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News tagged packaging and testing
  • Last update: Thursday 9 October 2014 [685 news items]

Chipbond to post better-than-expected 4Q12 sales

Dec 6, 15:31

LCD-driver-IC packaging and testing house Chipbond Technology is expected to report an up to 5% sequential increase in consolidated revenues for the fourth quarter of 2012, bucking...

MPI November sales up 20%

Dec 5, 11:46

MJC Probe (MPI), which specializes in the manufacture of probe cards for wafer testing, has announced that revenues for November 2012 increased 20.9% sequentially to NT$292 million...

Taiwan IC backend production value to dip in 4Q12, says IEK

Nov 20, 13:45

The production value of Taiwan's IC packaging and testing industry sectors registered sequential growth of 2% and 2.3%, respectively, in the third quarter of 2012, according to data...

STATS ChipPAC to expand operations in Korea

Nov 20, 13:42

STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...

Toshiba temporarily reopens semiconductor facility in Thailand

Nov 14, 16:06

Toshiba has resumed manufacturing at its chip plant in Pathumthani, Thailand in order to meet healthy demand for discrete products for smartphones and tablets, according to the Japan-based...

ASE to post better-than-seasonal sales for 1Q13

Nov 8, 10:02

IC packaging and testing house Advanced Semiconductor Engineering (ASE) is expected to post an only a single-digit sales drop sequentially in the first quarter of 2013, compared to...

SPIL October sales highest for 2012

Nov 6, 14:34

Consolidated revenues at Siliconware Precision Industries (SPIL) in October hit the highest monthly level thus far in 2012, according to statistics released by the Taiwan-based IC...

High PC-DRAM inventory affecting business, says PTI chairman

Nov 1, 13:41

The PC-DRAM industry will carry on its inventory correction through the first quarter of 2013, before staging a rebound in the following quarter, according to DK Tsai, chairman of...

SPIL expects 4Q12 revenues to stay flat or drop slightly

Oct 31, 13:57

IC packager Siliconware Precision Industries (SPIL) expects its consolidated revenues to stay flat or drop by up to 3% sequentially in the fourth quarter of 2012, due to weak demand...

SPIL chairman Bough Lin conservative about company performance in 4Q12

ASE expects 4Q12 IC backend shipments to rise 3-5% sequentially

Oct 29, 11:56

Advanced Semiconductor Engineering (ASE), the largest Taiwan-based IC packaging and testing houses, expects its shipments in the fourth quarter of 2012 to increase on quarter by 3-5%...

STATS ChipPAC to sell stake in China joint venture

Oct 5, 14:01

STATS ChipPAC has announced plans to sell its 25% stake in a China-based joint venture to co-owner Wuxi China Resources Microelectronics, a wholly-owned subsidiary of China Resources...

STATS ChipPAC receives compensation for damage caused by Thai flooding

Oct 2, 01:20

STATS ChipPAC has reached a property damage insurance settlement of US$26.7 million with its insurers as compensation for its plant and equipment damaged by flooding in Thailand.

ASE breaks ground on new factory in Korea

Sep 28, 14:32

Advanced Semiconductor Engineering (ASE) recently broke ground on its second factory located in Paju City, Gyeonggi province, Korea. The new plant is slated for commercial operation...

ASE to expand operations in Korea

Rising value of NT dollar to affect performance of IC backend service firms

Sep 26, 14:40

The rising price of gold and the appreciation of the NT dollar, triggered by the launch the US Federal Reserve's third round of the quantitative easing (QE3) is expected to weigh...

PTI ramping up logic IC backend service business

Sep 21, 01:10

Powertech Technology (PTI) has managed to increase the ratio of logic IC backend service business to more than 20% of its total sales recently, and expects its 3D IC technology to...

3D IC commercialization to take place in 2015-16, says ASE

Sep 6, 09:33

The adoption and commercialization of 3D TSV stacking IC technology and products will likely take place in the 2015-16 timeframe, according to Tong Ho-ming, general manager and chief...

Tong Ho-ming, general manager and chief of R&D at ASE

STATS ChipPAC advances TSV capabilities with qualification of mid-end manufacturing

Aug 29, 16:49

STATS ChipPAC has announced that its through-silicon-via (TSV) capabilities have achieved a new milestone with the qualification of its 300mm mid-end manufacturing operation and transition...

