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News tagged FC substrate
  • Last update: Wednesday 3 September 2014 [38 news items]

Niching looks to ramp up LED leadframe and FC CSP substrate shipments in 2015

Sep 3, 14:20

IC packaging material and tool distributor Niching Industrial looks to ramp up its shipments of EMC-based (epoxy molding compound) LED leadframes and FC CSP substrates to drive revenue...

Machvision reports on-year revenue growth for June

Jul 4, 15:30

PCB and IC substrate inspection equipment maker Machvision has reported consolidated revenues of NT$80.29 million (US$2.68 million) for June, up 13.9% sequentially and 79.8% on year...

Kinsus Interconnect reports strong IC substrate orders for July-August

Jul 20, 11:11

IC-packaging substrate maker Kinsus Interconnect Technology has stated that it has landed sufficient orders for July and August with order momentum to further strengthen onward month...

Strong growth for semiconductor equipment in advanced packaging market, says Information Network

Jul 20, 10:28

Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...

NPC to ramp up CPU-use FC substrate output

May 20, 01:10

Nan Ya PCB (NPC) will be able to grow its output of flip-chip (FC) substrates for Intel's x86 CPUs later in the second quarter of 2011, on the strength of improved yields, according...

Nan Ya PCB looks to strong performance in 2Q11

Apr 26, 14:34

Nan Ya PCB expects its second-quarter 2011 performance to be stronger than the first-quarter's due to a pick-up in orders from the IT segment as well as an improvement of yield rates...

Unimicron to spend NT$6-7 billion for capacity ramp in 2011

Jan 31, 11:45

Unimicron Technology will invest NT$6-7 billion (US$207-241 million) to ramp up its capacity for HDI boards and flip-chip chip-scale packaging (FC CSP) substrates in 2011 to meet...

Nan Ya PCB sampling FC substrates for new Intel platform

Jan 10, 11:33

Taiwan's Nan Ya PCB (NPC) has begun sampling six- to 12-layer flip-chip (FC) substrates for Intel's recently-announced Sandy Bridge processors, as well as Japan-based Ibiden Electronics...

STATS ChipPAC sees over 50% growth in flip chip business

Dec 14, 12:00

STATS ChipPAC has seen its flip chip business grow more than 50% in 2010 compared to 2009, according to the company, adding that shipments of flip chip packages have surpassed 250...

Nanya PCB October sales grow 6% on month

Newswatch - Nov 5, 01:50

Buoyed by rising demand for PCBs used in consumer electronics products, and CPU-use flip-chip (FC) substrates, Nanya PCB (NPC) saw October 2010 revenues increase 6.04% sequentially...

Nanya PCB to get more FC substrate backend orders from Intel on better yields

Oct 21, 01:10

Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to...

Nanya PCB to expand FC substrate capacity by 30%

Jun 22, 12:13

Nanya PCB (NPC) has announced plans to boost its monthly output of flip-chip (FC) substrates to 40 million units by the end of 2010, up from the current level of 30 million units...

PCB maker Unimicron raises 2Q10 revenue guidance

Jun 21, 11:49

PCB and IC substrate maker Unimicron Technology has revised upward its second-quarter revenues guidance to a sequential 15-20% growth from a 10% growth projected previously thanks...

Nanya PCB to expand capacity for FC substrates and HDI boards

May 25, 15:40

Nanya PCB has revealed plans to boost its flip-chip (FC) substrate capacity by 5-7 million units for a total of 35-37 million units a month by the end of June 2010, and also expand...

Unimicron to ramp up FC substrate capacity by 15-18% in 3Q10

Apr 29, 14:12

Unimicron Technology plans to ramp up its capacity for flip-chip (FC) substrates by 15-18% in the third quarter to meet increasing demand, company spokesman Shen Tsai-sheng said at...

IC substrate maker Kinsus expects 2010 capex to reach NT$1.5 billion

Feb 25, 14:02

IC substrate maker Kinsus Interconnect Technology expects its capex for 2010 to reach NT$1.5 billion (US$46.8 million), up from NT$800 million in 2009. The company also revealed that...

NPC likely to receive FC substrate backend orders from Intel after NGK stops its supply

Nov 3, 16:15

IC substrate supplier Nan Ya Printed Circuit Board (NPC) may see weaker order volumes in the short term because its Japan-based strategic partner NGK Spark Plugs has announced that...

IC substrate makers Kinsus, PPT report growth in July revenues

Aug 11, 16:59

Taiwan IC substrate makers Kinsus Interconnect Technology and Phoenix Precision Technology (PPT) both saw July revenues hit the highest monthly levels of 2009, and market watchers...

