.
- 25 Dec 2012:Processors, memory, manufacturing processes, chip architecture, EDA, MEMS, RF, touch screens, servers and the Internet of Things are markets where startups can still make a difference.
- Albany area only logical place for TSMC to locate plant? One analyst says so (December 24) - Bizjournals.comIf Taiwan Semiconductor Manufacturing Co. is planning on building a chip plant in the United States, the only place that would make sense is Malta, New York, an analyst said.
- 13 Dec 2012:Flextronics, Motorola Mobility partner to streamline supply chain operations (December 10) - Company releaseFlextronics and Motorola Mobility have signed a definitive agreement, under which Flextronics will acquire Motorola's manufacturing operations in Tianjin, China, and will also assume the management and operation of its Jaguariuna, Brazil, facility.
- 7 Dec 2012:Qualcomm has said that a shortage of its advanced smartphone processors is almost resolved as manufacturing partners including Samsung Electronics boosted production.
- 3 Dec 2012:OmniVision Technologies' fiscal second-quarter profit dropped 50% as high manufacturing costs pressured the chip maker's margins, masking a jump in revenue.
- 27 Nov 2012:Evidence is starting to mount that foundry chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) could be about to follow Globalfoundries in building a wafer fab in up-state New York.
- 12 Nov 2012:Samsung has made no secret of the fact that it provides a number of the key components inside Apple's flagship iPhone and iPad devices, even while actively competing against them with its own Galaxy line of Android competitors. A major change in that relationship has now been reported out of Korea, however, where the Chosun Ilbo says Samsung has increased the price of manufacturing Apple's application processor by nearly 20%.
- 2 Nov 2012:Abu Dhabi's Advanced Technology Investment (ATIC) expects to earn its first profit by 2015 as it scales up operations overseas, but plans to set up a chip manufacturing facility at home remain on hold, its chief executive said on Wednesday.
- 26 Oct 2012:KLA-Tencor posted fiscal first-quarter revenue below expectations and said current-quarter revenue would fall more as chipmakers, worried about the economy, hold off on new orders of manufacturing equipment.
- 8 Oct 2012:2012 EUVL Symposium sees steady progress towards EUVL introduction in high-volume manufacturing (October 5) - Company releaseAt the 2012 International Symposium on Extreme Ultraviolet Lithography, industry and research experts named the timely development of a source suited for high-volume manufacturing as the most critical issue. Other challenges remain the development of yielding masks and the further development of high-quality EUV resists.
- 4 Oct 2012:Taiwan Semiconductor Manufacturing Company's (TSMC) share in the 28nm contract chipmaking sector may drop from 80% to 50% next year on fierce competition from Samsung, according to research firm Topology.
- 2 Oct 2012:A HP executive recently said that the company has decided to postpone manufacturing commercial memristor-based ReRAM products until late 2013. The company originally planned to go into production during 2Q/3Q 2013.
- 24 Sep 2012:Semiconductor Manufacturing International (SMIC) has announced the availability of its 1.2-volt low-power embedded EEPROM platform, which is fully compatible with its 0.13-micron low-leakage (LL) process.
- 4 Sep 2012:Fujitsu Semiconductor to transfer ownership of LSI assembly and test facilities to J-Devices (August 31) - Company releaseThe objective of the agreement is for Fujitsu Semiconductor and J-Devices to build a long-term, mutually beneficial strategic partnership in the semiconductor manufacturing business.
- 3 Sep 2012:Manufacturing output across the 17-country eurozone shrank again in August, according to a widely-watched survey.
- 29 Aug 2012:Apple and Qualcomm were rebuffed in separate attempts to invest cash with Taiwan Semiconductor Manufacturing Co. in a bid to secure exclusive access to smartphone chips, people with knowledge of the matter said.
- 8 Aug 2012:The Nikkei Shimbun, Japan's economic newspaper, reported that Nikon is going to work with Intel to develop the next generation semiconductor manufacturing equipment capable of handling 450mm wafers.
- 24 Jul 2012:Taiwan Semiconductor Manufacturing (TSMC) was the world's largest pure play foundry for MEMS devices in 2011, posting a phenomenal 201% increase in revenue as it gained share from rivals and capitalized on new income streams.
