KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system.
Meeting IC manufacturers' need for accelerated defect sourcing on advanced devices, these two tools combine increased speed with seamless connectivity to find and identify defects that inhibit yield and reliability. The 2910 series' improved defect capture and the eDR-7100's enhanced review resolution have been demonstrated by detecting and imaging unique defects located at the bottom of three-dimensional or vertical pattern structures such as FinFETs.
Multiple 2910 series optical inspection tools, configured as either the 2910 or 2915, and eDR-7100 e-beam review tools have been installed at leading IC manufacturers where they are being used for new technology development and ramp, according to the company.
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...
Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...
Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...
Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...
Photo: Company
Stereo vision, first utilized as far back as in the late 1800s, is now entering the autonomous driving...
Interviews with Taiwan's startups to see their business development and upcoming strategy for the market.
Global mobile device shipment forecasts, 2023 and beyond: Smartphones, notebooks and tablets
DIGITIMES Research expects smartphone shipments to grow 2-9% a year throughout the period from 2023-2027 with the CAGR for the...
Advanced packaging technology outlook, 2020-2026
Hybrid bonding and other new advanced assembly techniques widely used for smartphone application processors (AP) and high-performance...
Smart manufacturing progress of Taiwan, 2021
Taiwanese manufacturers demonstrated strong ambition toward adopting ISA-95 Layer 1 and 2 manufacturing equipment automation...