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News tagged equipment
  • Last update: Tuesday 21 October 2014 [876 news items]

ASML lands rising EUV equipment orders; looking to expand capacity

Sep 11, 14:07

ASML's new EUV system, the NXE:3300B, has obtained 18 orders. In order to meet customer demand, the lithography tool vendor is looking to boost its production capacity for EUV tool...

Equipment maker Csun 3Q13 revenues to drop 5-10% on quarter

Sep 11, 12:39

PCB and LCD equipment maker Csun Manufacturing is expected to see its revenues decline 5-10% sequentially to between NT$980 million (US$32.9 million) and NT$1 billion in the third...

Global 2Q13 semiconductor equipment billings and bookings drop on year

Sep 10, 12:36

Worldwide semiconductor manufacturing equipment billings and bookings showed on-year decreases of 27% and 5%, respectively, in the second quarter of 2013, according to data collected...

3D NAND, FinFET to drive semiconductor equipment market growth, says Applied Materials

Sep 6, 12:11

With chipmakers engaged in the development of 3D NAND and FinFET technologies, the global semiconductor market is set to expand another 25-35%, said an Applied Materials executive...

Erix Yu, president of Applied Materials Taiwan

SEMICON Taiwan 2013: Scientech showcases in-house developed equipment

Sep 5, 15:53

Semiconductor equipment distributor and wafer reclamation service provider Scientech is currently showcasing its in-house developed wet-process equipment for 12-inch fabs at the SEMICON...

Fab equipment spending to rise 25% in 2014, says SEMI

Sep 4, 11:04

Capital expenditure for semiconductor fab equipment spending will increase to US$39.8 billion in 2014, the highest on record, according to SEMI.

Foundries to use part of 28nm equipment for 20nm chip production

Aug 29, 11:40

Foundry chipmakers plan to use part of their 28nm production equipment for the manufacture of 20nm chips, as they are aware of a potential oversupply of 28nm chips, according to industry...

International vendors take up 35% of China Mobile TD-LTE equipment procurement value

Aug 22, 15:58

China Mobile has held an open-bid to procure 207,000 TD-LTE base stations worth an estimated CNY20 billion (US$3.26 billion) in total. Alcatel-Lucent Shanghai Bell, Ericsson and Nokia...

KLA-Tencor to set up equipment training center in Taiwan

Aug 22, 15:34

Semiconductor equipment maker KLA-Tencor has announced plans to invest a total of US$3 million to set up a local equipment training center in Taiwan slated for completion in April...

North American equipment industry posts book-to-bill ratio of 1.00 in July 2013, says SEMI

Aug 22, 14:23

North America-based manufacturers of semiconductor equipment posted US$1.16 billion in orders in July 2013 (three-month average basis) and a book-to-bill ratio of 1.00, according...

Automated equipment component maker Hiwin looks to strong sales in 2H13

Aug 21, 18:32

Hiwin Technologies, which focuses on the production of ballscrews, linear-motion devices and industrial robots, expects demand from the automated equipment, semiconductor, medicare...

PCB exposure equipment maker CBT conservative about 2H13 outlook

Aug 21, 10:51

PCB exposure equipment maker Chime Ball Technology (CBT) is conservative about the business outlook for the second half of 2013 due to low capacity utilization rates at PCB supplie...

Chime Ball chairman

Equipment supplier Mirle sees profits more than double in 1H13

Aug 15, 10:46

Equipment supplier Mirle Automation has reported net profits of NT$211 million (US$7.04 million) for the first half of 2013, up 109% from a year earlier. The earnings translated into...

WLAN and Bluetooth dominate market for wireless-enabled industrial automation equipment, says IMS Research

Aug 12, 13:40

More than half of all wireless-enabled industrial automation equipment shipped in 2012 used Bluetooth or 802.11a/b/g/n wireless LAN (WLAN) technology, with the two entrenched standards...

PCB equipment suppliers Machvision, Chime Ball post strong earnings in 1H13

Aug 6, 16:19

PCB equipment suppliers Machvision and Chime Ball Technology both have reported strong earnings for the first half of 2013, but are conservative about the business outlook for the...

SEMI book-to-bill ratio rises to 1.10 for June

Jul 19, 11:13

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.10 in June, up from 1.08 in May, according to the Semiconductor Equipment and Materials...

Lenovo begins marketing storage equipment

Jul 17, 20:49

Lenovo stepped into developing storage devices through a partnership with EMC in 2012 and has begun marketing related products targeting small- to medium-size businesses and media...

Nokia Siemens offers lowest prices for China Mobile procurement

Jul 17, 11:48

Nokia Siemens Networks has offered the lowest prices in a bid to supply 207,000 TD-LTE base stations to China Mobile, according to China-based tech.sina.com.

PCB equipment maker Csun 2Q13 revenues gain over 80% sequentially

Jul 10, 21:58

Semiconductor and PCB manufacturing equipment provider Csun Manufacturing saw its revenues edge down 6.5% on month and 2.5% on year to NT$363 million (US$12.08 million) in June. However,...

Chip equipment spending to rise 21%, says SEMI

Jul 10, 13:45

Semiconductor equipment spending for 2014 will reach US$43.98 billion, up 21% from the US$36.29 billion estimated for 2013, according to SEMI. The forecast indicates that 2014 will...

Inspection tool maker HMI posts record 2Q13 revenues

Jul 8, 21:46

Hermes Microvision (HMI), which provides electron beam (e-beam) inspection tools and solutions for the production of semiconductors, saw its second-quarter revenues hit a record high...

