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NEWS TAGGED WIRE BONDING
Tuesday 6 October 2020
SPIL sells China subsidiary on Huawei woes
ASE Technology Holding has announced that Siliconware Electronics (Fujian), a wholly-owned subsidiary in China of its member firm Siliconware Precision Industries (SPIL), has been...
Friday 11 September 2020
Taiwan firms eyeing lucrative demand for mini LED substrates
Demand for mini LED-backlit display solutions is expected to take off in 2021 with leading system vendors such as Apple and Samsung keenly adopting the solutions in their terminal...
Friday 10 July 2020
ASE Technology sees record 1H20 revenues, stronger 3Q20
Leading IC backend house ASE Technology Holding saw its revenues for both second-quarter and first-half 2020 hit record highs, thanks mainly to high capacity utilization for wire...
Wednesday 14 August 2019
Wafer-level backend demand promising
The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...
Tuesday 4 September 2018
ASE COO sheds light on future IC development
With a 22% share of the global semiconductor market, Taiwan's IC industry must capture the right to speak for its future business development while embracing the 60th anniversary...
Monday 25 April 2016
Taiwan university develops aluminum ball bonding technology
While copper wire is considered a cheaper alternative to gold wire for ball wire bonding used in semiconductor packaging, a process based on aluminum wire has been developed by Taiwan's...
Tuesday 7 April 2015
SEMI reports 2014 semiconductor materials sales of US$44.3 billion
The global semiconductor materials market increased 3% in 2014 compared to 2013, while worldwide semiconductor revenues increased 10%, according to SEMI. Revenues of US$44.3 billion...
Wednesday 12 February 2014
SPIL to grow sales of silver wire-bonding packaging in 2014
Chip packager Siliconware Precision Industries (SPIL) expects the development of its silver wire-bonding packaging business to bear fruit in 2014.
Wednesday 13 March 2013
Greatek looks to improved profitability on copper wire bonding lines
Logic IC packaging firm Greatek Electronics has revealed that copper wire bonding packaging lines are currently contributing more than 50% to its total revenues, which will further...
Thursday 6 September 2012
Demand for copper wirebonding packaging to peak in 2014
Demand for copper wirebonding packaging will remain strong over the next two years, with the packaging technology to account for 85% of the global wirebonding market in 2014, according...
Tuesday 31 July 2012
ASE, SPIL make progress in transition to copper wire bonding
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...
Friday 29 June 2012
Greatek remains focused on shift to copper wire bonding
IC backend service provider Greatek Electronics, which focuses on the consumer electronics market, has said the firm will continue shifting copper wire bonding from gold bonding in...
Wednesday 7 September 2011
Proportion of copper wire bonding to rise to over 20% in 2011, says SEMI
Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for...
Monday 15 August 2011
ASE and SPIL look to continued growth in copper wire bonding business in 3Q11
IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase...
Monday 2 May 2011
ASE sees 7-9% growth in 2Q11 shipments; copper wire bonding sales rising
Chip packager Advanced Semiconductor Engineering (ASE) expects shipments to increase 7-9% sequentially in the second quarter of 2011, with a higher gross margin, company CFO Joseph...