- 11 Jul 2012:ASML is negotiating with Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) over taking up to a 10% stake in the company under its equity-plus-research program.
- 29 Jun 2012:Qualcomm CEO Paul Jacobs, girding against a shortage of chips, said he wouldn't rule out owning a manufacturing plant or tapping the company's cash pile to ensure access to needed parts. Qualcomm is weighing different business arrangements with its suppliers and would consider "writing big checks," said Jacobs.
- 20 Jun 2012:Renesas Electronics said its alliance with Taiwan Semiconductor Manufacturing Company (TSMC) will help boost market share and operating margin.
- 19 Jun 2012:Celestica announced that over the course of the next three to six months, it will wind down its manufacturing services for Research in Motion (RIM). Celestica has been a high-performing manufacturing supplier for RIM.
- This achievement was driven by STATS ChipPAC's proven high volume manufacturing capabilities combined with the company's engineering focus on copper wire technology development for a broad range of advanced, multi-die laminate and leaded packages including three dimensional (3D) packaging.
- 4 Jun 2012:ARM chips made with an advanced, 20-nanometer manufacturing process could appear in smartphones and tablets by as soon as the end of next year, the head of ARM's processor division said Monday.
- 1 Jun 2012:Mentor Graphics has announced TSMC will use the Calibre SmartFill solution to achieve TSMC's fill requirements for its 20nm manufacturing processes.
- 15 May 2012:Black Sand Technologies has been selected to provide silicon PA technology for integrated RF front end products by Murata Manufacturing. The products will be used to increase integration and improve the performance of 3G smartphones, tablets and datacards.
- 11 May 2012:President Obama's visit will highlight the historic public and private investments in new advanced manufacturing, R&D, and education facilities helping to revitalize upstate New York and strategically position the US in the global economy.
- Elo expands projective capacitive touchscreen line
- GSMA announces further details for Mobile World Congress Shanghai 2016
- With a decade of achievements, AVEXIR Technologies establishes itself as gamers' favorite
- KMF protection class II: Compact power entry module for protection class II equipment
- Prize-winning design quality: Raiden series triumphs in Red Dot Award: Product Design 2016
- Unisys IT Implementation of Unisys Stealth Solution for Data Center Segmentation
- AccuTouch Five Wire Resistive Touchscreens
- Getting the Most Out Of Your Next Generation Digital Security Surveillance System
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Perforce Software Wins Develop Industry Excellence Award for the Second Year in a Row
- Perforce Teams with Leading Git Client Developer fournova
- Perforce Introduces Helix GitSwarm: Flexible Git Ecosystem Mirrored to a Powerful Mainline Repository
- Perforce Helix Distributed Version Control System Brings Greater Flexibility While Maintaining Enterprise-class Security, Auditability and Control
- Perforce Powers Development of Legacy Quest for iOS and Android
- Digitimes Research: 4 million 9.7-inch iPad Pros to ship in 1H16
- Digitimes Research: Global all-in-one PC shipments to drop 3.9% on year in 2015
- Mentor Graphics Veloce VirtuaLAB adds protocols for networking designs
- Mouser Electronics undergoing expansion
- Digitimes Research: iPad Pro shipments to be less than 3 million units in 4Q15
Dassault Systemes, a European multinational software company that develops 3D design, 3D engineering,...
Nvidia CEO Jen-Hsun Huang has been outspoken with his predictions about future technologies and products,...
During a Digitimes interview, Global Sales and Operations senior vice president B.S. Teh for Seagate...
At this point most consumers are not that familiar with the USB Type C specification but it has the...
- Smartphone and tablet industry: The view from Taiwan - May 2012
Taiwan-based companies have a long and successful history of involvement in the supply chain for mobile devices, which for the purposes of this article consist...
- Taiwan motherboard industry overview - May 2012
The year 2011 saw the motherboard industry reverse its trend of declining shipments year-on-year, to post a slight 0.2% growth. This upturn in fortunes was expected...
- Notebook market overview - Jun 2011
The notebook industry in 2010 experienced several major events that significantly changed the industry's ecosystem for the year and the industry is also believed...
- LCD TV overview - Jun 2011
Growth of the global LCD TV market was not as strong as expected in 2010 as the market continued to feel the aftershocks of the economic recession that had hit...