- 2 Oct 2012:A HP executive recently said that the company has decided to postpone manufacturing commercial memristor-based ReRAM products until late 2013. The company originally planned to go into production during 2Q/3Q 2013.
- 24 Sep 2012:Semiconductor Manufacturing International (SMIC) has announced the availability of its 1.2-volt low-power embedded EEPROM platform, which is fully compatible with its 0.13-micron low-leakage (LL) process.
- 4 Sep 2012:Fujitsu Semiconductor to transfer ownership of LSI assembly and test facilities to J-Devices (August 31) - Company releaseThe objective of the agreement is for Fujitsu Semiconductor and J-Devices to build a long-term, mutually beneficial strategic partnership in the semiconductor manufacturing business.
- 3 Sep 2012:Manufacturing output across the 17-country eurozone shrank again in August, according to a widely-watched survey.
- 29 Aug 2012:Apple and Qualcomm were rebuffed in separate attempts to invest cash with Taiwan Semiconductor Manufacturing Co. in a bid to secure exclusive access to smartphone chips, people with knowledge of the matter said.
- 8 Aug 2012:The Nikkei Shimbun, Japan's economic newspaper, reported that Nikon is going to work with Intel to develop the next generation semiconductor manufacturing equipment capable of handling 450mm wafers.
- 24 Jul 2012:Taiwan Semiconductor Manufacturing (TSMC) was the world's largest pure play foundry for MEMS devices in 2011, posting a phenomenal 201% increase in revenue as it gained share from rivals and capitalized on new income streams.
- 11 Jul 2012:ASML is negotiating with Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) over taking up to a 10% stake in the company under its equity-plus-research program.
- 29 Jun 2012:Qualcomm CEO Paul Jacobs, girding against a shortage of chips, said he wouldn't rule out owning a manufacturing plant or tapping the company's cash pile to ensure access to needed parts. Qualcomm is weighing different business arrangements with its suppliers and would consider "writing big checks," said Jacobs.
- 20 Jun 2012:Renesas Electronics said its alliance with Taiwan Semiconductor Manufacturing Company (TSMC) will help boost market share and operating margin.
- 19 Jun 2012:Celestica announced that over the course of the next three to six months, it will wind down its manufacturing services for Research in Motion (RIM). Celestica has been a high-performing manufacturing supplier for RIM.
- This achievement was driven by STATS ChipPAC's proven high volume manufacturing capabilities combined with the company's engineering focus on copper wire technology development for a broad range of advanced, multi-die laminate and leaded packages including three dimensional (3D) packaging.
- 4 Jun 2012:ARM chips made with an advanced, 20-nanometer manufacturing process could appear in smartphones and tablets by as soon as the end of next year, the head of ARM's processor division said Monday.
- 1 Jun 2012:Mentor Graphics has announced TSMC will use the Calibre SmartFill solution to achieve TSMC's fill requirements for its 20nm manufacturing processes.
- 15 May 2012:Black Sand Technologies has been selected to provide silicon PA technology for integrated RF front end products by Murata Manufacturing. The products will be used to increase integration and improve the performance of 3G smartphones, tablets and datacards.
- 11 May 2012:President Obama's visit will highlight the historic public and private investments in new advanced manufacturing, R&D, and education facilities helping to revitalize upstate New York and strategically position the US in the global economy.
- 3 May 2012:Toshiba has announced that it will rebuild its semiconductor manufacturing operations in Thailand by relocating Toshiba Semiconductor Thailand to a new manufacturing facility.
- China's Hony Capital plans to sell or outsource the operations at Elpida Memory's Hiroshima DRAM plant to Semiconductor Manufacturing International Corp (SMIC) if its bid for the bankrupt Japanese chipmaker is successful, the Nikkei business daily said on Tuesday.
- 18 Apr 2012:Taiwan Semiconductor Manufacturing Company (TSMC) will offer only one process at the 20nm node, a change from the multiple processes that the foundry giant has offered customers for the past several nodes, said Shang-yi Chiang, company executive VP and co-COO.
- 17 Apr 2012:Barclays Capital is raising its total lithography units forecast by more than 10 systems, from 234 to 251 in 2012. As many as 260 litho tools could be purchased for semiconductor manufacturing, as foundries are seeing high demand for 28nm chips.
