ASE to open China regional headquarters

Sep 20, 11:34

Packaging and testing firm Advanced Semiconductor Engineering (ASE) will hold a groundbreaking ceremony for a regional headquarters in Shanghai on September 21, and is also expected...

ChipMOS reiterates 3Q11 outlook

Sep 19, 15:16

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs, has said that its sales guidance for the third quarter of 2011 should remain on track.

ASE to sell CNY-denominated bonds, says paper

Stockwatch - Sep 14, 16:38

Taiwan-based Advanced Semiconductor Engineering (ASE) plans to issue Chinese yuan-denominated bonds worth a total of CNY650 million (US$102 million) in Hong Kong with an aim to boost...

ASE, SPIL post sequential growth in August sales

Sep 8, 01:25

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential growth of 2.9% and 6.7%, respectively, in consolidated revenues...

Proportion of copper wire bonding to rise to over 20% in 2011, says SEMI

Sep 7, 16:36

Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for...

UTAC gains controlling stake in JV with SMIC

Sep 6, 14:27

Semiconductor Manufacturing International Corporation (SMIC) has transferred nearly its entire stake in its packaging and testing joint venture to partner United Test and Assembly...

ASE plans another share buyback

Stockwatch - Sep 2, 01:05

Advanced Semiconductor Engineering (ASE) on August 29 announced that the company executed its fourth share buyback program ahead of schedule. Two days later, ASE issued a filing with...

IC production value to grow modestly through 2014, says ASE

Aug 30, 12:17

The production value of the global semiconductor industry will achieve a CAGR of at least 7% for 2011-2014, IC packager Advanced Semiconductor Engineering (ASE) has commented, adding...

Amkor, Globalfoundries team up for advanced assembly, test solutions

Aug 30, 11:08

Amkor Technology and Globalfoundries have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes, according to the companies...

Chipbond 2Q11 profits halved

Aug 24, 17:07

LCD driver IC packaging and testing firm Chipbond Technology has reported net income of NT$254 million (US$8.7 million) on revenues of NT$3.445 billion for the second quarter of 2011...

Sigurd to buy back stock

Aug 24, 10:55

Taiwan-based testing company Sigurd Microelectronics plans to buy back three million shares of its common stock at a price range between NT$15 (US$0.52) and NT$25 per share from August...

Mobile RAM outlook optimistic, say memory backend firms

Aug 23, 13:55

The outlook for mobile RAM remains optimistic despite weaker-than-expected demand thus far in 2011, according to sources at major Taiwan-based memory packaging and testing houses...

PTI cuts 2011 capex, says paper

Newswatch - Aug 22, 12:22

Memory packaging and testing firm Powertech Technology (PTI) has revised downward its capex budget for 2011 to less than NT$10 billion (US$345 million) from the previously-planned...

More firms reducing exposure in DRAM packaging and testing market

Aug 22, 12:00

The growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out...

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

ASE and SPIL look to continued growth in copper wire bonding business in 3Q11

Aug 15, 15:15

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase...

Tong Hsing 2Q11 profits meet guidance; expects flat growth in 3Q

Aug 11, 14:32

Ceramic substrate supplier Tong Hsing Electronic Industries has posted net profits of NT$214 million (US$7.37 million) for the second quarter of 2011, which met with the company's...

ASE, SPIL report revenue gains for July

Newswatch - Aug 9, 12:09

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) both have reported sequential revenue gains for July. Revenues of ASE's core IC ATM (assembly...

ASE core ATM business likely to post 2% sales growth in 3Q11

Aug 4, 01:35

Advanced Semiconductor Engineering (ASE) is expected to see sales of its ATM (assembly test and material) division increase about 2% sequentially in the third quarter of 2011, according...

Chipbond, ChipMOS expect flat revenues in 3Q11

Jul 26, 15:37

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies, in view of stagnant demand for LCD panels, expect their revenues for the third quarter of...

ASE, SPIL to post up to 5% growth in 3Q11 sales

Jul 22, 01:20

Judging from Intel's revenue outlook, market watchers expect Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) to see revenue growth of up to 5%...

ChipMOS mulls phasing out DRAM backend business

Jul 15, 01:10

Packaging and testing house ChipMOS Technologies plans to gradually phase out its DRAM packaging and testing business, and concentrate on backend services for LCD driver ICs and flash...

ChipMOS secures NT$8.4 billion syndicated loan

Jul 14, 14:08

IC packaging and testing house ChipMOS Technologies has signed an NT$8.4 billion (US$291 million) syndicated loan agreement with a banking consortium mostly to repay part of its previous...

ASE, SPIL reiterate 2011 capex outlook

Jul 14, 01:10

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have said they currently have no plans to adjust planned capex for 2011. Meanwhile, both IC packagers...

Chipbond conservative about 3Q11

Jul 13, 16:03

LCD driver IC packaging and testing firm Chipbond Technology has expressed uncertainty about the outlook for the third quarter due to low order visibility.

Chip equipment sales to grow 12% in 2011, says SEMI

Jul 12, 13:56

Worldwide sales of semiconductor manufacturing equipment will reach US$44.33 billion in 2011, representing growth of 12.1% on year, according to SEMI's mid-year forecast.

ASE core ATM business posts 4.5% growth in 2Q11 sales

Jul 8, 01:05

Advanced Semiconductor Engineering (ASE) saw sales of its ATM (assembly test and material) division decrease 3.7% sequentially to NT$10.55 billion (US$367 million) in June, due to...

DRAM backend firms post slight growth in June revenues

Jul 7, 01:30

Powertech Technology (PTI), Walton Advanced Engineering and Formosa Advanced Technologies (FATC) have reported sequential growth in revenues for June 2011 of 2.9%, 0.8% and 1.7%,...

SPIL 2Q11 sales miss guidance

Jul 6, 15:12

IC packaging and testing house Siliconware Precision Industries (SPIL) has reported consolidated revenues of NT$5.1 billion (US$176 million) for June, up 5.1% on month. Consolidated...

ASE says clients working through inventory

Jun 29, 16:47

Clients have slowed down their pace of orders since June, and are working through their chip inventories that were piled up over the previous two months, according to Tien Wu, COO...

DRAM makers negotiating for cheaper backend services, says paper

Newswatch - Jun 29, 13:37

Contract quotes for DRAM packaging and testing services have been facing downward pressure, and are likely to decline over 10% in the third quarter of 2011, according to a Chinese-language...