Taipei, Thursday, October 27, 2016 19:10 (GMT+8)
News tagged Team
  • Last update: Tuesday 20 September 2016 [90 news items]

Globalfoundries, Samsung said to team up to vie for Apple chip orders

Nov 13, 12:23

Rumors have been circulated in the IC industry claiming that Globalfoundries and Samsung Electronics will team up to vie for A9-series chip orders from Apple. Under the reported tie-up,...

Dialog, Richtek team up for power management ICs

Nov 12, 11:56

Taiwan-based Richtek Technology has signed a cooperation agreement with Dialog Semiconductor for the development of power management ICs targeting the tablet and smartphone chipset...

ASE, Infineon team up for assembly of auto products

Nov 7, 15:42

Advanced Semiconductor Engineering (ASE) has announced a joint development and product agreement for assembly services of automotive products with Infineon Technologies. The collaboration...

Alchip, KnCMiner team up for Bitcoin mining machine with 28nm ASIC

Nov 5, 15:44

KnCMiner, a provider of Bitcoin mining devices, and fabless ASIC company Alchip Technologies, have announced the availability of what the companies claim is the world's first 28nm...

Imagination, MediaTek team up for heterogeneous multi-processing SoCs

Sep 4, 12:35

Imagination Technologies has recognized MediaTek for its deployment of heterogeneous processing. The new MediaTek MT8135 chip is a mobile SoC enabling heterogeneous multi-processing...

Huawei to team up with Compal to make smartphones, tablets in Brazil, says paper

Newswatch - Aug 26, 14:04

Huawei Technologies plans to team up with Taiwan-based Compal Electronics to produce smartphones and tablets in Jundiai, Brazil, according to a Chinese-language Economic Daily...

Synopsys, UMC team up for 14nm FinFET

Jun 27, 10:48

IC foundry United Microelectronics (UMC) has announced that its partnership with Synopsys, a provider of electronic design automation (EDA) software and services, resulted in the...

InnoDisk, Aptos team up for industrial embedded use SSDs

May 31, 14:55

InnoDisk, which specializes in flash storage devices for industrial applications and embedded systems, has teamed up with backend service provider Aptos Technology to develop a new...

Xilinx, TSMC team up for 16nm FinFET FPGAs

May 29, 15:44

Xilinx and TSMC have jointly announced that they are teaming up to create FPGAs built using 16nm FinFET process technology.

Imec, Globalfoundries team up for STT-MRAM

May 22, 11:22

Globalfoundries has joined Imec's industrial research collaboration to develop spin-transfer torque magnetoresistive random access memory (STT-MRAM), according to the IC foundry.

Infineon, Globalfoundries team on 40nm embedded flash process

Apr 29, 21:58

Infineon Technologies and Globalfoundries have announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology.

TSMC, Altera team on 55nm embedded flash process

Apr 16, 12:08

Programmable logic supplier Altera is working with foundry partner Taiwan Semiconductor Manufacturing Company (TSMC) on a 55nm embedded flash (EmbFlash) process technology tailored...

Sequans, Alcatel-Lucent team up for LTE broadcast

Feb 25, 11:53

Sequans Communications has successfully completed interoperability testing of Alcatel-Lucent's LTE infrastructure equipment with Sequan's eBMS-capable LTE chipsets, according to the...

Austrian research team develop a new flat, flexible, transparent, and potentially disposable polymer sheet for capturing images

Feb 22, 11:22

An Austrian research team has developed a new way of capturing images based on a flat, flexible, transparent, and potentially disposable polymer sheet. The team describesd their new...

Samsung reportedly replaces management team in Brazil market

Jan 23, 22:34

Korea-based Samsung Electronics has reportedly replaced its management team in Brazil despite the team's efforts helping Samsung to become the largest vendor in the country, defeating...

MStar Semiconductor and Flingo Samba TV platform team up to provide smart TV solution

Jan 17, 15:13

Smart TV app publisher Flingo has announced that Samba, its new interactive TV platform, will be integrated into MStar Semiconductor Smart TV solution to synchronize TV, tablet, phone...

UMC restructures executive team

Nov 20, 13:47

Foundry chipmaker United Microelectronics has announced the appointment of Po-Wen Yen to the position of CEO, effective immediately. Former CEO Shih-Wei Sun has been promoted to company...

UMC, STMicro team up to develop BSI process for image sensors

Sep 7, 15:02

United Microelectronics (UMC) has teamed up with STMicroelectronics to develop 65nm CMOS image sensor technology using backside illumination (BSI).

ALi, Panasonic team up for DVB-T2 chipset

Aug 30, 01:00

ALi, a provider of set-top box (STB) system-on-chip (SoC) solutions, has announced that the company has teamed up with Panasonic's semiconductor business group to begin mass production...

BOE eyes team up with Formosa Epitaxy, Unity Opto to set up LED epitaxial wafer plant

Aug 17, 11:27

China-based LED firms have been producing low-priced LED chips causing oversupply in the upstream LED chip segment to continue. China-based panel maker BOE recently announced plans...