- 10 Apr 2012:Taiwan Semiconductor Manufacturing Company (TSMC) has unveiled a new plant in the mountains of central Taiwan - not to make computer chips, but tea.
- 3 Apr 2012:Barclays Capital finds that light-emitting diode (LED) manufacturing and materials patents will soon run out, potentially draining value from material/chip/package suppliers and turning LEDs into commodities.
- 28 Mar 2012:What's surprising are Nvidia's remarks concerning TSMC's current cost curves and manufacturing ramps. This is normally the sort of information discussed quietly between a foundry and its customers or by the press with help from various anonymous sources. Discussing the problems publicly is a sign of just how frustrated the company has become.
- 24 Mar 2012:Globalfoundres announced that its Fab 1 in Dresden, Germany has shipped a quarter of a million semiconductor wafers based on 32nm High-k Metal Gate (HKMG) technology. The milestone represents a significant lead over other foundries in HKMG manufacturing, it claimed.
- 15 Mar 2012:It seems as if Nvidia is having difficulty manufacturing its upcoming Kepler GPU lineup due to a supply shortage at TSMC that has been linked to internal (TSMC) 28nm issues.
- 8 Mar 2012:Rumors surfaced online today that claim TSMC has pulled the plug on their 28nm manufacturing lines and that the company started to test and tune the machines to improve yields.
- 7 Mar 2012:
- 1 Mar 2012:SMIC, Brite Semiconductor tape out low leakage 40nm test chip on dual-core ARM Cortex-A9 processor (February 27) - Company releaseBrite Semiconductor, Semiconductor Manufacturing International (SMIC) and ARM have jointly announced the first tape out of a dual-core ARM Cortex-A9 MPCore test chip using SMIC's 40nm low leakage process technology.
- 24 Feb 2012:
- 9 Feb 2012:Nokia will cut about 4,000 jobs at its smartphone manufacturing bases in Europe and the Americas after announcing plans to shift production to Asia.
- 7 Feb 2012:Sean Chen, the new premier, said on Monday that Taiwan needed to move beyond export manufacturing to design, research and development - products should not only be made in Taiwan, but also designed by Taiwan.
- Taiwan Semiconductor Manufacturing Co. plans to announce 3D IC assembly service as a general offering at the beginning of 2013, according to Maria Marced, president of TSMC Europe.
- 6 Feb 2012:Advanced Micro Devices has disclosed at an analyst event that it had begun manufacturing of its chips at IBM's facilities. The partnership is believed to ensure AMD's ability to supply its next-generation A-series Fusion chips code-named "Trinity" to PC makers and be in position to compete against Intel's Core i-series future products.
- 30 Jan 2012:Foundry Taiwan Semiconductor Manufacturing Co. has hit back at analysts who have said it has yield problems with its 28nm CMOS manufacturing processes.
- 6 Jan 2012:After several years of rapid capacity expansion driven by high-brightness LED used in TV backlighting applications, a 40% decline in world metal organic chemical vapor deposition (MOCVD) purchases in 2012 will reduce overall LED equipment spending for the first time in over five years.
- 29 Dec 2011:US Congressman to discuss possible investment plan with TSMC (December 28) - Central News Agency (CNA)US Congressman Bill Owens will arrive in Taipei Wednesday to visit Taiwan Semiconductor Manufacturing Company (TSMC) to discuss a possible investment plan, according to the Ministry of Foreign Affairs (MOFA).
- 6 Dec 2011:ASM International (ASMI) has announced the successful demonstration of a new 14nm high-k gate dielectric process that achieved less than six angstroms equivalent oxide thickness (EOT) at a customer's 14nm R&D line, an improvement of about 40% from the current advanced nodes.
- 24 Nov 2011:Microprocessor vendor Advanced Micro Devices has decided to cancel APUs that Globalfoundries was set to make for it on 28nm process technology, according to online reports. Instead AMD will start afresh using the 28nm gate-last HKMG manufacturing process technology from alternative foundry TSMC, the reports said.
- 23 Nov 2011:China's manufacturing activity dropped to a 32-month low in November, renewing fears the Asian powerhouse is losing steam amid global economic woes.
- 11 Nov 2011:Maria Marced, European president of TSMC, has pushed back against claims by market researchers at Gartner that foundries are having problems with yield on 28nm process technologies. For TSMC the roll out of the 28nm chip manufacturing node is "on plan," Marced told EE Times.
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