Samsung Electronics is mass producing ePoP (embedded package on package) memory, a single memory package consisting of 3GB LPDDR3 DRAM, 32GB eMMC and a controller.
For use in high-end smartphones, the thin ePoP can be stacked directly on top of the mobile processor.
The 3GB LPDDR3 mobile DRAM inside the ePoP operates at an I/O data transfer rate of 1,866Mb/s, and sports a 64-bit I/O bandwidth.
Because of its thinness and heat-resistant properties, Samsung's smartphone ePoP does not need any space beyond the 225mm2 (15 by 15mm) taken up by the mobile application processor. A conventional PoP (also 15 by 15mm), consisting of the mobile processor and DRAM, along with a separate eMMC (11.5mm by 13mm) package, takes up 374.5mm2.
The single-package configuration also meets the semiconductor package height ceiling of 1.4mm, Samsung said.
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...
Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...
Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...
Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...
Photo: Company
- Musk says chip capacity will decide winner of AI race (Mar 21) - EE Times
- Google taps MediaTek for cheaper AI chips (Mar 17) - The Information
- European project gets $260 million for HPC chip sovereignty (Mar 6) - EE Times
- The trouble with MAGA's chipmaking dreams (Mar 3) - Economist
- Automotive chips: Gloom and doom or boom by 2030? (Feb 14) - EE Times
- Deepseek is more Wall Street than Silicon Valley (Feb 3) - Culpium, by Tim Culpan
- Tech CEOs try to reassure Wall Street after DeepSeek shock (Jan 30) - Wall Street Journal
- TSMC to make chips for cryptominer Bitdeer at new US fab (Jan 17) - Culpium, by Tim Culpan
![]()
Taiwan chip firm Macronix seeks tech edge as US-China rivalry intensifiesMemory chipmaker Macronix is betting on advanced technologies to escape a bruising price war as US-China...
![]()
Trump's reciprocal tariff ratesFollowing the initial deal with Vietnam on July 2, the Trump administration has been gradually disclosing the reciprocal tariff rates for more and more...
South Korea panel maker business status
South Korea's two major panel makers have made progress in restructuring their businesses and will continue to strengthen OLED...
Trump reciprocal tariff impact on global industries
US President Donald Trump's implementation of reciprocal tariffs marked a significant shift in global trade dynamics and despite...
Global server supply chain status and analysis, 2023-2025
DIGITIMES conducted a thorough investigation of major Taiwanese and Chinese EMS providers' production sites, analyzing over...