Foxconn refutes rumors about entering Taiwan cable TV channel market

Aug 2, 01:05

Foxconn Electronics (Hon Hai Precision Industry), commenting on a recent rumor that the company is preparing to enter Taiwan's cable TV channel market, has said it is aiming to work...

Fujitsu, DoCoMo and NEC team up for communications IC

Aug 1, 16:14

Fujitsu has announced that the company has reached an agreement with NTT DoCoMo and NEC to form a joint venture, which will focus on the development and sales of semiconductors used...

ARM, TSMC team up to deliver ARM cores on FinFET transistors

Jul 24, 14:06

TSMC and ARM have announced a multi-year agreement extending their collaboration beyond 20nm technology to deliver ARM processors on FinFET transistors, enabling the fabless industry...

UMC signs license deal with IBM to develop 20nm chips

Jul 2, 13:55

United Microelectronics (UMC) announced recently that the company has signed a license agreement with IBM to expedite the development of its 20nm CMOS process with FinFET 3D transi...

ECS passes 2011 finance report with growth of more than 7%

Jun 26, 01:10

Elitegroup Computer Systems (ECS) hosted a shareholder meeting on June 25, passing its finance report for 2011 with consolidated revenues reaching NT$72.7 billion (US$2.43 billion),...

Taiwan market: Yahoo! Kimo expanding marketing team for keyword search advertising

Jun 15, 15:36

Yahoo! Kimo (Yahoo! Taiwan) has expanded its agent workforce for marketing its online keyword search advertising service in the Taiwan market to 38 sales partners and about 300 sales...

Singapore IME, UMC team up to develop TSV for BSI sensors

Jun 6, 01:20

Singapore's Institute of Microelectronics (IME) and United Microelectronics (UMC), the world's second largest foundry company, have announced plans to jointly develop through-silicon...

Spansion, SK Hynix team up for SLC NAND

Apr 3, 10:50

Spansion has announced an alliance with SK Hynix to introduce SLC NAND products at the 4x, 3x, and 2x nodes. As part of the relationship, the pair will enter into a patent cross-licensing...

Arakawa Chemical, Taimide team up on thin-film metallization process research

Jan 9, 14:14

Taiwan-based polyimide (PI) film supplier Taimide Technology has announced it will work with Japan's Arakawa Chemical Industries to develop a new process used for the manufacture...

Fujitsu Semiconductor, Sequans team up for LTE

Oct 21, 14:16

Sequans Communications announced on October 20 it has established a technology and marketing collaboration with Fujitsu Semiconductor for the purpose of providing customers with a...

Asustek launches Zenbook series ultrabooks

Oct 13, 01:30

Asustek Computer has unveiled its Zenbook series ultrabooks saying it is confident it has the closest performance/price ratio compared to Apple's MacBook Air.

Asustek Zenbook series ultrabook

TSMC to visit Apple for more talks

Oct 6, 01:30

Taiwan Semiconductor Manufacturing Company (TSMC) has sent a 60-member team, which includes staff from its IC design service partner Global UniChip, to Silicon Valley-based Apple...

TSMC groundbreaking ceremony for Fab 15

Lantiq, Altair Semiconductor team up for LTE-ready home gateways

Sep 28, 15:55

Lantiq and Altair Semiconductor have announced that Altair's LTE chipset will be used for the Lantiq XWAY GRX family of network processors, speeding development of LTE-ready home...

Foxconn notebook team reportedly shift to Compal

Jul 20, 15:45

Foxconn's R&D team of 100-200 staff responsible for developing Dell notebooks have reportedly left and joined Compal Electronics due to Foxconn making adjustments in its notebook...

Acer, HP undergoing management reshuffle

Jul 19, 01:05

Acer, on July 18, announced it has recruited Dave Chan, former Hewlett-Packard (HP) China vice president, as general manager of its Touch Business Group in China. Also, while company...

Acer and HP
90 items [2/3]
  • MSI+LA+Dodgers+version+all%2Din%2Done+PC

    MSI LA Dodgers version all-in-one PC

    The LA Dodgers and Micro-Star International (MSI) have announced that MSI will be supplying the Dodgers with Wind Top all-in-one PCs and notebooks for use by team executives and office...

    Photo: Company, Mar 17.

  • Team+Rainbow%2Dseries+USB+drives

    Team Rainbow-series USB drives

    Team, a Taiwan-based supplier of memory modules, memory cards, USB drives and solid state drives (SSDs), is showcasing a variety of products at Computex Taipei 2008, including its...

    Photo: Company, Jun 3.

  • Team+Supreme%2Dseries+USB+drives

    Team Supreme-series USB drives

    Among Team's USB disk drive offerings on display at Computex 2008 is its Supreme series, which offer drives in capacities ranging from 8-64GB. With a leather-felt shell and slide...

    Photo: Company, Jun 3.

China smartphone touch-panel industry 2016 forecast
Wireless broadband developments in Southeast Asia markets

27-Oct-2016 markets closed


TAIEX (TSE)9362.25-23.40-0.25% 

TSE electronic385.39-1.34-0.35% 

GTSM (OTC)127.72+0.05+0.04% 

OTC electronic169.58+0.82+0.49% 

Analysis of China revised domestic semiconductor industry goals
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.