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News tagged packaging and testing
  • Last update: Friday 11 April 2014 [666 news items]

PTI expects recovery starting 2Q13

Feb 6, 22:22

Packaging and testing firm Powertech Technology (PTI) expects business to pick up in the second quarter, and continue to recover for the rest of 2013. said company chairman DK Tsai...

Renesas, J-Devices sign MoU on transfer of backend facilities

Jan 31, 16:44

Renesas Electronics and J-Devices have signed a memorandum of understanding regarding the transfer of three semiconductor backend production facilities operated by Renesas and its...

IC backend firms to suffer setback in January-February, says SPIL chair

Jan 31, 12:15

IC packaging and testing companies will suffer setbacks in revenues during January and February because of inventory adjustments at clients, as well as fewer working days due to the...

SPIL chairman Bough Lin

ASE, SPIL to stop ramping copper wirebonding capacity

Jan 31, 11:03

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both stated that they will stop ramping up capacity for copper wire-bonding. Instead, raising...

STATS ChipPAC enters into license and settlement agreement with Tessera

Jan 29, 11:30

STATS ChipPAC announced on January 29 that it has signed a patent license and settlement agreement with Tessera. The agreement results in the dismissal of all claims and counterclaims...

ASE, SPIL 1Q13 sales likely to drop 10% or more

Jan 28, 20:58

Sales at IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will likely register sequential decreases of 10% or more...

Walton to cut 2013 capex, provides cautious outlook

Jan 22, 21:50

Walton Advanced Engineering, which provides packaging and testing services for memory chips, has expressed caution about its business outlook for 2013. Filling under-utilized capacity...

Chipbond, ChipMOS 2013 capex to stay flat

Jan 22, 19:58

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies will have their capex for 2013 stay unchanged at the prior year's level.

Chipbond posts record sales in 4Q, 2012

Jan 14, 20:19

Consolidated revenues at Taiwan-based Chipbond Technology, a packaging and testing house specializing in LCD driver ICs, climbed to an all-time high of NT$4.17 billion (US$144.1 million)...

ASE, SPIL 4Q12 sales miss guidance

Jan 10, 14:09

Packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their core business revenues miss their guidance of 2-5%...

Sigurd posts profit growth in 2012

Jan 9, 15:26

Taiwan-based testing company Sigurd Microelectronics has reported pre-tax profits of NT$1.12 billion (US$38.5 million) for 2012, representing a 25% increase.

Seasonal factors push KYEC revenues down in 4Q12

Jan 8, 13:58

IC testing firm King Yuan Electronics (KYEC) has announced that revenues for the fourth quarter of 2012 slipped 7.8% sequentially to NT$3.28 billion (US$112.9 million), citing seasonal...

STATS ChipPAC raises 4Q12 revenue outlook

Jan 4, 14:49

STATS ChipPAC, a semiconductor test and packaging service provider, has revised upward its fourth-quarter revenue guidance to a 16-18% sequential increase from the 2-8% growth estimated...

Sigurd plans flat capex in 2013

Dec 27, 22:14

IC packaging and testing house Sigurd Microelectronics expects to maintain its 2013 capex at the same level as 2012. The expenditures will be spent on expanding capacity and R&...

IC backend services firms to ride high as TSMC ramps capex for 2013, say sources

Dec 17, 21:37

Taiwan-based IC backend services companies will benefit from an increase in capital expenditure (capex) by Taiwan Semiconductor Manufacturing Company (TSMC) in 2013, according to...

Sigurd posts record monthly sales

Dec 13, 16:14

Taiwan-based Sigurd Microelectronics, a packaging and testing company specializing in consumer and mature logic ICs, has announced that consolidated revenues for November 2012 climbed...

Chipbond to post better-than-expected 4Q12 sales

Dec 6, 15:31

LCD-driver-IC packaging and testing house Chipbond Technology is expected to report an up to 5% sequential increase in consolidated revenues for the fourth quarter of 2012, bucking...

MPI November sales up 20%

Dec 5, 11:46

MJC Probe (MPI), which specializes in the manufacture of probe cards for wafer testing, has announced that revenues for November 2012 increased 20.9% sequentially to NT$292 million...

