The new Nokia 3.1 's comes with slim CNC'd aluminium sides with a dual diamond cut, according to the vendor, which describes it as its most affordable 18:9 smartphone with 5.2-inch HD+ display. The 2.5D curved display is protected by damage resistant Corning Gorilla Glass.
The Nokia 3.1 runs MediaTek 6750 octa-core chipset, giving a 50% performance boost on the previous generation, said the vendor. It features an upgraded 13MP main camera with auto focus, and its full set of sensors usually only found on premium phones supports most popular AR apps like Pokemon Go.
The new Nokia 3.1 will come in three colors: blue/copper, black/chrome and white/iron; two storage/RAM options: 2GB/16Gb, 3GB/32GB; and will be available starting June 2018 at a global average retail price of EUR139.
Nishant Arya, Vice Chairman, JBM GroupPhoto: Company
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...Photo: Company
IFA Berlin 2023, one of the world's largest and most iconic consumer electronics exhibitions, will...
Computex returned to the Taipei Nangang Exhibition Center in 2023 after its absence from 2020-2022 amid the COVID-19 pandemic. This year, the spotlights...
Global mobile device shipment forecasts, 2023 and beyond: Smartphones, notebooks and tablets
DIGITIMES Research expects smartphone shipments to grow 2-9% a year throughout the period from 2023-2027 with the CAGR for the...
Advanced packaging technology outlook, 2020-2026
Hybrid bonding and other new advanced assembly techniques widely used for smartphone application processors (AP) and high-performance...
Smart manufacturing progress of Taiwan, 2021
Taiwanese manufacturers demonstrated strong ambition toward adopting ISA-95 Layer 1 and 2 manufacturing equipment automation...