SK Hynix has announced its DRAM and CXL solutions have been validated with AMD's just-unveiled EPYC 9004 series processors.

Progate Group Corporation (PGC), which is among TSMC's design ecosystem partners, has expressed optimism about its operations in 2023 and will start to trade its shares on the Taipei...

AMD will utilize TSMC's CoWoS packaging for the next generation of its datacenter accelerators, according to industry sources.

High-profile semiconductor industry leaders in China recently gathered at the just-ended SEMICON China Executive Summit seeking to find ways out for China's future IC development...

For mature manufacturing process, 3D IC packaging is expected to become their alternative solution to advanced processes and will develop faster than expected under the latest US...

Taiwan-based IC substrate specialists Unimicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology are poised to generate sequential revenue increases in the fourth quarter...

Backend house Powertech Technology (PTI) expects its capex for 2023 to be about 40% lower than this year's level estimated at NT$17 billion.

The US government launched a new series of control of semiconductor export to China earlier in October - the move is expected to limit the country in designing and obtaining high-performance...

TSMC is in talks with its major clients about the adoption of its new CoWoS-R+ packaging technology for HPC chips utilizing high-bandwidth memory such as HBM3, according to industry...

TSMC has seen capacity utilization rates for advanced integrated fan-out (InFO) and chip-on-wafer-on-substrate (CoWoS) packaging start loosening in the fourth quarter of 2022, due...

TSMC is expected to see its fab capacity utilization trending downward in the next six months, except for 5nm and 28nm process nodes, as order cuts by fabless clients are beginning...

IC testing house Sigurd Microelectronics has enjoyed stable demand for wireless and HPC chips, enabling it to post about flat sequential revenue growth in September.

Automotive chips and power devices continue to see uneven supplies, and Taiwan's leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics...

MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...

Taiwan's IC design houses including MediaTek, Novatek Microelectronics and Realtek Semiconductor have sharply increased their new development projects for the next 1-2 years despite...