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News tagged packaging and testing
  • Last update: Wednesday 13 May 2015 [729 news items]

ASE lands pull-in of copper wirebonding orders

Jun 27, 14:40

IC backend service company Advanced Semiconductor Engineering (ASE) has seen its Europe- and US-based fabless clients adopting copper wire to package their products since the beginning...

Walton 2Q13 profits to leap as orders soar

Jun 26, 11:06

Memory-IC packaging and testing firm Walton Advanced Engineering has enjoyed a ramp-up in orders for mobile DRAM and niche-market memory chips in the second quarter of 2013, and seen...

FATC to see strong rebound in June, says report

Newswatch - Jun 24, 16:12

Formosa Advanced Technologies (FATC), which provides backend services for DRAM manufacturers Nanya Technology and Inotera Memories, will see its June sales rebound significantly on...

ChipMOS to expand capacity for LCD driver ICs, says chairman

Jun 24, 15:52

Packaging and testing firm ChipMOS Technologies plans to expand 12-inch wafer bumping and testing capacity for LCD driver ICs, according to company chairman and CEO SJ Cheng. Overall...

Commentary: Tier-two LCD driver IC houses to face shortages in 3Q13

Jun 24, 10:30

China's smartphone market continues to boom and demand for related components from domestic brands has been strong in the first half of 2013. Demand for small-size panels above 5-inch...

IC material distributor Niching sees rising shipments

Jun 21, 15:37

IC material distributor Niching Industrial has seen its shipments ramp up, thanks to increasing capacity utilization rates at semiconductor packaging and testing firms and strong...

SPIL expanding capacity for high-end ICs

Jun 17, 21:29

Siliconware Precision Industries (SPIL) has moved to expand production capacity at a fast pace for high-end IC packaging and testing in anticipation of robust demand for mobile communication...

SPIL chairman Bough Lin

High-end IC backend demand to pick up in 2H13, says SPIL chair

Jun 14, 16:09

Demand for high-end IC packaging and testing is expected to pick up in the second half of 2013 and enjoy sequential growth through the last quarter of the year, thanks to a pull-in...

SPIL chairman Bough Lin

PTI May sales fall 21% from year ago

Jun 11, 15:10

Powertech Technology (PTI), which specializes in backend services for memory ICs, has announced consolidated sales for May 2013 fell 20.6% from a year ago to NT$3.15 billion (US$105...

ASE IC backend unit posts record revenues in May

Jun 10, 22:35

Sales of Advanced Semiconductor Engineering's (ASE) core ATM (assembly test and material) business increased 6.3% sequentially and 12.2% from a year ago to NT$12.41 billion (US$419...

SPIL to hike capex budget for 2013

May 29, 22:15

IC backend service company Siliconware Precision Industries (SPIL) has decided to hike its capex budget for 2013 to NT$14.9 billion (US$496.14 million), up nearly 32% from NT$11.3...

STATS ChipPAC to pump another US$500 million into expansion in Singapore

May 29, 11:19

STATS ChipPAC has unveiled plans to invest another US$500 million to expand its operations in Singapore, where the IC backend house is headquartered.

ChipMOS capex for 2013 to reach NT$2.5-2.8 billion

May 20, 16:23

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, expects its capex for 2013 to total NT$2.5-2.8 billion (US$83.6-93.6 million)...

chipmos chairman SJ Cheng

ASE to buy Toshiba backend plant in China

May 16, 11:34

IC packager Advanced Semiconductor Engineering (ASE) announced on May 15 that the company has reached a deal with Toshiba Semiconductor (Wuxi) in China to acquire its chip assembly...

Walton generates more revenues from specialty DRAM, says report

Newswatch - May 7, 10:16

Packaging and testing company Walton Advanced Engineering, which long focused on the PC DRAM market, has seen sales generated from the orders for specialty DRAM (SDRAM) chips account...

Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner

May 3, 15:13

The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.

Supply for high-end IC packaging to fall short in 2H13, says SPIL chair

May 2, 14:49

Supply for high-end IC packaging is likely to fall short of demand during the second half of 2013, according to Bough Lin, chairman for Siliconware Precision Industries (SPIL). SPIL...

