- 26 Feb 2013:Growth in the giant China manufacturing sector in February withdrew from the highest point in nearly two years despite a fourth consecutive month of expansion, a private survey showed Monday, as foreign demand remained unsteady.
- 4 Feb 2013:The contraction of manufacturing across the eurozone slowed in January amid signs that the worst may be over, according to a survey.
- 28 Jan 2013:Samsung plans to invest US$1.7 billion in expanding and fitting out its operations in Kunshan, a fast-growing manufacturing hub west of Shanghai, the Xinhua news agency said on Sunday.
- 22 Jan 2013:Intel has presented Professor Stephen Hawking with a birthday gift, a 300mm wafer with the message "Happy Birthday Stephen Hawking" inscribed hundreds of times in copper letters defined using Intel's 32nm manufacturing procress.
- 28 Dec 2012:Some local residents and council representatives showed up December 26 at a meeting to protest against Taiwan Semiconductor Manufacturing Co.'s plan to build its first 450mm wafer fab plant at the Central Taiwan Science Park.
- 25 Dec 2012:Processors, memory, manufacturing processes, chip architecture, EDA, MEMS, RF, touch screens, servers and the Internet of Things are markets where startups can still make a difference.
- Albany area only logical place for TSMC to locate plant? One analyst says so (December 24) - Bizjournals.comIf Taiwan Semiconductor Manufacturing Co. is planning on building a chip plant in the United States, the only place that would make sense is Malta, New York, an analyst said.
- 13 Dec 2012:Flextronics, Motorola Mobility partner to streamline supply chain operations (December 10) - Company releaseFlextronics and Motorola Mobility have signed a definitive agreement, under which Flextronics will acquire Motorola's manufacturing operations in Tianjin, China, and will also assume the management and operation of its Jaguariuna, Brazil, facility.
- 7 Dec 2012:Qualcomm has said that a shortage of its advanced smartphone processors is almost resolved as manufacturing partners including Samsung Electronics boosted production.
- 3 Dec 2012:OmniVision Technologies' fiscal second-quarter profit dropped 50% as high manufacturing costs pressured the chip maker's margins, masking a jump in revenue.
- 27 Nov 2012:Evidence is starting to mount that foundry chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) could be about to follow Globalfoundries in building a wafer fab in up-state New York.
- 12 Nov 2012:Samsung has made no secret of the fact that it provides a number of the key components inside Apple's flagship iPhone and iPad devices, even while actively competing against them with its own Galaxy line of Android competitors. A major change in that relationship has now been reported out of Korea, however, where the Chosun Ilbo says Samsung has increased the price of manufacturing Apple's application processor by nearly 20%.
- 2 Nov 2012:Abu Dhabi's Advanced Technology Investment (ATIC) expects to earn its first profit by 2015 as it scales up operations overseas, but plans to set up a chip manufacturing facility at home remain on hold, its chief executive said on Wednesday.
- 26 Oct 2012:KLA-Tencor posted fiscal first-quarter revenue below expectations and said current-quarter revenue would fall more as chipmakers, worried about the economy, hold off on new orders of manufacturing equipment.
- 8 Oct 2012:2012 EUVL Symposium sees steady progress towards EUVL introduction in high-volume manufacturing (October 5) - Company releaseAt the 2012 International Symposium on Extreme Ultraviolet Lithography, industry and research experts named the timely development of a source suited for high-volume manufacturing as the most critical issue. Other challenges remain the development of yielding masks and the further development of high-quality EUV resists.
- 4 Oct 2012:Taiwan Semiconductor Manufacturing Company's (TSMC) share in the 28nm contract chipmaking sector may drop from 80% to 50% next year on fierce competition from Samsung, according to research firm Topology.
- 2 Oct 2012:A HP executive recently said that the company has decided to postpone manufacturing commercial memristor-based ReRAM products until late 2013. The company originally planned to go into production during 2Q/3Q 2013.
- 24 Sep 2012:Semiconductor Manufacturing International (SMIC) has announced the availability of its 1.2-volt low-power embedded EEPROM platform, which is fully compatible with its 0.13-micron low-leakage (LL) process.
- 4 Sep 2012:Fujitsu Semiconductor to transfer ownership of LSI assembly and test facilities to J-Devices (August 31) - Company releaseThe objective of the agreement is for Fujitsu Semiconductor and J-Devices to build a long-term, mutually beneficial strategic partnership in the semiconductor manufacturing business.
