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News tagged packaging and testing
  • Last update: Thursday 31 July 2014 [680 news items]

ChipMOS and Thailin land backend orders for fingerprint sensors, says report

Newswatch - Sep 3, 12:16

Packaging and testing company ChipMOS Technologies and its subsidiary Thailin Semiconductor, which provides testing services for memory ICs, logic ICs and mixed-signal ICs, have teamed...

ASE to land growing backend orders for Apple devices, says report

Newswatch - Aug 29, 15:56

IC packaging and testing house Advanced Semiconductor Engineering (ASE) is expected to secure backend orders for fingerprint sensors, application processors and Wi-Fi modules for...

PTI lands backend orders from MediaTek, say reports

Newswatch - Aug 23, 15:56

IC backend service company Powertech Technology (PTI) has grabbed orders for handset chips from MediaTek, with shipments scheduled to kick off in the fourth quarter of 2013, a Chinese-language...

ASE, SPIL August sales to rise

Aug 22, 20:45

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to report 3-5% sequential increases in August revenues, thanks to brisk...

IC backend services firms to see revenues peak in 3Q13

Aug 21, 09:54

IC backend services companies, including King Yuan Electronics (KYEC), Sigurd Microelectronics, STATS ChipPAC Taiwan Semiconductor and Ardentec, are expected to see their revenues...

Taiwan 3Q13 IC backend production value to register slight growth, says IEK

Aug 16, 16:13

The production value of Taiwan's IC packaging and testing industry sectors will register sequential growth of 4.6% and 4.3%, respectively, in the third quarter of 2013, according...

Chipbond sales to grow up to 5% sequentially in 3Q13

Aug 14, 21:46

LCD driver IC backend service company Chipbond Technology is expected to see its revenues grow moderately within a range of 5% sequentially in the third quarter of 2013 as demand...

Walton looks to non-PC DRAM for 2H13 growth

Aug 9, 10:45

Packaging and testing firm Walton Advanced Engineering expects rising demand for mobile DRAM and other niche-market memory chips to drive company growth in the second half of 2013.

Walton president Yu Hong-chi

ASE, SPIL July sales up

Aug 8, 16:12

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported increases in July consolidated revenues from the previous month of...

Sigurd pre-tax profits soar in 2Q13

Aug 2, 10:04

Taiwan-based testing company Sigurd Microelectronics has announced second-quarter 2013 revenues increased 13.2% sequentially to NT$1.37 billion (US$45.3 million) with pre-tax profits...

SPIL optimistic about communications IC market in 2H13

Aug 1, 15:54

Siliconware Precision Industries (SPIL) chairman Bough Lin has expressed optimism that demand for communications ICs will be strong in the second half of 2013 on the back of brisk...

SPIL chairman Bough Lin

Chipbond 3Q13 revenues may fall short of expectations

Jul 19, 15:45

A recent slowdown in demand for small- to medium-size LCD driver ICs, as well as slow adoption of Ultra HD TV sets, might have a negative impact on the sales performance of packaging...

ASE to raise additional capital through issuing new shares, bonds

Jul 16, 13:45

Taiwan-based Advanced Semiconductor Engineering (ASE) has announced plans to issue new shares and unsecured corporate bonds overseas. Proceeds from the share and bond issues will...

STATS ChipPAC Taiwan 2Q13 sales up over 15%

Jul 12, 12:03

Wafer probing service provider STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, saw its second-quarter sales increase more than 15% sequentially...

PTI 2Q13 sales rise 2.6%

Jul 11, 16:00

Powertech Technology (PTI), which provides packaging and testing services for mainly memory ICs, saw its second-quarter sales increase 2.6% sequentially.

High-end packaging next battlefield for IC assembly and test services providers, says Amkor executive

Jul 9, 15:53

Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...

Kevin Yu, Amkor sales director for Greater China

ASE IC backend biz posts record revenues in 2Q13

Jul 8, 22:04

Sales of Advanced Semiconductor Engineering's (ASE) core ATM (assembly test and material) business reported net sales of NT$36.3 billion (US$1.22 billion) for the second quarter of...

Smartphones to buoy SPIL, KYEC revenues in 3Q13

Jul 8, 16:13

IC demand for mobile devices particularly smartphones is expected to drive revenue growth at packaging and testing houses Siliconware Precision Industries (SPIL) and King Yuan Electronics...

SPIL chairman Bough Lin indicated previously that upcoming flagship phones and games consoles would

ASE, SPIL 3Q13 sales to be affected by slower sales of Galaxy S4

Jul 3, 21:59

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to see their sales for the third quarter of 2013 affected by reduced orders from...

PTI, Walton look to high utilization rates and shipments in 3Q13

Jul 2, 22:20

IC backend service companies Powertech Technology (PTI) and Walton Advanced Engineering will see their capacity utilization rates and shipments remain high in the third quarter thanks...

STATS ChipPAC to close Malaysia plant

Jul 1, 14:21

STATS ChipPAC, which provides IC assembly and test services to semiconductor companies and electronics OEMs, has unveiled plans to consolidate manufacturing at its production units...

