Silicon Integrated System (SiS) has announced that its SiS672/96/307DV chipset that supports the Intel Atom 230 CPU has been adopted by Pegatron Technology for its ultra-slim Atom nettop.
The ultra-slim Atom nettop supports the Intel Atom 230 CPU and DDR2 667 memory with memory size of up to 2GB. The SiS Mirage 3 GPU is integrated in the SiS672 chipset to deliver graphics output.
The nettop is designed to be able to attach on various LCD monitor models to function as an all-in-one PC, the company said.
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...
Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...
Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...
Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...
Photo: Company
In November 2021, Zillow, a US-based real estate online marketplace, announced it would terminate the...
Mobile, telecom, computing trends
Taiwan notebooks - 4Q 2021
Taiwan's notebook shipments enjoyed better-than-expected growths in the fourth quarter of 2021, picking up over 10% sequentially,...
Global server revenue forecast, 2022
Taiwan-based manufacturers' revenues generated from server-related businesses including motherboards, complete systems as well...
Global server shipment forecast, 2022
According to Digitimes Research's statistics and analyses, the 2021 global server market has a supply-demand gap as large cloud...
South Korea to build semiconductor ecosystem; Tianma to invest in 8.6-gen panel project; Nissan and Honda unveil EV development plans
This Asia tech industry summary will mainly focus on South Korea's president-elect Yoon Seok-youl nominating Lee Jong-ho, a...
Advanced packaging technology outlook, 2020-2026
Hybrid bonding and other new advanced assembly techniques widely used for smartphone application processors (AP) and high-performance...
Smart manufacturing progress of Taiwan, 2021
Taiwanese manufacturers demonstrated strong ambition toward adopting ISA-95 Layer 1 and 2 manufacturing equipment automation...