- 3 Sep 2012:Manufacturing output across the 17-country eurozone shrank again in August, according to a widely-watched survey.
- 29 Aug 2012:Apple and Qualcomm were rebuffed in separate attempts to invest cash with Taiwan Semiconductor Manufacturing Co. in a bid to secure exclusive access to smartphone chips, people with knowledge of the matter said.
- 8 Aug 2012:The Nikkei Shimbun, Japan's economic newspaper, reported that Nikon is going to work with Intel to develop the next generation semiconductor manufacturing equipment capable of handling 450mm wafers.
- 24 Jul 2012:Taiwan Semiconductor Manufacturing (TSMC) was the world's largest pure play foundry for MEMS devices in 2011, posting a phenomenal 201% increase in revenue as it gained share from rivals and capitalized on new income streams.
- 11 Jul 2012:ASML is negotiating with Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) over taking up to a 10% stake in the company under its equity-plus-research program.
- 29 Jun 2012:Qualcomm CEO Paul Jacobs, girding against a shortage of chips, said he wouldn't rule out owning a manufacturing plant or tapping the company's cash pile to ensure access to needed parts. Qualcomm is weighing different business arrangements with its suppliers and would consider "writing big checks," said Jacobs.
- 20 Jun 2012:Renesas Electronics said its alliance with Taiwan Semiconductor Manufacturing Company (TSMC) will help boost market share and operating margin.
- 19 Jun 2012:Celestica announced that over the course of the next three to six months, it will wind down its manufacturing services for Research in Motion (RIM). Celestica has been a high-performing manufacturing supplier for RIM.
- This achievement was driven by STATS ChipPAC's proven high volume manufacturing capabilities combined with the company's engineering focus on copper wire technology development for a broad range of advanced, multi-die laminate and leaded packages including three dimensional (3D) packaging.
- 4 Jun 2012:ARM chips made with an advanced, 20-nanometer manufacturing process could appear in smartphones and tablets by as soon as the end of next year, the head of ARM's processor division said Monday.
- 1 Jun 2012:Mentor Graphics has announced TSMC will use the Calibre SmartFill solution to achieve TSMC's fill requirements for its 20nm manufacturing processes.
- 15 May 2012:Black Sand Technologies has been selected to provide silicon PA technology for integrated RF front end products by Murata Manufacturing. The products will be used to increase integration and improve the performance of 3G smartphones, tablets and datacards.
- 11 May 2012:President Obama's visit will highlight the historic public and private investments in new advanced manufacturing, R&D, and education facilities helping to revitalize upstate New York and strategically position the US in the global economy.
- 3 May 2012:Toshiba has announced that it will rebuild its semiconductor manufacturing operations in Thailand by relocating Toshiba Semiconductor Thailand to a new manufacturing facility.
- China's Hony Capital plans to sell or outsource the operations at Elpida Memory's Hiroshima DRAM plant to Semiconductor Manufacturing International Corp (SMIC) if its bid for the bankrupt Japanese chipmaker is successful, the Nikkei business daily said on Tuesday.
- 18 Apr 2012:Taiwan Semiconductor Manufacturing Company (TSMC) will offer only one process at the 20nm node, a change from the multiple processes that the foundry giant has offered customers for the past several nodes, said Shang-yi Chiang, company executive VP and co-COO.
- 17 Apr 2012:Barclays Capital is raising its total lithography units forecast by more than 10 systems, from 234 to 251 in 2012. As many as 260 litho tools could be purchased for semiconductor manufacturing, as foundries are seeing high demand for 28nm chips.
- 10 Apr 2012:Taiwan Semiconductor Manufacturing Company (TSMC) has unveiled a new plant in the mountains of central Taiwan - not to make computer chips, but tea.
- 3 Apr 2012:Barclays Capital finds that light-emitting diode (LED) manufacturing and materials patents will soon run out, potentially draining value from material/chip/package suppliers and turning LEDs into commodities.
- 28 Mar 2012:What's surprising are Nvidia's remarks concerning TSMC's current cost curves and manufacturing ramps. This is normally the sort of information discussed quietly between a foundry and its customers or by the press with help from various anonymous sources. Discussing the problems publicly is a sign of just how frustrated the company has become.
- 24 Mar 2012:Globalfoundres announced that its Fab 1 in Dresden, Germany has shipped a quarter of a million semiconductor wafers based on 32nm High-k Metal Gate (HKMG) technology. The milestone represents a significant lead over other foundries in HKMG manufacturing, it claimed.
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