NPC kicks off FC substrate capacity ramp

Jul 16, 12:31

Taiwan-based Nan Ya Printed Circuit Board (NPC) has kicked off its expansion plans aiming to ramp up its monthly output of flip-chip (FC) substrates to 40 million units by the end...

Nanya PCB expects strong 2H09 on CE demand

Jun 24, 14:42

Nan Ya Printed Circuit Board (NPC) has forecast its revenue ratio between the first and second halves of 2009 may be between 30:70 and 40:60, according to company president Otto Chang...

chang

STATS ChipPAC delivers low-cost flip-chip technology

May 20, 12:25

STATS ChipPAC, a Singapore-based semiconductor packaging and testing service provider, has announced a new flip-chip (FC) technology that it says offers cost savings over standard...

IC substrate makers Kinsus and PPT see mixed 1Q09 results

Apr 22, 16:04

IC substrate maker Kinsus Interconnect Technology may post better than expected results for the first quarter of this year, as peer maker Phoenix Precision Technology (PPT) saw losses...

PPT and NPC see FC substrate utilization up

Apr 6, 15:35

Global flip-chip (FC) substrate suppliers are expected to report shipment growth in March thanks to increased orders from Intel and AMD. Taiwan-based Phoenix Precision Technology...

Kinsus expects strong substrate shipment growth in March due to China 3G deployment

Mar 20, 17:11

IC substrate maker Kinsus Interconnect Technology estimates that March revenues will top NT$700 million (US$20.74 million) because China handset makers have expanded deployment of...

Altera guidance revision to spur growth for Taiwan suppliers

Mar 4, 16:22

Altera's recently-revised guidance for the first quarter of 2009 is good news for its contract suppliers in Taiwan, which include foundry partner Taiwan Semiconductor Manufacturing...

Kinsus BT-based FC and FC CSP substrate shipments to increase in 2009

Feb 20, 14:18

Kinsus Interconnect Technology has reported January sales of NT$433 million (US$12.45 million), down 21% on month. The company expects sales to increase to NT$500-550 million in February...

fc csp

IC substrate sales slumped in December 08 due to decline in handset and PC demand

Jan 6, 15:02

IC substrate makers saw weak performance in December 2008 due to a sharp decline in demand for consumer electronics, handsets and PC products. Phoenix Precision Technology (PPT) has...

IC substrate makers' utilization rates drop sharply in December

Dec 24, 14:16

IC substrate makers' utilization rates in December have dropped due to declining orders. Nan Ya Printed Circuit Board (NPC)'s utilization rate for flip-chip (FC) substrates has fallen...

IC substrate maker Kinsus to see sales decline more than 15% in 4Q amid weak order volumes

Nov 12, 12:06

IC substrate maker Kinsus Interconnect Technology expects to see a sales decline of more than 15% in the fourth quarter, while its utilization rate will be in the 65-70% range and...

Next-generation Intel Nehalem CPU to increase consumption of FC substrates

Oct 28, 12:12

The number of substrate layers for the next-generation Intel Nehalem-based CPU has been decided, according to industry sources, with 12 layers being the maximum, double the current...

FC

PCB maker NPC expected to see 10% sales decline in 4Q

Oct 24, 17:02

According to Nan Ya Printed Circuit Board (NPC), demand for traditional PCBs and wire-bonding substrates is falling but shipments of flip-chip (FC) substrates remains relatively strong...

FC

Intel Nehalem CPUs expected to boost substrate demand

Sep 19, 17:05

The launch of second-phase Intel Nehalem-based CPUs (scheduled for the third quarter of 2009) is expected to have a corresponding impact on substrate demand, according to industry...

FC shipments remain strong, but other IC substrate segments constraining overall growth

Sep 19, 16:49

Taiwan investors forecast that sales for IC substrate makers in the third quarter will have only single-digit growth due to weak demand for wire bonding substrates and PCBs, which...

Nan Ya forecast to challenge NT$11 billion in 3Q08 sales on healthy flip-chip demand

Aug 27, 01:00

After enjoying strong performance in second quarter 2008, Nan Ya Printed Circuit Board (NPC) is optimistic about its third-quarter performance.

Netbooks and handsets to drive up PPT sales in 3Q08

Aug 6, 14:59

Seeing its July sales sustain an upward trend, Phoenix Precision Technology (PPT) has delivered an optimistic outlook for the third quarter, with flip-chip (FC) and chip-scale packaging...

38 items [1/2]
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DIGITIMES Translation Services
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