Taipei, Wednesday, August 31, 2016 05:36 (GMT+8)
mostly cloudy
Taipei
31°C
News tagged STATS ChipPAC
  • Last update: Thursday 21 July 2016 [85 news items]

STATS ChipPAC announces volume manufacturing of fcCuBE technology

Jul 9, 14:34

STATS ChipPAC has announced its fcCuBE technology - an advanced flip chip packaging technology that features copper (Cu) column bumps, bond-on-lead (BOL) interconnection and enhanced...

IC testing firms see sales continue to rise in May-June

Jun 12, 01:30

Sales at major IC backend service companies, including King Yuan Electronics (KYEC), Sigurd Microelectronics, STATS ChipPAC Taiwan Semiconductor and Adventec, all continued to trend...

STATS ChipPAC looks to strong sales in 2Q12

Jun 6, 13:45

IC testing house STATS ChipPAC Taiwan Semiconductor has revealed that orders from its major clients have been steady in the second quarter of 2012, which will ensure its revenues...

STATS ChipPAC 1Q12 revenues up, KYEC down

Apr 27, 01:30

Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, saw first-quarter 2012 revenues reach NT$330 million (US$11.3 million), up 25.7% on...

STATS ChipPAC Taiwan expects 1Q12 sales to rise 15-20%

Mar 30, 01:10

Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, expects its revenues to increase 15-20% sequentially in the first quarter of 2012...

STATS ChipPAC revises guidance for 1Q12

Mar 20, 01:25

Semiconductor test and packaging service provider STATS ChipPAC now expects its revenues to register a 9-11% sequential decline in the first quarter of 2012, citing weaker-than-expected...

STATS ChipPAC intros new 3D eWLB PoP solutions

Mar 7, 11:35

STATS ChipPAC, a semiconductor test and advanced packaging service provider, has announced its next-generation three dimensional (3D) embedded wafer-level ball grid array (eWLB) package-on-package...

STATS ChipPAC Taiwan revenues pushed up by orders from TSMC, says report

Newswatch - Feb 14, 15:25

Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, saw its January revenues rise 9% sequentially buoyed by a pull-in of orders for logic...

STATS ChipPAC to shut Thailand plant

Feb 1, 14:34

STATS ChipPAC has announced that the company will not resume assembly operations in its Thailand plant due to extensive equipment and facility damage beyond economic restoration....

Taiwan IC testing houses to post single-digit sales drop in 1Q12

Jan 17, 01:05

Taiwan-based IC testing specialists including King Yuan Electronics (KYEC) and Ardentec are likely to see their first-quarter revenues decrease 5-10% sequentially affected by clients'...

STATS ChipPAC breaks ground for new factory

Jan 6, 01:20

STATS ChipPAC on January 5 hold a groundbreaking ceremony for its new factory in Singapore, according to the chip test and packaging service provider. The new 197,000-square foot...

STATS ChipPAC Taiwan to post sales growth in 1Q12 on short lead-time orders, says report

Newswatch - Jan 5, 14:00

Revenues at STATS ChipPAC Taiwan Semiconductor are expected to register slight sequential growth in the first quarter of 2012, thanks to a pull-in of testing orders for logic ICs...

STATS ChipPAC says Thailand factory to resume partial operations in 1Q12

Dec 8, 01:15

STATS ChipPac's operations in Thailand, which have been stopped since October 17 due to recent flooding in the country, are expected to resume partially in the first quarter of 2012,...

Focus on small, cost-effective packages: Q&A with STATS ChipPAC CEO Tan Lay Koon

Nov 21, 13:48

Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...

STATS ChipPAC CEO Tan Lay Koon

STATS ChipPAC completes expansion of 300mm wafer bump and WLCSP operation in Taiwan

Nov 17, 14:13

STATS ChipPAC has completed the expansion of its 300mm wafer bump and wafer-level chip-scale packaging (WLCSP) in Taiwan, according to the chip packaging and test service provider.

STATS ChipPAC to open new wafer-level packaging plant in Taiwan, says paper

Newswatch - Nov 14, 16:40

STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...

Thai flooding affects IC backend units of multiple suppliers, says IHS

Nov 4, 11:26

Numerous semiconductor suppliers headquartered around the world maintain assembly and test operations in Thailand, and many of these facilities have been affected by recent flooding...

STATS ChipPAC intros new fan-out WLP offering

Oct 6, 11:19

STATS ChipPAC has announced that its next-generation fan-out type wafer level packaging (FO-WLP) offers the technology to support a broad range of semiconductor markets including...

IC testers KYEC, SCT suffer large sequential decrease in 2Q11 profits

Aug 24, 01:00

King Yuan Electronics (KYEC) and STATS ChipPAC Taiwan Semiconductor (SCT), providers of IC testing services, saw net profits for the second quarter of 2011 drop 52.0% and 31.0% seq...

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

Copper pillar to be mainstream FC packaging technology in 2012

Jun 3, 15:43

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...

STATS ChipPAC reaches milestone of over 300 million copper wirebond units shipped

May 4, 13:45

STATS ChipPAC has shipped over 300 million semiconductor packages with copper wirebond interconnect, according to the company. Its previous milestone with shipments of more than 100...

