News tagged wire bonding
Last update: Wednesday 12 February 2014 [24 news items]
SPIL announces equipment purchase
Stockwatch - Aug 3, 14:43
Siliconware Precision Industries (SPIL) has announced an equipment purchase worth NT$574.62 million (US$18 million) from Verigy, which mainly supplies automated test equipment.
ASE raises 2010 capex
Jun 15, 11:52
Advanced Semiconductor Engineering (ASE) has decided to boost its 2010 capex to US$600-700 million from US$450-500 million it earlier planned, said company COO Tien Wu at a recent...
ASE and SPIL revenues hit 2-year high in October
Nov 10, 13:46
IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw revenues in October 2009 reach a two-year high at NT$4.9 billion (US$152 million), while rival Siliconware...
ASE and SPIL deny headhunting rumors
Oct 16, 12:23
Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...
SPIL 2Q09 sales up more than 50%
Jul 8, 15:53
Siliconware Precision Industries (SPIL) has announced unaudited revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$431.24 million), beating market watchers'...
ASE, SPIL optimistic about 3Q09
Jun 2, 16:10
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL) have fully utilized all wire bonders, with the former using 60-70% and the latter 70-80% of their...
NPC to relocate wirebond capacity to China
Jul 29, 11:38
Having already identified flip-chip (FC) substrates as a key sales driver in 2008, Nan Ya Printed Circuit Board (NPC) plans to relocate its low-margin production to China in order...