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Tuesday 9 April 2024
TSMC's seismic shield: unmatched resilience amid 7.2-magnitude earthquake turmoil
TSMC has swiftly recovered in the wake of the devastating 7.2-magnitude Hualien earthquake on April 3.
Tuesday 9 April 2024
Is Intel benchmarking itself against TSMC in its roadmap to restore glory?
How will Intel Foundry (IF) return to the forefront? Is 2024 the time when Intel will catch up with TSMC's 2nm?
Tuesday 9 April 2024
Samsung reportedly to announce new investment plans next week
After the Wall Street Journal reported that Samsung Electronics will double its investment in Taylor, Texas, the US Department of Commerce (DOC) announced granting US$6.6...
Tuesday 9 April 2024
Electronics players suggest Taiwan- Japan collaboration to bolster natural disaster preparedness
Operations at Taiwan-based PCB and OSAT companies have returned to normal after a 7.2-magnitude earthquake hit the island on April 3. As Taiwan becomes a critical IC production hub...
Tuesday 9 April 2024
Microchip expands speciality node partnership with TSMC
Microchip Technology has announced an expansion of its partnership with TSMC to enable specialized 40nm manufacturing capacity at Japan Advanced Semiconductor Manufacturing (JASM),...
Tuesday 9 April 2024
Samsung and SK Hynix continue to expand DRAM production
Samsung and SK Hynix's profitability is set to significantly improve.
Tuesday 9 April 2024
How can Intel Foundry shake off 10 years of deficits?
According to the restructured accounting model of Intel Foundry (IF), it has been seeing continuous operational losses for three consecutive years from 2021 to 2023, totaling US$5.1...
Tuesday 9 April 2024
Advanced chips 100% made in US will be possible
According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...
Monday 8 April 2024
TSMC plans a third fab in Arizona and to receive up to US$6.6 billion in Chips Act funding
TSMC today announced that the US Department of Commerce and TSMC Arizona have signed a non-binding preliminary memorandum of terms (PMT) for up to US$6.6 billion in direct funding...
Monday 8 April 2024
Memory chip vendors suspend 2Q24 contract pricing in wake of Taiwan tremor
DRAM makers have temporarily stopped offering product quotes, signaling a likelihood that there will be major increases in prices in the wake of a strong earthquake that shook Taiwan...
Monday 8 April 2024
Global semiconductor sales increase 16% in February, says SIA
According to the Semiconductor Industry Association (SIA), global semiconductor sales totaled US$46.2 billion in February 2024, up 16.3% from US$39.7 billion a year earlier.
Monday 8 April 2024
Samsung's advanced packaging reportedly grabs Nvidia orders amid competition with TSMC
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
Monday 8 April 2024
SK Hynix enters investment deal for advanced chip packaging with Indiana
SK Hynix recently announced plans to invest an estimated US$3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
Monday 8 April 2024
Why do quake-ridden Taiwan and Japan thrive in semiconductor industry?
After the 7.4 magnitude earthquake hit northeastern Taiwan, TSMC's speedy recovery to resume operation on the late evening of April 5 demonstrated the resilience and flexibility of...
Monday 8 April 2024
Indian server maker Mega Networks planning AI servers and OSAT plant
Mega Networks, an Indian server solutions provider with almost 28 years of experience, is planning to bring out AI servers and enter the semiconductor packaging segment.