Taipei, Monday, December 18, 2017 09:25 (GMT+8)
SEMICON Taiwan 2005
  • DIGITIMES Show Daily, SEMICON Taiwan 2005, Taipei (12-14 September)

    Last update: Friday 23 September 2005 [31 news items]

SPIL to get more than 300 newest wire bonders from K&S by October

Sep 23, 12:04

US-based supplier of semiconductor-assembly equipment, tools and materials Kulicke & Soffa Industries (K&S) stated it is currently in the process of shipping 580 wire bonders...

Manufacturing process methodology for MEMS market success

Sep 16, 15:49

Over the last 15 years, MEMS has become a well-known term in the field of high-tech innovative technologies. Research centers' activities in this area have grown tremendously and...

With the right time, workforce and environment, Taiwan will become the center of IC design OEM – Opportunity arises as Japan IDMs cooperate with Taiwan against Korea

Sep 16, 15:43

Besides Taiwan’s first-tier foundry and packaging/testing houses that already have leading, world-class positions, Taiwan also has a promising IC design industry that includes...

A look at China’s IC design houses

Sep 16, 15:39

Just two months after saying it might lift a ban to allow Taiwanese semiconductor makers to set up China fabs using 0.18-micron processes, the Taiwan government in early April said...

Sumitomo schedules photoresist production for 32nm EUV lithography by 2008

Sep 16, 14:30

At the recently concluded SEMICON Taiwan, Japan-based Sumitomo Chemical revealed a roadmap for its Sumiresist materials used in semiconductor photolithography to form a patterned...

Synova revolutionizes wafer dicing – A cleaner, gentler cut

Sep 16, 09:56

Synova SA is poised to revolutionize wafer dicing with its innovative laser-microjet (LMJ) technology, where a hair-thin low-pressure jet of water guides the laser while simultaneously...

LDS 300 Laser Dicing System from Synova SA

Puma 9000 combines high-res imaging with darkfield scattering; KLA-Tencor offers the best of both worlds

Sep 16, 09:54

Announced in June, KLA-Tencor’s Puma 9000 patterned wafer inspection system combines high-resolution imaging with laser scattering technology. Previously, KLA-Tencor offered...

Puma 9000 patterned wafer inspection system, from KLA-Tencor

Advanced Energy highlights PI-980 pressure-insensitive MFC

Sep 15, 16:15

The problem with single-drop gas lines has been the creation of pressure transients and perturbations when valves are opened and closed, and it’s these disturbances in flow...

The PI-980 MFC is designed to eliminate crosstalk and enhance flow stability

The “Rich dad” effect in the Taiwan IC design industry

Sep 15, 16:11

Although the book “Rich Dad, Poor Dad” is mainly about two differing financial views of the world, a key idea that arises from the book is the unfairness of resource distribution...

Unstable cross-strait relations hinder Taiwan investment in China; Government should assist in “industry upgrade”

Sep 15, 11:07

Over the past few years, China has been systematically promoting economic reforms while domestic consumption significantly increased. As a result, China has become “the world’s...

Taiwan needs to increase R&D spending

Sep 15, 11:02

Twelve years ago when a Taiwan economics official explained to parliament a project on submicron technology, an ignorant lawmaker mistook it for an agricultural project because the...

The Da Vinci road – SEZ’s Da Vinci tool enables single-wafer wet processing

Sep 14, 17:10

At Semicon Taiwan 2005, the SEZ Group was showing its Da Vinci series of single-wafer wet processing systems, which target polymer removal for copper dual-damascene etch. The Da Vinci...

Herwig Petschnig, Chief Operating Officer, SEZ Asia Pacific

Promos orders Genus StrataGem 300mm ALD process tools

Sep 14, 17:02

ProMOS Technologies has placed a purchase order agreement for a production ALD system from Genus, a member of the Aixtron Group. The system will initially be used for the volume production...

Genus StrataGem 300mm ALD process tools

Taiwan IC designers losing ground to China competitors

Sep 14, 14:09

China’s IC designers are no longer the copycats they used to be. Since 2003, they have attained significant breakthroughs in the development of software and firmware. In addition,...

Rohm and Haas to set up manufacturing plant in Taiwan

Sep 14, 13:59

The US-based polishing technology supplier Rohm and Haas Electronic Materials CMP is using its presence at SEMICON Taiwan 2005 this week in Taipei to attract more attention to its...

