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Advanced packaging and testing takes step in four major sectors, showcasing several high-end test interfaces

Julian Ho, Taipei; Jack Wu, DIGITIMES Asia Monday 11 September 2023 0

Credit: DIGITIMES

Advanced packaging and testing technologies shined brightly at SEMICON Taiwan 2023 due to a focus on AI, HPC, and automotive chips. This included various showcases of new products and technology from test interface suppliers like Chunghwa Precision...

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