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Wednesday 20 May 2020
Team Group shipping industrial memory devices for HPC applications
Memory module house Team Group expects to kick off volume shipments of industrial memory devices for use in HPC applications later in May.
Tuesday 5 May 2020
Innolux, EIH team up for large-size e-paper displays
Taiwan-based panel maker Innolux has teamed up with e-paper solution provider E Ink Holdings (EIH) to develop large-size colored e-paper display products for IoT and smart city applications,...
Wednesday 29 April 2020
Team Group posts profit hike in 1Q20
Memory module manufacturer Team Group has reported net profits hiked 264.2% from a year earlier to NT$151 million (US$5.05 million) in the first quarter of 2020, when gross margin...
Monday 30 March 2020
AIDC-led team lands NT$62 billion in orders from aircraft makers
An aerospace team composed of Taiwan's Aerospace Industrial Development (AIDC) and three advanced machinery makers has successfully tapped into the international aerospace composite...
Friday 21 February 2020
ST, TSMC team up for GaN devices
STMicroelectronics and TSMC are collaborating to accelerate the development of gallium nitride (GaN) process technology and the supply of both discrete and integrated GaN devices...
Wednesday 19 February 2020
NTUST fosters team for development of power electronics industry in Taiwan
Playing a vital role in global power electronics technology development, Taiwan hosts six of the world's top 10 power supply manufacturers. The impressive achievement is attributable...
Tuesday 18 February 2020
EVG, Inkron team up for diffractive optical element structures
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has announced it is partnering with Inkron, a manufacturer...
Tuesday 18 February 2020
NTUST team develops metallic glass coating technology with strong development potential
Celebrating 60 years of progress in 2020, metallic glass technologies are widely used today in healthcare, biotechnology, manufacturing and aerospace industries as the material combines...
Tuesday 7 January 2020
EgisTec, eMemory team up for large-area in-display fingerprint sensor
Taiwan-based Egis Technology (EgisTec) and eMemory Technology have gained government subsidies for their joint development of large-area in-display optical fingerprint sensor chips...
Thursday 2 January 2020
Andes Technology and Deeplite team up for AI deep learning
Taiwan-based Andes Technology, a supplier of high-performance low-power compact 32/64-bit RISC-V CPU cores, and Canada-based AI startup Deeplite, have announced the results of their...
Thursday 19 December 2019
Baidu, Samsung team up for AI chips
Baidu and Samsung Electronics have announced jointly that Baidu's first cloud-to-edge AI accelerator, Baidu Kunlun, has completed its development and will be mass-produced early next...
Thursday 17 October 2019
GF acquires Smartcom PDK development team
Globalfoundries has acquired the PDK engineering team from Smartcom Bulgaria. The newly acquired team will enhance GF's scale and capabilities, while strengthening competitiveness...
Wednesday 16 October 2019
Google to team up with Taiwan Mobile to sell Pixel 4 in Taiwan
Google has unveiled its latest smartphones, the Pixel 4 and Pixel 4 XL, and will team up with Taiwan Mobile to campaign the new lineup along with its Pixel 3a and Nest Mini smart...
Wednesday 9 October 2019
Furukawa, Lemtech team up for smartphone thermal solutions
Japan's Furukawa Electric and Taiwan-based Lemtech have teamed up to develop stainless steel-based ultra-thin vapor chamber cooling solutions for smartphones.
Friday 27 September 2019
NTPC-AWS JIC begins second-round of startup team recruitment
The NTPC-AWS Joint Innovation Center (JIC), established jointly by Amazon Web Services (AWS) and the New Taipei City government, has activated the second phase of recruitment of startup...