IC substrate maker Kinsus Interconnect Technology expects to see a sales decline of more than 15% in the fourth quarter, while its utilization rate will be in the 65-70% range and...
The number of substrate layers for the next-generation Intel Nehalem-based CPU has been decided, according to industry sources, with 12 layers being the maximum, double the current...
According to Nan Ya Printed Circuit Board (NPC), demand for traditional PCBs and wire-bonding substrates is falling but shipments of flip-chip (FC) substrates remains relatively strong...
The launch of second-phase Intel Nehalem-based CPUs (scheduled for the third quarter of 2009) is expected to have a corresponding impact on substrate demand, according to industry...
Taiwan investors forecast that sales for IC substrate makers in the third quarter will have only single-digit growth due to weak demand for wire bonding substrates and PCBs, which...
Seeing its July sales sustain an upward trend, Phoenix Precision Technology (PPT) has delivered an optimistic outlook for the third quarter, with flip-chip (FC) and chip-scale packaging...
Unimicron Technology has blamed the failure of its second-quarter profits to meet expectations to exchange losses. As demand from all major segments is showing signs of recovery,...
Nan Ya Printed Circuit Board (NPC) reiterated its strong sales guidance for the third quarter, indicating that it anticipates the utilization rate for its flip-chip (FC) substrate...
Taiwan-based flip chip (FC) substrate maker Nan Ya Printed Circuit Board (NPC) is expected to see its utilization rate reach 95% in the third quarter, with the proportion of production...
