- 24 Nov 2011:Microprocessor vendor Advanced Micro Devices has decided to cancel APUs that Globalfoundries was set to make for it on 28nm process technology, according to online reports. Instead AMD will start afresh using the 28nm gate-last HKMG manufacturing process technology from alternative foundry TSMC, the reports said.
- 23 Nov 2011:China's manufacturing activity dropped to a 32-month low in November, renewing fears the Asian powerhouse is losing steam amid global economic woes.
- 11 Nov 2011:Maria Marced, European president of TSMC, has pushed back against claims by market researchers at Gartner that foundries are having problems with yield on 28nm process technologies. For TSMC the roll out of the 28nm chip manufacturing node is "on plan," Marced told EE Times.
- 31 Oct 2011:Spansion plans to consolidate its two test and assembly manufacturing operations which will result in the closing of its Kuala Lumpur facility, according to the company.
- 24 Oct 2011:"TSMC has ceased to participate in the program," said Ebun Caldeira, director of finance and market research at SIA. Caldeira declined to say why TSMC has pulled out. "We do have some efforts underway to get TSMC to rejoin," she said.
- 5 Oct 2011:One reason for the delay in both Q1 and Q2 could have been uncertainty on how to record the loss of manufacturing capacity, and capacity utilization, at Japanese companies affected by the aftermath of the great earthquake and tsunami that struck northern Japan on March 11. This will have had a small but significant effect in the first quarter but is likely to have had a much bigger effect in the second quarter.
- 29 Sep 2011:
- 24 Sep 2011:The latest monthly readings released Thursday on manufacturing in the eurozone, the UK and China all were weaker than they had been, as was a report on the service sector in Europe.
- 8 Sep 2011:A former Taiwan Semiconductor Manufacturing Co. manager who pleaded guilty to being part of an insider-trading scheme involving Primary Global Research deserves a prison term of as long as three years and 10 months, the US said.
- 1 Sep 2011:China's Purchasing Managers Index (PMI) rose to 50.9 in August from 50.7 the previous month, up for the first time in four months.
- 19 Aug 2011:New data on the US economy, including a huge drop in a regional manufacturing survey, has heightened market fears of a new recession.
- 13 Aug 2011:China is putting a competitive squeeze on some of its partners that still use the mainland as a source of low-cost design and manufacturing. Good Will Instrument, a 700-person test and measurement company in Taiwan, is just one of the companies feeling the pinch.
- 18 Jul 2011:TSMC has begun trial manufacturing of next generation chips for Apple's mobile devices, according to a source with knowledge of the matter.
- 16 Jul 2011:David Wang has resigned as CEO of Semiconductor Manufacturing International Corp. (SMIC), according to the China-based foundry, which named Wenyi Zhang chairman of the board of directors and acting CEO.
- 8 Jul 2011:Toshiba has announced that it will establish two new technology development centers for hard disk drives (HDD). The "HDD Advanced Technology Center" will seek to accelerate development of higher density technology and the "HDD Manufacturing Technology Center" will develop enhanced manufacturing capabilities. Both will open on July 16th.
- 30 Jun 2011:Semiconductor Manufacturing International Corp. (SMIC) has announced that its chairman died. But shareholders rejected CEO David Wang's reappointment as a board director, and the company requested its shares be suspended from trading in Hong Kong pending the release of "price- sensitive" information.
- 23 May 2011:Chip manufacturing firm Globalfoundries will begin construction of a new manufacturing plant in Abu Dhabi next year, the majority stakeholder of the company said on Friday.
- 12 May 2011:Manosha Karunatilaka, a former account manager at Taiwan Semiconductor Manufacturing (TSMC), pleaded guilty to charges that he participated in an insider trading scheme tied to Primary Global Research, an expert network firm.
- 2 May 2011:China economic growth may moderate as manufacturing index slips (May 1) - Bloomberg (via Businessweek)A Chinese manufacturing index declined in April from March, indicating that growth may moderate in the world's second-biggest economy after the government raised interest rates and allowed faster gains in the yuan.
- 28 Apr 2011:
- 15 Apr 2011:Apple will start selling a white version of its iPhone 4 in the next few weeks, following a 10-month delay, three people with knowledge of the plans said. The release was stalled as Apple resolved manufacturing challenges including paint that peeled under heat.
- 14 Apr 2011:Ford is to cut its workforce in Victoria by 240 after a slump in demand for larger cars, and competitor Toyota will reduce hours for manufacturing staff in the wake of the Japanese earthquake disaster.
- 13 Apr 2011:Last fall, industry analysts predicted there would be an oversupply of manufacturing capacity due to a market correction following the strong revenue posted in 2010, but following the earthquake, tsunami, and now nuclear crisis in Japan, the landscape looks different.