Taiwan IC backend production value to dip in 4Q12, says IEK

Nov 20, 13:45

The production value of Taiwan's IC packaging and testing industry sectors registered sequential growth of 2% and 2.3%, respectively, in the third quarter of 2012, according to data...

STATS ChipPAC to expand operations in Korea

Nov 20, 13:42

STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...

Toshiba temporarily reopens semiconductor facility in Thailand

Nov 14, 16:06

Toshiba has resumed manufacturing at its chip plant in Pathumthani, Thailand in order to meet healthy demand for discrete products for smartphones and tablets, according to the Japan-based...

ASE to post better-than-seasonal sales for 1Q13

Nov 8, 10:02

IC packaging and testing house Advanced Semiconductor Engineering (ASE) is expected to post an only a single-digit sales drop sequentially in the first quarter of 2013, compared to...

SPIL October sales highest for 2012

Nov 6, 14:34

Consolidated revenues at Siliconware Precision Industries (SPIL) in October hit the highest monthly level thus far in 2012, according to statistics released by the Taiwan-based IC...

High PC-DRAM inventory affecting business, says PTI chairman

Nov 1, 13:41

The PC-DRAM industry will carry on its inventory correction through the first quarter of 2013, before staging a rebound in the following quarter, according to DK Tsai, chairman of...

SPIL expects 4Q12 revenues to stay flat or drop slightly

Oct 31, 13:57

IC packager Siliconware Precision Industries (SPIL) expects its consolidated revenues to stay flat or drop by up to 3% sequentially in the fourth quarter of 2012, due to weak demand...

SPIL chairman Bough Lin conservative about company performance in 4Q12

ASE expects 4Q12 IC backend shipments to rise 3-5% sequentially

Oct 29, 11:56

Advanced Semiconductor Engineering (ASE), the largest Taiwan-based IC packaging and testing houses, expects its shipments in the fourth quarter of 2012 to increase on quarter by 3-5%...

STATS ChipPAC to sell stake in China joint venture

Oct 5, 14:01

STATS ChipPAC has announced plans to sell its 25% stake in a China-based joint venture to co-owner Wuxi China Resources Microelectronics, a wholly-owned subsidiary of China Resources...

STATS ChipPAC receives compensation for damage caused by Thai flooding

Oct 2, 01:20

STATS ChipPAC has reached a property damage insurance settlement of US$26.7 million with its insurers as compensation for its plant and equipment damaged by flooding in Thailand.

ASE breaks ground on new factory in Korea

Sep 28, 14:32

Advanced Semiconductor Engineering (ASE) recently broke ground on its second factory located in Paju City, Gyeonggi province, Korea. The new plant is slated for commercial operation...

ASE to expand operations in Korea

Rising value of NT dollar to affect performance of IC backend service firms

Sep 26, 14:40

The rising price of gold and the appreciation of the NT dollar, triggered by the launch the US Federal Reserve's third round of the quantitative easing (QE3) is expected to weigh...

PTI ramping up logic IC backend service business

Sep 21, 01:10

Powertech Technology (PTI) has managed to increase the ratio of logic IC backend service business to more than 20% of its total sales recently, and expects its 3D IC technology to...

3D IC commercialization to take place in 2015-16, says ASE

Sep 6, 09:33

The adoption and commercialization of 3D TSV stacking IC technology and products will likely take place in the 2015-16 timeframe, according to Tong Ho-ming, general manager and chief...

Tong Ho-ming, general manager and chief of R&D at ASE

STATS ChipPAC advances TSV capabilities with qualification of mid-end manufacturing

Aug 29, 16:49

STATS ChipPAC has announced that its through-silicon-via (TSV) capabilities have achieved a new milestone with the qualification of its 300mm mid-end manufacturing operation and transition...

Backend firms expect orders for 28nm chips to pick up

Aug 29, 16:10

Taiwan Semiconductor Manufacturing Company (TSMC) is producing 28nm process ICs for Qualcomm and the first batch of shipments will be delivered to packaging and testing houses in...

ChipMOS announces new share buyback program

Aug 21, 13:58

ChipMOS Technologies has announced plans to effect a new US$10 million share repurchase program in compliance with Rule 10b5-1 and Rule 10b-18 under the Securities Exchange Act of...

666 items [4/20]
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