ASE lands pull-in of copper wirebonding orders

Jun 27, 14:40

IC backend service company Advanced Semiconductor Engineering (ASE) has seen its Europe- and US-based fabless clients adopting copper wire to package their products since the beginning...

Walton 2Q13 profits to leap as orders soar

Jun 26, 11:06

Memory-IC packaging and testing firm Walton Advanced Engineering has enjoyed a ramp-up in orders for mobile DRAM and niche-market memory chips in the second quarter of 2013, and seen...

FATC to see strong rebound in June, says report

Newswatch - Jun 24, 16:12

Formosa Advanced Technologies (FATC), which provides backend services for DRAM manufacturers Nanya Technology and Inotera Memories, will see its June sales rebound significantly on...

ChipMOS to expand capacity for LCD driver ICs, says chairman

Jun 24, 15:52

Packaging and testing firm ChipMOS Technologies plans to expand 12-inch wafer bumping and testing capacity for LCD driver ICs, according to company chairman and CEO SJ Cheng. Overall...

Commentary: Tier-two LCD driver IC houses to face shortages in 3Q13

Jun 24, 10:30

China's smartphone market continues to boom and demand for related components from domestic brands has been strong in the first half of 2013. Demand for small-size panels above 5-inch...

IC material distributor Niching sees rising shipments

Jun 21, 15:37

IC material distributor Niching Industrial has seen its shipments ramp up, thanks to increasing capacity utilization rates at semiconductor packaging and testing firms and strong...

SPIL expanding capacity for high-end ICs

Jun 17, 21:29

Siliconware Precision Industries (SPIL) has moved to expand production capacity at a fast pace for high-end IC packaging and testing in anticipation of robust demand for mobile communication...

SPIL chairman Bough Lin

High-end IC backend demand to pick up in 2H13, says SPIL chair

Jun 14, 16:09

Demand for high-end IC packaging and testing is expected to pick up in the second half of 2013 and enjoy sequential growth through the last quarter of the year, thanks to a pull-in...

SPIL chairman Bough Lin

PTI May sales fall 21% from year ago

Jun 11, 15:10

Powertech Technology (PTI), which specializes in backend services for memory ICs, has announced consolidated sales for May 2013 fell 20.6% from a year ago to NT$3.15 billion (US$105...

ASE IC backend unit posts record revenues in May

Jun 10, 22:35

Sales of Advanced Semiconductor Engineering's (ASE) core ATM (assembly test and material) business increased 6.3% sequentially and 12.2% from a year ago to NT$12.41 billion (US$419...

SPIL to hike capex budget for 2013

May 29, 22:15

IC backend service company Siliconware Precision Industries (SPIL) has decided to hike its capex budget for 2013 to NT$14.9 billion (US$496.14 million), up nearly 32% from NT$11.3...

STATS ChipPAC to pump another US$500 million into expansion in Singapore

May 29, 11:19

STATS ChipPAC has unveiled plans to invest another US$500 million to expand its operations in Singapore, where the IC backend house is headquartered.

ChipMOS capex for 2013 to reach NT$2.5-2.8 billion

May 20, 16:23

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, expects its capex for 2013 to total NT$2.5-2.8 billion (US$83.6-93.6 million)...

chipmos chairman SJ Cheng

ASE to buy Toshiba backend plant in China

May 16, 11:34

IC packager Advanced Semiconductor Engineering (ASE) announced on May 15 that the company has reached a deal with Toshiba Semiconductor (Wuxi) in China to acquire its chip assembly...

680 items [3/20]
Realtime news
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    Bits + chips | 5h 45min ago

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  • Young Optics nets NT$54 million for 1H14

    Before Going to Press | 6h 57min ago

  • China market: Gome to start price-cuts to promote LCD TVs in August, says report

    Before Going to Press | 7h 1min ago

  • Teco to exhibit cloud-based smart home appliances at TAIROS

    Before Going to Press | 7h 16min ago

  • Samsung reports decreased handset and tablet shipments for 2Q14

    Before Going to Press | 7h 18min ago

  • PCB/LCD equipment supplier Asia Neo Tech to debut on OTC market

    Before Going to Press | 7h 43min ago

  • Nearly 50 firms stepping into 3D printing, says ITRI

    Before Going to Press | 7h 54min ago

  • Radiant Opto-Electronics nets NT$3.07 per share for 1H14

    Before Going to Press | 7h 56min ago

  • Taiwan market: WD launches NAS HDDs

    Before Going to Press | 7h 56min ago

  • Russia market: Smartphone competition heating up

    Before Going to Press | 7h 57min ago

  • Taiwan panel makers plan to cooperate with China TV vendors to tap international market

    Before Going to Press | 7h 57min ago

  • UMC to ramp 28nm wafer capacity

    Before Going to Press | 7h 58min ago

  • Wintek becomes major touch panel supplier for Xiaomi

    Before Going to Press | 7h 59min ago

  • HTC swings to profitability in 2Q14

    Before Going to Press | 8h ago

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