STATS ChipPAC expands TSV offering

Apr 19, 10:38

STATS ChipPAC has expanded its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities, according to the company.

STATS ChipPAC profits surge in 2010

Jan 28, 11:07

STATS ChipPAC, a Singapore-based provider of semiconductor testing and assembly services, has announced net profits soared to US$108 million in 2010 from US$10.1 million in 2009....

STATS ChipPAC expands WLP offering with 12-inch manufacturing in Taiwan

Jan 18, 12:00

STATS ChipPAC has announced the expansion of its wafer-level package (WLP) offering with new 300mm manufacturing capabilities in Taiwan. The 300mm WLP operation is located in Hsinchu...

STATS ChipPAC, Intersil qualify copper wire interconnect for analog and mixed-signal devices

Dec 16, 01:00

STATS ChipPAC and Intersil have qualified the use of copper wire interconnect solutions on a number of high-end analog and mixed-signal devices which are in volume production, STATS...

STATS ChipPAC sees over 50% growth in flip chip business

Dec 14, 12:00

STATS ChipPAC has seen its flip chip business grow more than 50% in 2010 compared to 2009, according to the company, adding that shipments of flip chip packages have surpassed 250...

Ardentec denies merger with STATS ChipPAC

Stockwatch - Dec 3, 12:35

Wafer probing service provider Ardentec has denied a Chinese-language Economic Daily News (EDN) report indicating STATS ChipPAC has approached it to discuss a merger, according...

STATS ChipPAC increasing copper-wire bonding output

Dec 2, 01:05

Singapore-based STATS ChipPAC has cumulatively packaged 100 million chips based on copper-wire bonding process since it started using the process in November 2009, and expects to...

MediaTek reportedly negotiating new prices with UMC and backend service providers

Nov 29, 12:29

MediaTek is reportedly negotiating with United Microelectronics Corporation (UMC) as well as backend service providers including Advanced Semiconductor Engineering (ASE) and Siliconware...

STATS ChipPAC opens new plant for 300mm eWLB wafer manufacturing

Sep 15, 15:33

STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...

STATS ChipPAC intros 300mm embedded WLB wafer manufacturing

Apr 13, 12:00

STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...

TSMC to raise orders to testing partners, says paper

Newswatch - Dec 15, 16:20

Taiwan Semiconductor Manufacturing Company (TSMC) plans to no longer add new capacity for wafer testing, and increase its outsourcing to backend partners Ardentec and STATS ChipPAC...

STATS ChipPAC moves copper wire bonding process to volume production

Nov 25, 11:23

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).

SPIL says 2010 capex to double

Oct 29, 11:57

Siliconware Precision Industries (SPIL) has set its capex budget for 2010 at NT$10 billion (US$307.7 million), doubling from NT$5.3 billion allocated for 2009, according to company...

SPIL chairman Bough Lin
85 items [2/3]
Realtime news
  • LTCC module maker ACX to see revenues high in August, 3Q16

    Bits + chips - Newswatch | 7h 16min ago

  • Smartphone vendors likely to follow Samsung Electronics to adopt IR LED-based iris recognition

    LED | 8h 9min ago

  • Samsung announces mass production of 14nm Exynos chips

    Bits + chips | 8h 19min ago

  • Hiwin Technologies expects robot business to begin to profit at end of 2016, says report

    Before Going to Press | 8h 37min ago

  • Acer sets up 2 subsidiaries to develop smart home and transportation devices

    Before Going to Press | 8h 38min ago

  • Orders for iris recognition chips to boost Xintec revenues in 2017, says report

    Before Going to Press | 8h 46min ago

  • Thermal module maker AVC reports earnings for July

    Before Going to Press | 8h 46min ago

  • Connector maker Alltop posts EPS NT$2.55 for January-July period

    Before Going to Press | 8h 48min ago

  • LTCC module maker ACX to see revenues high in August, 3Q16

    Before Going to Press | 9h 15min ago

  • Mirle develops 3D curved glass forming equipment, says report

    Before Going to Press | 9h 17min ago

  • Tripod to post 5-8% revenue growth in 3Q16, says report

    Before Going to Press | 9h 36min ago

  • Taiwan market: LG launches X-series smartphones

    Before Going to Press | 9h 37min ago

  • Enterprise private, public cloud use on the rise, says VMware CEO

    Before Going to Press | 9h 56min ago

  • VMware unveils Cross-Cloud Architecture, Cloud Foundation at VMworld 2016

    Before Going to Press | 9h 58min ago

  • Taipei to host International Industrial Automation show

    Before Going to Press | 10h ago

  • LG Electronics to launch 38-inch 21:9 Ultra Wide LCD monitor

    Before Going to Press | 10h 5min ago

  • NVM IP provider eMemory unveils EcoBit technology for RFID and NFC applications

    Before Going to Press | 10h 6min ago

Pause
 | 
View more
IFSEC
Display panels for wearable devices

30-Aug-2016 markets closed

 LastChange

TAIEX (TSE)9110.17-21.55-0.24% 

TSE electronic371.6-0.99-0.27% 

GTSM (OTC)130.06-0.03-0.02% 

OTC electronic169.14+0.16+0.09% 

Analysis of China revised domestic semiconductor industry goals
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.