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News tagged testing
  • Last update: Thursday 12 June 2014 [331 news items]

Notebook players limit initial Ultrabook shipment volume below 50,000 units

Sep 6, 01:05

First-tier notebook brand vendors Acer, Lenovo, Toshiba and Asustek Computer, understanding that demand for notebooks is unlikely to recover in the fourth quarter, while Apple's products...

SPIL vying for CPU back-end orders from Apple

Aug 26, 11:07

Packaging and testing firm Siliconware Precision Industries (SPIL) is likely to snatch outsourcing orders for Apple's new processor dubbed A6, according to industry sources.

IC testers KYEC, SCT suffer large sequential decrease in 2Q11 profits

Aug 24, 01:00

King Yuan Electronics (KYEC) and STATS ChipPAC Taiwan Semiconductor (SCT), providers of IC testing services, saw net profits for the second quarter of 2011 drop 52.0% and 31.0% seq...

Samsung reportedly contacted Taiwan OEMs for evaluating notebook outsourcing

Aug 23, 01:10

Korea-based notebook brand vendor Samsung Electronics has reportedly contacted Taiwan-based notebook makers Quanta Computer, Compal Electronics and Pegatron Technology in August to...

More firms reducing exposure in DRAM packaging and testing market

Aug 22, 12:00

The growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out...

PTI, Walton look to lower revenues in 4Q11

Aug 18, 14:58

Memory packaging and testing firms Powertech Technology (PTI) and Walton Advanced Engineering both expect their fourth-quarter revenues to be lower than the levels recorded in the...

Walton expects flat 3Q11, but drop in 4Q

Aug 18, 01:10

Memory IC packaging and testing firm Walton Advanced Engineering has narrowed its sales forecast for the third quarter to flat growth sequentially, compared with the 0-5% increase...

Walton president Yu Hong-chi

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

Chroma profits up 34% in 2Q11

Aug 10, 12:03

Testing solution provider Chroma ATE saw its net profits grow 34% sequentially to NT$530 million (US$18.24 million) on consolidated revenues of NT$4.12 billion for the second quarter...

ChipMOS mulls phasing out DRAM backend business

Jul 15, 01:10

Packaging and testing house ChipMOS Technologies plans to gradually phase out its DRAM packaging and testing business, and concentrate on backend services for LCD driver ICs and flash...

ChipMOS secures NT$8.4 billion syndicated loan

Jul 14, 14:08

IC packaging and testing house ChipMOS Technologies has signed an NT$8.4 billion (US$291 million) syndicated loan agreement with a banking consortium mostly to repay part of its previous...

PTI developing advanced packaging technologies

Jul 1, 01:10

Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...

PTI, Walton seeing weaker-than-expected demand for mobile DRAM

Jun 30, 01:25

Memory IC packaging and testing firms Powertech Technology (PTI) and Walton Advanced Engineering have revised downward their targeted sales contributions from mobile DRAM products...

White-box players supply close to 20% of global tablet PC shipments in 1Q11

Jun 28, 01:05

White-box tablet PC players are rising quickly in the tablet PC industry with related shipments already accounting for close to 20% of global tablet PC shipments in the first quarter...

ASE subsidiary sells DRAM testing equipment to PTI

Jun 27, 11:30

Power ASE Technology, a subsidiary of Advanced Semiconductor Engineering (ASE) specializing in DRAM packaging and testing, has announced that the company has sold some of its high-speed...

NSN opens TD-LTE testing center in Taiwan

Jun 23, 16:33

Nokia Siemens Networks (NSN) on June 22 inaugurated a TD-LTE testing center set up in northern Taiwan in cooperation with the National Chiao Tung University, the first one of its...

Microsoft postpones IDP for 2 weeks to re-consult with chip players

Jun 2, 01:10

Microsoft has postponed its Integrated Development Program (IDP) for Windows 8 as the plan created significant dissatisfaction within the upstream supply chain. Microsoft is set to...

KYEC lands new order for FRAM

May 26, 01:00

King Yuan Electronics (KYEC) has obtained orders from Ramtron International, a supplier of non-volatile ferroelectric random access memory (FRAM), according to the chip assembly and...

KYEC expects rebound in 2H11

May 19, 01:10

IC testing firm King Yuan Electronics (KYEC) expects a rebound in the second half of 2011 following a weaker-than-expected second quarter. Orders have picked up since mid-May, according...

PTI beats 1Q11 guidance, gives positive outlook

Apr 29, 01:35

Powertech Technology (PTI) on April 28 reported better-than-expected results for its first-quarter performance. The memory packaging and testing service provider also gave a rosy...

PTI chairman DK Tsai

IC testing firm Thailin to control packaging house ChipMOS Shanghai

Apr 25, 15:58

IC testing house Thailin Semiconductor will spend US$39.95 million to take up the control of ChipMOS Technologies (Shanghai) through the purchase of Modern Mind Technology, which...

