IC testers KYEC, SCT suffer large sequential decrease in 2Q11 profits

Aug 24, 01:00

King Yuan Electronics (KYEC) and STATS ChipPAC Taiwan Semiconductor (SCT), providers of IC testing services, saw net profits for the second quarter of 2011 drop 52.0% and 31.0% seq...

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

Copper pillar to be mainstream FC packaging technology in 2012

Jun 3, 15:43

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...

STATS ChipPAC reaches milestone of over 300 million copper wirebond units shipped

May 4, 13:45

STATS ChipPAC has shipped over 300 million semiconductor packages with copper wirebond interconnect, according to the company. Its previous milestone with shipments of more than 100...

STATS ChipPAC expands TSV offering

Apr 19, 10:38

STATS ChipPAC has expanded its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities, according to the company.

STATS ChipPAC profits surge in 2010

Jan 28, 11:07

STATS ChipPAC, a Singapore-based provider of semiconductor testing and assembly services, has announced net profits soared to US$108 million in 2010 from US$10.1 million in 2009....

STATS ChipPAC expands WLP offering with 12-inch manufacturing in Taiwan

Jan 18, 12:00

STATS ChipPAC has announced the expansion of its wafer-level package (WLP) offering with new 300mm manufacturing capabilities in Taiwan. The 300mm WLP operation is located in Hsinchu...

STATS ChipPAC, Intersil qualify copper wire interconnect for analog and mixed-signal devices

Dec 16, 01:00

STATS ChipPAC and Intersil have qualified the use of copper wire interconnect solutions on a number of high-end analog and mixed-signal devices which are in volume production, STATS...

STATS ChipPAC sees over 50% growth in flip chip business

Dec 14, 12:00

STATS ChipPAC has seen its flip chip business grow more than 50% in 2010 compared to 2009, according to the company, adding that shipments of flip chip packages have surpassed 250...

Ardentec denies merger with STATS ChipPAC

Stockwatch - Dec 3, 12:35

Wafer probing service provider Ardentec has denied a Chinese-language Economic Daily News (EDN) report indicating STATS ChipPAC has approached it to discuss a merger, according...

STATS ChipPAC increasing copper-wire bonding output

Dec 2, 01:05

Singapore-based STATS ChipPAC has cumulatively packaged 100 million chips based on copper-wire bonding process since it started using the process in November 2009, and expects to...

MediaTek reportedly negotiating new prices with UMC and backend service providers

Nov 29, 12:29

MediaTek is reportedly negotiating with United Microelectronics Corporation (UMC) as well as backend service providers including Advanced Semiconductor Engineering (ASE) and Siliconware...

STATS ChipPAC opens new plant for 300mm eWLB wafer manufacturing

Sep 15, 15:33

STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...

STATS ChipPAC intros 300mm embedded WLB wafer manufacturing

Apr 13, 12:00

STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...

TSMC to raise orders to testing partners, says paper

Newswatch - Dec 15, 16:20

Taiwan Semiconductor Manufacturing Company (TSMC) plans to no longer add new capacity for wafer testing, and increase its outsourcing to backend partners Ardentec and STATS ChipPAC...

STATS ChipPAC moves copper wire bonding process to volume production

Nov 25, 11:23

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).

ASE ramping copper wire bonding output

Oct 1, 14:18

Advanced Semiconductor Engineering (ASE) has been ramping up its output utilizing a copper wire bonding process, with shipments of such ICs reaching over 50 million units in the past...

Top backend houses to see revenues grow in 3Q09

Aug 3, 12:14

Amkor Technology is expected to see the strongest revenue growth among top packaging and testing houses in th third quarter, followed by Advanced Semiconductor Engineering (ASE),...

STATS ChipPAC sales up 45% in 2Q09; swings to profit

Jul 30, 11:30

STATS ChipPAC saw its net sales grow 45% sequentially in the second quarter of 2009, and managed to swing back to profitability, according to the company. The Singapore-based chip...

STATS ChipPAC expanding capacity for wafer-level packaging

Jun 17, 14:35

STATS ChipPAC has announced it is expanding capacity for full turnkey wafer-level packaging in its Singapore operation. The IC packaging and testing service provider said it is on...

STATS ChipPAC delivers low-cost flip-chip technology

May 20, 12:25

STATS ChipPAC, a Singapore-based semiconductor packaging and testing service provider, has announced a new flip-chip (FC) technology that it says offers cost savings over standard...

STATS ChipPAC reports losses for 1Q09 due to continued contraction in demand

Apr 30, 11:48

STATS ChipPAC has posted its second straight quarterly loss in the first quarter of 2009, joining fellow packaging and testing house Advanced Semiconductor Engineering (ASE). Its...

Wafer testing firms expect better 2Q09 on resumed orders for handset chips

Mar 30, 16:43

Wafer testing service providers Ardentec, King Yuan Electronics Company (KYEC) and STATS ChipPAC Taiwan Semiconductor have estimated stronger performance for the second quarter of...

ASE 1Q revenue drop expected to narrow from original forecast

Newswatch - Mar 27, 17:13

With Amkor Technology recently revising up its gross margin outlook for the first quarter and indicating that its revenues will fall into the avorable end of the range of the company's...

Wafer testing companies to see revenues move up in March on improved order visibility

Mar 12, 14:12

Most Taiwan-based wafer testing companies, including King Yuan Electronics (KYEC), Ardentec and STATS ChipPAC Taiwan Semiconductor, expect March revenues to perform better than those...

ASE 1Q09 revenues to slide up to 40%; capex slashed

Feb 13, 12:17

Advanced Semiconductor Engineering (ASE) has estimated that its sales in the first quarter of 2009 may drop 35-40% sequentially amid a continuing dim outlook. The wafer packaging...

STATS ChipPAC swings to losses in 4Q08

Feb 12, 11:43

Singapore's STATS ChipPAC has posted sales of US$324.6 million for the fourth quarter of 2008, down 31.3% sequentially and 31.9% from 2007. For the full year 2008, the packaging and...

More players in packaging and testing sector may lower 4Q forecasts

Dec 3, 01:00

With Advanced Semiconductor Engineering (ASE) lowering its fourth-quarter guidance closely on the heels of a grimmer outlook offered by Taiwan Semiconductor Manufacturing Company...

STMicroelectronics, STATS ChipPAC and Infineon to set new milestone in establishing wafer-level packaging standards

Aug 8, 09:49

STMicroelectronics, STATS ChipPAC and Infineon Technologies announced that they have signed an agreement to jointly develop next-generation embedded wafer-level ball-grid array (eWLB)...

IC testing houses confident in strong seasonal demand upsurge in 3Q08

Jun 23, 14:34

Despite second-quarter performance that failed to meet expectations, major IC testing houses in Taiwan foresee a demand pickup alongside seasonality in the third quarter.