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Samsung ISOCELL Slim GH1
Samsung Electronics has ntroduced a 0.7-micrometer-pixel image sensor, the 43.7-megapixel...
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AUO 6-inch all-screen panel
AUO's 6-inch full HD LTPS in-cell touch panel integrates the display driver IC and touch...
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IFA 2017: Huawei Kirin 970
Huawei has launched the Kirin 970 at IFA 2017 in Berlin, a chip that combines the power of...
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Silego SLG59H1302C power splitter
Silego Technology, a developer of configurable and mixed signal products, has introduction...
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Bosch MEMS acceleration sensors for wearables
Bosch Sensortec has announced a new family of MEMS acceleration sensors for wearable devices:...
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Toshiba Serial Interface NAND
Toshiba has launched a new line-up of NAND flash memory products for embedded applications...
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Intel XMM 7360 LTE Advanced solution
Intel announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel...
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Intel Atom x3 processor
Intel has introduced the Atom x3 processor series (formerly codenamed SoFIA), the company's...
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Qualcomm Snapdragon 810 and 808 processors
Qualcomm Technologies has introduced its next-generation mobile processors for the Qualcomm...
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MWC 2013: Nvidia Tegra 4i processor
Nvidia has introduced its first fully integrated 4G LTE mobile processor, the Tegra 4i. Previously...
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MWC 2013: Intel introduces new mobile SoCs
Intel has announced a range of new products for the mobile market, including a dual-core...
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Intel introduces new Atom Z2420 processor
Intel has unveiled a new low-power Atom processor-based platform (Lexington) and smartphone...
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Samsung 30nm 2GB LPDDR3 mobile memory
Samsung Electronics has begun mass producing 2GB and low power double-data-rate 3 (LPDDR3)...
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Samsung 4Gb LPDDR2 DRAM
Samsung Electronics has started sampling what it claims is the industry's first monolithic...
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Hynix 44nm 2Gb DDR2 for mobile applications
Hynix Semiconductor has developed 2-gigabit (2Gb) low-power DDR2 DRAM for mobile applications...
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