Taiwan market: Chunghwa Telecom Lab and Alcatel-Lucent complete LTE network testing

Apr 22, 15:11

Chunghwa Telecom (CHT) Laboratories and Alcatel-Lucent on April 21 jointly announced the completion of end-to-end and comprehensive tests of 4G LTE (Long Term Evolution) equipment...

IC packager ASE steps up investment in China

Apr 21, 01:20

Taiwan-based IC packaging and testing firm Advanced Semiconductor Engineering (ASE) has revealed plans to invest a total of US$1.2 billion on manufacturing facilities in Shanghai,...

IC backend 2Q11 sales likely affected by material shortages

Apr 14, 15:18

IC packaging and testing firms including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to provide a cautious outlook for the second...

IC testing firm KYEC cautious about 2Q11

Apr 11, 15:04

King Yuan Electronics (KYEC) has expressed concerns that it may experience a particularly weak second quarter of 2011, as clients turn cautious about placing orders due to shortages...

Elpida says packaging and testing unit affected by earthquake

Apr 8, 14:32

Japan-based memory chip supplier Elpida Memory has disclosed the impact of the earthquake that occurred in northeast Japan on April 7 on its business operations.

Chipbond remains cautious about 2Q11

Apr 8, 11:28

LCD driver IC packaging and testing firm Chipbond Technology has remained cautious about the outlook for the second quarter due to low order visibility. The company expects to report...

RIM PlayBook to benefit Quanta and Foxlink

Apr 7, 01:40

As Research In Motion (RIM) is set to launch its PlayBook tablet PC on April 19 in the US and Canada priced at US$499.99, its upstream assembly partner Quanta Computer and connector...

Packaging and testing house Sigurd breaks ground for new factory, says report

Newswatch - Mar 31, 14:32

IC packaging and testing house Sigurd Microelectronics has broken ground on a new factory building located next to its existing production site in Hsinchu, northern Taiwan, according...

BT resin supply expected to return to normal in May

Mar 31, 01:00

Recovery work at Mitsubishi Gas Chemical's (MGC) Fukushima facility is progressing more quickly than expected, sources at Taiwan-based chip packaging and testing houses have claimed...

Elpida says packaging and testing unit back in operation

Mar 17, 12:35

Elpida Memory has announced that Akita Elpida Memory, a packaging and testing subsidiary of Elpida, has resumed production on restoration of electricity supply.

Elpida likely to seek support from PTI for packaging and testing

Mar 15, 15:34

With plant operations disrupted due to power shortages, Japan-based Elpida Memory may ask for assistance from its packaging and testing partner Powertech Technology (PTI), industry...

Taiwan packaging and testing firms post sequential drops in February

Mar 8, 14:07

All major Taiwan-based chip packaging and testing firms saw sequential declines in consolidated sales in February 2011.

Chipbond, KYEC team up for power IC packaging and testing

Mar 3, 01:05

LCD driver-IC packaging and testing firm Chipbond Technology and King Yuan Electronics (KYEC), which specializes in chip probing and final test services, have signed a memorandum...

Notebook makers expect strong shipment growth in March as Intel fixes chipsets

Feb 24, 01:15

Taiwan-based notebook makers are already assembling notebooks with fixed 6 series chipsets as Intel's progress in fixing its defective chipsets is ahead of schedule and most of the...

331 items [4/10]
  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • ALT+Apollo+BR30+series+LED+lamb

    ALT Apollo BR30 series LED lamb

    Aeon Lighting Technology (ALT) showcased its Apollo BR30 Series LED lambs at the Light Series in Lighting + Building 2010 in German. ALT Apollo BR30 series conform to E26/E27 and...

    Photo: company, Apr 21.

  • ALT+Osiris+LED+lights

    ALT Osiris LED lights

    Aeon Lighting Technology (ALT) is showcasing its Osiris recessed light series LED lights in Lighting+Building 2010 in German. ALT said its Osiris recessed light series emit no harmful...

    Photo: company, Apr 16.

  • FormFactor+300mm+full%2Dwafer+test+solution+for+DRAM

    FormFactor 300mm full-wafer test solution for DRAM

    FormFactor has introduced its next-generation 300mm (12-inch) full-wafer-contact probe card for DRAM devices - the SmartMatrix 100 probe solution. Incorporating a proprietary probe...

    Photo: Company, Dec 11.

  • VIA+Mobile+ITX+form+factor%2Dbased+motherboard

    VIA Mobile ITX form factor-based motherboard

    VIA Technologies has announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices. Mobile-ITX defines...

    Photo: Ninelu Tu, DIGITIMES, Dec 4.

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