SPIL chairman Bough Lin

ASE expects 11-14% growth in 2Q13 shipments

Apr 29, 10:32

IC packaging and testing house Advanced Semiconductor Engineering (ASE) expects shipments to increase 11-14% sequentially and gross margin to rise to 23.2% in second-quarter 2013,...

ChipMOS subsidiary begins trading on Taiwan emerging stock board

Apr 22, 15:39

ChipMOS Taiwan, a subsidiary of semiconductor assembly and test services provider ChipMOS Technologies, on April 19 started trading on the Emerging Stock Board of the Taiwan Stock...

ASE breaks ground for new factory buildings in southern Taiwan

Apr 12, 11:55

Semiconductor assembly and testing company Advanced Semiconductor Engineering (ASE) on April 12 held a groundbreaking ceremony for two new factory buildings, one designated for production...

ASE, SPIL March sales rebound

Apr 9, 15:35

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their monthly revenues rebound to a sequential growth track in March 2013...

ASE to issue NT$15 billion convertible bonds

Stockwatch - Apr 9, 12:23

Taiwan-based Advanced Semiconductor Engineering (ASE), which provides semiconductor assembly and test services, has unveiled plans to issue overseas convertible bonds worth up to...

PTI-Greatek deal probed for possible insider trading

Mar 21, 22:07

The Taipei Prosecutor's Office on March 21 began an investigation into possible insider trading before Powertech Technology (PTI) made its acquisition of a controlling stake in Greatek...

Memory IC backend firms seeing demand pick up

Mar 21, 14:55

Upcoming roll-outs of new smartphones and other mobile devices are set to drive demand for NAND flash and mobile DRAM chips, according to Taiwan-based memory IC packaging and testing...

Packaging material supplier Chang Wah to post double-digit revenue growth in 2Q13

Mar 20, 14:19

Packaging material supplier Chang Wah Electromaterials is expected to post a double-digit growth in revenues in the second quarter of 2013, powered by increasing orders for flip chip...

Greatek looks to improved profitability on copper wire bonding lines

Mar 13, 13:51

Logic IC packaging firm Greatek Electronics has revealed that copper wire bonding packaging lines are currently contributing more than 50% to its total revenues, which will further...

IC testing firms post revenue drops in February

Mar 12, 15:35

King Yuan Electronics (KYEC), Sigurd Microelectronics and STATS ChipPAC Taiwan Semiconductor all suffered sequential revenue decreases in February 2013, due to inventory adjustments...

Digitimes Research: Taiwan IC backend production value to outperform global industry

Feb 26, 15:42

Production value of Taiwan's dedicated semiconductor packaging and testing industry is forecast to grow 4.9% to US$13.88 billion in 2013, while the global industry will generate a...

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PTI expects recovery starting 2Q13

Feb 6, 22:22

Packaging and testing firm Powertech Technology (PTI) expects business to pick up in the second quarter, and continue to recover for the rest of 2013. said company chairman DK Tsai...

Renesas, J-Devices sign MoU on transfer of backend facilities

Jan 31, 16:44

Renesas Electronics and J-Devices have signed a memorandum of understanding regarding the transfer of three semiconductor backend production facilities operated by Renesas and its...

IC backend firms to suffer setback in January-February, says SPIL chair

Jan 31, 12:15

IC packaging and testing companies will suffer setbacks in revenues during January and February because of inventory adjustments at clients, as well as fewer working days due to the...

SPIL chairman Bough Lin

ASE, SPIL to stop ramping copper wirebonding capacity

Jan 31, 11:03

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both stated that they will stop ramping up capacity for copper wire-bonding. Instead, raising...

STATS ChipPAC enters into license and settlement agreement with Tessera

Jan 29, 11:30

STATS ChipPAC announced on January 29 that it has signed a patent license and settlement agreement with Tessera. The agreement results in the dismissal of all claims and counterclaims...

ASE, SPIL 1Q13 sales likely to drop 10% or more

Jan 28, 20:58

Sales at IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will likely register sequential decreases of 10% or more...

Walton to cut 2013 capex, provides cautious outlook

Jan 22, 21:50

Walton Advanced Engineering, which provides packaging and testing services for memory chips, has expressed caution about its business outlook for 2013. Filling under-utilized capacity...

729 items [5/21]
2015 China IC design market forecast
2015 China smartphone panel trend forecast

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2015 global notebook demand forecast
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