Backend firms expect orders for 28nm chips to pick up

Aug 29, 16:10

Taiwan Semiconductor Manufacturing Company (TSMC) is producing 28nm process ICs for Qualcomm and the first batch of shipments will be delivered to packaging and testing houses in...

ChipMOS announces new share buyback program

Aug 21, 13:58

ChipMOS Technologies has announced plans to effect a new US$10 million share repurchase program in compliance with Rule 10b5-1 and Rule 10b-18 under the Securities Exchange Act of...

ChipMOS expects 4-8% growth in 3Q12 sales

Aug 20, 15:46

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, expects to post sales growth of 4-8% sequentially in the third quarter of...

Japan IDMs to increase outsourcing of logic IC backend processing

Aug 17, 11:35

Major Japan-based IDM companies including Renesas, Sony and Toshiba are set to increase outsourcing of backend processing for logic ICs, and have approached existing and potential...

Sigurd to buy stake in fellow backend firm

Stockwatch - Aug 16, 15:08

Sigurd Microelectronics, a Taiwan-based packaging and testing company specializing in consumer and mature logic ICs, has unveiled plans to participate in an upcoming fundraiser by...

KYEC holds positive view for 2H12

Aug 15, 13:56

King Yuan Electronics (KYEC) expects its sales will be driven by brisk demand coming from the handset sector in the third quarter of 2012. The IC testing house has seen orders for...

Chipbond revenues hit two-year high in July 2012

Aug 10, 14:15

LCD driver IC packaging and testing firm Chipbond Technology has announced consolidated revenues of NT$1.27 billion (US$42.3 million) for July 2012 - the highest monthly result since...

Memory backend companies post mixed results in July

Aug 9, 14:42

Memory backend service companies have posted mixed results for July, with Powertech Technology (PTI) and Formosa Advanced Technologies (FATC) seeing their revenues decline for the...

Major IC packagers step up 2012 capex

Aug 6, 15:41

Advanced Semiconductor Engineering (ASE), Amkor Technology and Siliconware Precision Industries (SPIL) – the world's leading packaging and testing houses – have all set...

PTI 2Q12 beats estimates; sees challenges ahead

Aug 1, 12:09

Memory IC packaging and testing house Powertech Technology (PTI) has reported better-than-expected revenue and EPS results for the second quarter of 2012. But looking forward, the...

ASE, SPIL make progress in transition to copper wire bonding

Jul 31, 16:12

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...

ASE, SPIL expect 3Q12 sales to rise

Jul 30, 14:27

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both expect their third-quarter sales to register another sequential growth buoyed by rising demand...

SPIL chairman Bough Lin expects company sales to grow through 4Q12

STATS ChipPAC profits fall

Jul 27, 11:46

STATS ChipPAC, a Singapore-based provider of semiconductor testing and assembly services, has announced net profits for the second quarter of its fiscal 2012 declined over 50% from...

Chipbond 3Q12 sales to grow up to 5%

Jul 13, 12:03

LCD-driver-IC packaging and testing house Chipbond Technology is expected to report sales growth of up to 5% sequentially for the third quarter of 2012, according to market sources...

STATS ChipPAC announces volume manufacturing of fcCuBE technology

Jul 9, 14:34

STATS ChipPAC has announced its fcCuBE technology - an advanced flip chip packaging technology that features copper (Cu) column bumps, bond-on-lead (BOL) interconnection and enhanced...

PTI, Walton to maintain orders after Micron-Elpida deal

Jul 3, 01:05

Micron Technology's takeover of DRAM maker Elpida Memory will not bring negative effects to Elpida's existing backend partners including Powertech Technology (PTI) and Walton Advanced...

MediaTek-MStar merger to have impact on existing suppliers

Jun 26, 12:37

The planned merger between MediaTek and MStar Semiconductor is expected to vertically integrate their supply chain. However, some market watchers speculate MediaTek will take over...

ASE to expand operations in Korea

Jun 25, 14:54

In view of the growing semiconductor industry in Korea, Advanced Semiconductor Engineering (ASE) is looking to expand its local factory site located in Paju, Gyeonggi Province, with...

685 items [5/20]
The transition to 4k TV - UHD TV market forecast, 2014-2017

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