Taipei, Tuesday, December 19, 2017 00:44 (GMT+8)
News tagged IC manufacturing
  • Last update: Monday 18 December 2017 [12779 news items]

Globalfoundries charts 2-pronged approach for FD-SOI process

8h 16min ago

Globalfoundries (GF) will have its 12-inch wafer fabs in Dresden, Germany focus on using FD-SOI (fully-depleted silicon-on-insulator) process technology to fabricate automotive-use...

GF vice president Thomas Morgenstern Lien, Digitimes, December 2017

Chipbond seeking to cement China market share, says chairman

9h 47min ago

Taiwan-based LCD driver IC packaging and testing service provider Chipbond Technology's latest strategic investment deployments in China are mainly designed to consolidate its market...

Kilopass NVM OTP IP achieves 3-lot qualification on GF 14nm LPP technology

10h 28min ago

Kilopass Technology, a provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), has announced that it has achieved a 3-lot qualification on...

North American semiconductor equipment industry billings up in November, says SEMI

12h 20min ago

North America-based manufacturers of semiconductor equipment posted US$2.05 billion in billings worldwide in November 2017 (three-month average basis), according to SEMI.

ASE, SPIL reschedule stock swap for October 2018

Dec 18, 11:08

IC packaging and testing service providers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have decided to defer the long stop date for share...

IC substrates distributor Niching upbeat about 2018 performance

Dec 15, 16:32

Taiwan-based semiconductor packaging material and equipment distributor Niching Industrial is optimistic about its 2018 performance due to rising demand for memory IC substrates,...

Chipbond to sell stake in China-based subsidiary

Dec 15, 16:22

LCD driver IC packaging and testing service provider Chipbond Technology will sell a 53.69% stake in Chipmore Technology, its subsidiary based in Suzhou, to a group of investors consisting...

Chipbond chairman Wu Fei-jain

MediaTek Sensio-powered smartphones, wearables to hit market in 1Q18

Dec 15, 15:08

MediaTek has revealed that it has received orders for its newly released health monitoring solution, Sensio MT6381, from China-based first-tier smartphone vendors and other wearable...

MediaTek wireless communications business general manager TL Lee

NXP pushing partnerships with China developers

Dec 14, 15:54

NXP Semiconductors has announced a strategic partnership with Alibaba Cloud, the cloud computing and business unit of Alibaba Group. The two companies are working together to enable...

Taiwan science parks post January-October revenues of NT$1.998 trillion

Dec 14, 10:50

Government-run Hsinchu Science Park (HSP), Southern Taiwan Science Park (STSP) and Central Taiwan Science Park (CTSP) generated combined revenues of NT$1.998 trillion (US$66.11 billion)...

TSMC still upbeat about HPC chips, says chairman

Dec 13, 16:29

Clients' demand for HPC (high-speed computing) chips at TSMC (Taiwan Semiconductor Manufacturing Company) has remained strong without signs of ebbing, according to company chairman...

Lite-On, Tsinghua Unigroup team up to tap China storage market

Dec 13, 15:36

Taiwan-based Lite-On Technology will team up with China's Tsinghua Unigroup to jointly develop the China market for storage products such as solid state drives (SSD), with the latter...

Win Semi to buy HBT production equipment from Avago

Dec 13, 15:12

GaAs foundry house Win Semiconductors has signed a MoU to purchase a batch of HBT (heterojunction bipolar transistor) production equipment from its strategic partner Avago Technologies...

Qualcomm, MediaTek yet to advance to 7nm node

Dec 13, 14:48

Qualcomm has decided to continue adopting Samsung's 10nm process for fabricating its newly released Snapdragon 845 chipset for smartphones, instead of advancing to 7nm process node...

Semiconductor equipment market to break record in 2017, says SEMI

Dec 13, 13:49

SEMI has projected that worldwide sales of new semiconductor manufacturing equipment will increase 35.6% to US$55.9 billion in 2017, marking the first time that the semiconductor...

SJ Semi signs purchase agreement with Advantest

Dec 13, 13:42

Advantest and China-based SJ Semiconductor have signed a volume purchase agreement that calls for China's middle-end-of-line (MEOL) semiconductor test-service company to buy T5830...

Certification service provider IST set for strong sales in 2018

Dec 12, 15:45

Certification service firm Integrated Service Technology (IST) is braced for strong sales in 2018, buoyed by the commencement of two new factories and emerging multiple applications...

Taiwan IC materials suppliers expect better revenue records in 2018

Dec 12, 14:21

Taiwan's major semiconductor materials distributors such as Topco Scientific and Wah Lee Industrial have reported revenue increases in the first 11 months of 2017 and expect better...

Apple Watch 3 shipment growth to benefit Taiwan IC packagers in 2018

Dec 11, 15:25

Shipments of Apple Watch 3 are expected to surge 20% on year to reach 23-25 million units in the coming year, which will greatly benefit Taiwan players in the supply, particularly...

TSMC November revenues flat

Dec 11, 15:07

Taiwan Semiconductor Manufacturing Compay (TSMC) has announced its consolidated revenues for November 2017 reached NT$93.15 billion (US$3.1 billion), a decrease of 1.4% from October...

UMC sees November revenues decrease

Dec 11, 15:07

United Microelectronics Corporation (UMC) has reported consolidated revenues of NT$12.155 billion (US$405.13 million) for November 2017, representing a 11.98% drop on month and 5.89%...