Rohm and Haas president and CEO Nick Gutwein (left) and plant manager Cliff Chen

Lam Research: It's no longer just CPUs and DRAM leading process development

Sep 14, 12:29

As consumer electronics goods see increasing adoption by consumers, the tendency of favorably evaluating products that are fun-oriented rather then utility-oriented is swinging the...

Agilent strengthens ties with NDL on wafer mapping tool development

Sep 14, 12:09

Agilent Technologies recently announced that it will partner with National Nano Device Laboratories (NDL) on wafer mapping tool development, aiming to shorten the testing time for...

Agilent inks partnership deal with NDL

SMIC could start production at its UTAC JV pack and test house in 1Q 2006

Sep 14, 12:08

An IC backend production plant jointly established by Semiconductor Manufacturing International Corporation (SMIC) and United Test and Assembly Center (UTAC) in Chengdu, China, has...

Taiwan IC backend production rebounds but still banned from moving forward

Sep 13, 18:22

The fire at Advanced Semiconductor Engineering (ASE)’s facilities in May of this year benefited some competing IC packaging and testing companies as was evident by their increased...

What’s next for the IC equipment industry?

Sep 13, 18:02

Time flashes back to last year’s Industry Strategy Symposium (ISS), the global IC equipment market was blossoming with an influx of orders. However, at this year’s conference,...

Evolution in packing technology

Sep 13, 18:01

As semiconductor production technology has evolved, the growing functionality of integrated circuit (ICs) has correspondingly increased the pin count per chip. Traditional lead-frame...

Soitec moves ahead in SOI

Sep 13, 18:01

France-based Soitec, which produces silicon-on-insulator (SOI) wafers based on its patented Smart Cut technology, recently opened a Taiwan office, responding to growing industry interest...

The France-based Soitec has two fabs at Bernin.

TSMC CEO: Time to market is time to money

Sep 13, 16:30

The most important concern with current semiconductor companies is their ability to accelerate their time to market – which equates to time to money – as end-users move...

Ramping 12-inch wafer output stimulates tester adjustment

Sep 13, 14:49

Stimulated by growing 12-inch wafer testing orders, local testing houses including Advanced Semiconductor Engineering (ASE) and King Yuan Electronics (KYEC) have both installed more...

Amkor conservative from mid-4Q

Sep 13, 14:39

Although confident about the next two months, Amkor Technology is conservative about demand growth after November, claiming that high crude oil price may serve as a limiting factor...

Memory module makers gear up production in China

Sep 13, 14:36

Substantial demand for NAND flash memory is encouraging memory module makers to accelerate their expansion in China because of its relatively low assembly costs. Kingston Technology...

Micron anticipates stabilizing memory prices; opens expanded testing & assembly capacity in Singapore

Sep 13, 14:34

Although Micron Technology was trumped by Korea-based Hynix Semiconductor as the third largest DRAM suppliers in the second quarter, the US-based memory and CMOS image sensor supplier...

Where is Taiwan as China rises in the global IC industry?

Sep 12, 16:03

As the focus of the global semiconductor industry turns to China, Taiwan players are benefiting from the influx of substantial business opportunities. However, as the semiconductor...

Taiwan semiconductor capex on track in 2005; may miss 2006 forecast

Sep 12, 15:24

Equipment spending by Taiwan's semiconductor industry, including foundry, memory manufacturing and packaging and testing companies, will meet the 2005 forecast, according to Archie...

Varian Semiconductor voted best equipment supplier in Taiwan

Sep 12, 15:01

VLSI Research announced Friday that Varian Semiconductor came out on top in its annual customer satisfaction survey. The survey asked equipment users to rate equipment suppliers on...

SPIL and KYEC deny merger rumors

Sep 12, 15:01

Bough Lin, chairman of Siliconware Precision Industries (SPIL), and Lin Dian-fang, president of King Yuan Electronics (KYEC), both denied rumors suggesting that SPIL was looking to...

Global AP demand forecast, 2017-2020

15-Dec-2017 markets closed


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GTSM (OTC)145.8-0.46-0.31% 

OTC electronic220.42-0.82-0.37% 

Global notebook shipment forecast, 2017 and beyond
  • The 10nm competition

    TSMC and Samsung have been competing for clients for the 10nm node.

  • Qualcomm royalty row

    Qualcomm faces pressure to renegotiate royalty terms with clients as more phone vendors reportedly mull following Apple's lead in suspending payments...

  • TSMC 3nm fab

    TSMC will build its 3nm fab in southern Taiwan.

  • SEMICON Taiwan 2017

    Semiconductor equipment and material suppliers are showcasing their latest products and technologies at SEMICON Taiwan 2017 in Taipei September 13-15.

  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.