- 12 Apr 2011:Chinese silicon wafer producer Jiangsu Huantai, a joint venture partner of MEMC Electronic Materials, aims to go public in 2012, according to company chairman Wang Lubao. Huantai expects to begin manufacturing LED materials later in 2011.
- 8 Apr 2011:LDK Solar has announced a business investment of approximately US$40 million to establish a new manufacturing plant in Nanchang City, Jiangxi Province (China). This new manufacturing facility will have capacity to supply two million 2-inch equivalent pieces of sapphire wafers per year and be positioned to capture the growing opportunities in the LED industry.
- 7 Apr 2011:The move leaves some to wonder if the silicon foundry giant is gradually moving into the IC-packaging world, thereby competing against Amkor, ASE and other subcontractors. Rick Cassidy, president of TSMC North America, said TSMC remains focused on the foundry market. But "lines are blurring" between some parts of the wafer manufacturing and packaging processes, Cassidy said.
- Taiwan's UMC will take the "lead role" in making the OMAP 5 device on a foundry basis for TI, said Kevin Ritchie, senior VP and manager of TI's technology and manufacturing group. For the OMAP 5, TI may work with other foundries, but Samsung does not appear to be one of the candidates. With the OMAP 4, TI has been "dissatisfied" with its foundry arrangement with Samsung, Ritchie said.
- 6 Apr 2011:TowerJazz expected to nearly double capacity with proposed acquisition of Micron plant (Apr 4) - Company releaseTowerJazz has signed a non-binding term sheet contemplating its purchase of Micron Technology's fabrication facility in Nishiwaki City, Hyogo, Japan. The proposed purchase would nearly double TowerJazz's current internal manufacturing capacity, increasing production by 60,000 wafers per month.
- 31 Mar 2011:Japanese manufacturing activity sank to a two-year low in March 2011, underlining the impact of the earthquake and tsunami on economic activity in the country.
- Renesas Electronics America will sell its semiconductor wafer fabrication facility in Roseville, California, to Telefunken Semiconductors. The sale price is approximately US$53 million, and the closing for the sale is planned for May 2, 2011. Telefunken also will enter into a supply agreement with Renesas for manufacturing services at the Roseville factory.
- 30 Mar 2011:
- Firms across the world fear shortages of parts that used to be made in the Japanese factories now shuttered because of power and water shortages, or because of road and port closures, following the quake and the floods. And carmakers, whose products often contain some 20,000 individual parts, are expected to be among those worst hit.
- Renesas may outsource component production to Singapore, Taiwan (Mar 28) - Bloomberg (via San Francisco Chronicle)Renesas is in talks to outsource production of auto microcontrollers to Globalfoundries Singapore, and some mobile phone semiconductor production to Taiwan Semiconductor Manufacturing Co. (TSMC), Shino Inokuma, a spokesman for Renesas, said by telephone.
- 24 Mar 2011:Iwate Toshiba Electronics will start to ramp-up production lines from March 28. However, Toshiba Mobile Display (Saitama Pref.), a wholly-owned subsidiary and manufacturer of mid- and small-sized LCD displays, expects to take about a month to secure recovery of its manufacturing line. Toshiba has started to supply some products alternatively from the Ishikawa Works, the company's another production facility located in Ishikawa Pref..
- 15 Mar 2011:Renesas Electronics has confirmed that seven out of 22 of its factories in Japan has temporarily shut down production. Among these factories, Renesas Yamagata Semiconductor Tsuruoka Factory is currently beginning its startup procedures to restart its manufacturing.
- 12 Mar 2011:The two Toshiba-SanDisk JV semiconductor manufacturing plants, Fab 3 and Fab 4, were down for a short period of time due to the earthquake and were back up and operational as of Friday morning, Pacific Time. SanDisk's current assessment is that there has been minimal immediate impact on wafer output due to the earthquake.
- 8 Mar 2011:A gauge of manufacturing in the euro region rose to 59 last month from 57.3 in January, London-based Markit Economics said in an e-mailed report. That's the highest since June 2000. A reading above 50 indicates expansion.
- 7 Mar 2011:Nova Measuring Instruments has announced that three major foundries recently placed US$12 million orders for its integrated and standalone metrology tools. The tools will support manufacturing and development for both the 4x and 3x technology nodes, and are expected to ship within the first and second quarters of 2011.
- 2 Mar 2011:Growing global demand has fuelled a surge in US manufacturing activity, which last month (Feb. 2011) accelerated at its fastest rate in almost seven years, according to the Institute of Supply Management.
- 25 Feb 2011:On Semiconductor plans to invest more than US$30 million to expand capacity and capabilities at its 8-inch wafer manufacturing facility in Gresham, Oregon. The facility remains the company's most advanced wafer fab - with current production technologies down to 0.11-micron.
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