Taiwan November exports hit record

Dec 11, 11:14

Taiwan's export value totaled US$28.88 billion in November 2017, the highest-ever monthly level with growths of 4.9% sequentially and 14.0% on year, while the month's import value...

Taiwan IC packagers eyeing auto chip orders from IDMs

Dec 8, 16:30

As the automotive-use chip sector is emerging as a new niche market with great development potential, Taiwan IC packaging and testing service providers are gearing up to scramble...

China gets big boost in semiconductor equipment localization

Dec 8, 16:10

China has taken a big stride forward in the localization of semiconductor equipment needed to support domestic chip production, as some major equipment makers have achieved technological...

TSMC Nanjing fab to start volume production in May 2018

Dec 8, 15:06

Taiwan Semiconductor Manufacturing Company (TSMC) will see its 12-inch wafer fab in Nanjing, China start volume production in May 2018, more than one quarter ahead of its original...

ASE revenues increase in November

Dec 7, 18:06

Advanced Semiconductor Engineering (ASE) has reported consolidated revenues of NT$28.09 billion (US$935.68 million) for November 2017, representing a 0.7% increase on month and 8.36%...

PTI revenues rise in November

Dec 7, 17:56

Powertech Technology Inc (PTI) has reported consolidated revenues of NT$5.632 billion (US$187.6 million) for November 2017, representing a 1.87% increase on month and 22.2% increase...

Power chip packager GEM sees record revenues for 4Q17

Dec 7, 17:53

Taiwan power semiconductor packaging and testing specialist GEM Services is expected to see its revenues for the fourth quarter of 2017 hit a new quarterly high of NT$800 million...

Digitimes Research: 12-inch silicon wafer ASP to rise 20-30% on year in 4Q17

Dec 7, 15:05

The average selling price (ASP) for 12-inch silicon wafers is estimated to surge 20-30% on year in the fourth quarter of 2017, and is expected to enjoy the same annual growth rate...

Global MOSFET suppliers seeking capacity support from Taiwan, China players

Dec 5, 15:55

With global shipments of electric cars seen to grow sharply in 2018, the supply of vital components, particularly high-voltage MOSFET (metal-oxide-semiconductor field-effect transistor)...

Backend IC service provider Sigurd sees bright prospect in 2018

Dec 5, 14:36

Taiwan-based IC packaging and testing house Sigurd Microelectronics is expected to enjoy strong revenue performance in 2018 due to more orders from Amazon for its smart speaker chips,...

IC testing firm CHPT November revenues dip to 30-month low

Dec 4, 15:55

IC testing solution provider Chunghwa Precision Test Technology (CHPT) saw its revenues fall 40% on month and 38.3% on year to a 30-month low of NT$142 million (US$4.73 million) in...

SITRI receives certification for sensors made at More than Moore line

Dec 4, 11:49

Shanghai Industrial Technology Research Institute (SITRI) has announced it has received certification for its sensors rolled out by its 8-inch More than Moore pilot test line.

SMIC announces private placement

Dec 4, 11:23

Semiconductor Manufacturing International Corporation (SMIC) has announced it has entered into an agreement with investors, including Dtang and the China IC Fund, for the placing...

China NOR flash maker GigaDevice launches strategic investment in SMIC

Dec 1, 14:48

China-based NOR flash supplier GigaDevice Semiconductor has announced subscribing to HK$532.5 million (US$68.43 million) worth of new shares issued by Semiconductor Manufacturing...

12779 items [1/366]
Realtime news
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    Before Going to Press | 3h 5min ago

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    Before Going to Press | 3h 5min ago

View more
  • Alfamation+tester+for+automotive+wireless+chargers+

    Alfamation tester for automotive wireless chargers

    Alfamation has announced a new test system for manufacturing quality control of in-car wireless chargers. The new tester supports different charging standards, including Qi, PMA,...

    Photo: Company, Nov 15.

  • Samsung+14nm+Exynos+chips

    Samsung 14nm Exynos chips

    Samsung Electronics has begun mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14nm process technology for the budget smartphone...

    Photo: Company, Aug 31.

  • Panasonic+GaN+power+transistors

    Panasonic GaN power transistors

    Panasonic has announced that it will launch the industry's smallest enhancement-mode gallium nitride (GaN) power transistors (X-GaN) package. The GaN is encapsulated into 8x8 dual-flat...

    Photo: Company, May 20.

  • Samsung+Exynos+7+Octa

    Samsung Exynos 7 Octa

    Samsung Electronics has begun mass production of mobile application processors built using 14nm FinFET process technology. Samsung's 14nm FinFET process will be adopted by its Exynos...

    Photo: Company, Feb 24.

  • New+EVG+roll%2Dto%2Droll+system

    New EVG roll-to-roll system

    EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has introduced the EVG570R2R, which the company claims...

    Photo: Company, Oct 11.

  • Foundry overview - Sep 2006

    Taiwan's semiconductor industry has begun to out-run its global peers, once more, in 2006. This followed a trough in 2004, caused by over-inventory, plus volatility in memory pricing...

  • Foundry industry overview - Jan 2005

    Foundry service providers primarily produce chips based on their customers’ or third-party firms’ intellectual property (IP). Some foundry firms also provide other types...

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

18-Dec-2017 markets closed


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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.