Applied lands 8.5G and 5.5G fab equipment orders from BOE

Jul 4, 14:00

Applied Materials announced recently that China-based LCD panel supplier BOE Technology has placed "significant" equipment orders for 8.5G and 5.5G production lines installed...

IC-making equipment market to rise through 4Q13, says The Information Network

Jun 25, 12:36

The global semiconductor equipment market should end 2013 in the black, according to market research firm The Information Network.

IC manufacturing equipment spending to slip 5% in 2013, says Gartner

Jun 21, 15:51

Worldwide semiconductor manufacturing equipment spending is projected to total US$35.8 billion in 2013, a 5.5% decrease from 2012 spending of US$37.8 billion, according to Gartner.

PCB equipment makers Csun, Ampoc 2Q13 sales to rise

Jun 18, 13:37

Buoyed by a pull-in of equipment orders from the PCB sector, Csun Manufacturing and Ampoc Far East are expected to see their second-quarter sales rise significantly on quarter, according...

Laser Tek to begin shipping automated optical inspection equipment in 3Q13

Jun 13, 22:16

Laser Tek, a supplier of passive component materials and production equipment, is expected to begin shipping its new AOI (automated optical inspection) equipment to passive component...

Global 1Q13 fab tool billings and bookings drop from year ago, says SEMI

Jun 13, 11:25

SEMI has reported that worldwide semiconductor manufacturing equipment billings reached US$7.31 billion in the first quarter of 2013. The billings figure is 8% higher than the fourth...

Digitimes Research: Taiwan MOCVD capacity to account for 28% of global total in 2013

Jun 10, 12:18

Global MOCVD equipment capacity is still in oversupply while prices of LED light bulbs continue to fall. Among all global operational MOCVD tools, Taiwan-based makers account for...

Fab equipment spending to soar in 2H13, says SEMI

Jun 6, 12:46

Fab equipment spending for the second half of 2013 is expected to be much stronger with a 32% growth rate or US$18.5 billion compared to the first half of the year, according to SEMI...

Z-Com aims to supply 30% of Wi-Fi hot-spot equipment to China Mobile in 2013

Jun 4, 20:15

Z-Com, a Taiwan-based maker of broadband wireless Internet-access devices and provider of wireless/mobile data solutions, aims to land orders from China Mobile, China's largest mobile...

Digitimes Research: South Korea display equipment firms to see rising revenues in 2013

May 31, 11:33

For the third consecutive year, AMOLED capex at South Korea-based Samsung Display will exceed LCD panel capex in 2013. Samsung Display has been investing in OLED production and increasingly...

Commentary: EU telecom equipment probe against China is unnecessary

May 28, 10:28

The telecom industry believes that by the end of 2013, China will likely issue 4G licenses to telecom carriers, and hence many equipment firms have been eager to gain share of the...

Equipment maker Acter sees profits down in 1Q13

May 17, 16:05

Cleanroom equipment maker Acter has reported net profits of NT$114 million (US$3.82 million) for the first quarter of 2013, decreasing 33.9% from a year earlier. First-quarter EPS...

Scientech looks to strong sales of reclaim wafers, semiconductor equipment in 2H13

May 13, 15:30

Semiconductor equipment distributor and wafer reclaim service provider Scientech expects demand for manufacturing equipment from the semiconductor and LED industries to continue to...

TSMC reiterates plans for 18-inch wafer manufacturing

May 10, 10:18

Taiwan Semiconductor Manufacturing Company (TSMC) has reiterated plans to build its first 450mm (18-inch) pilot production lines, which will offer FinFET transistor technology at...

TSMC talks about plans for 18-inch wafer manufacturing
876 items [3/26]
Realtime news
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  • Foxconn+green%2Dtunnel+datacenter

    Foxconn green-tunnel datacenter

    Foxconn has unveiled its fourth-generation eco-friendly industrial park in Guiyang, China featuring a green-tunnel datacenter and facilities for food safety testing, development of...

    Photo: Ninelu Tu, DIGITIMES, Jul 11.

  • Lantiq+GEMINAX+XXS+V3+chipset

    Lantiq GEMINAX XXS V3 chipset

    Lantiq has announced its latest generation chipset for ADSL linecards. Implemented in 65nm process technology, the new GEMINAX XXS V3 chipset offers high-level integration with...

    Photo: Company, Dec 8.

  • FormFactor+300mm+full%2Dwafer+test+solution+for+DRAM

    FormFactor 300mm full-wafer test solution for DRAM

    FormFactor has introduced its next-generation 300mm (12-inch) full-wafer-contact probe card for DRAM devices - the SmartMatrix 100 probe solution. Incorporating a proprietary probe...

    Photo: Company, Dec 11.

  • Transcend+64GB+CompactFlash+card

    Transcend 64GB CompactFlash card

    Transcend Information has introduced high-capacity 400X CompactFlash cards with capacities ranging up to 64GB. The new 400X CF cards delivers fast transfer rates of up to 90MB/s...

    Photo: Company, Nov 26.

  • Applied+HCT+Diamond+Squarer+for+solar+wafers+

    Applied HCT Diamond Squarer for solar wafers

    Applied Materials has introduced ts new HCT Diamond Squarer system, which can reduce the cost of squaring silicon ingots by up to one-third while offering at least twice the cutting...

    Photo: Company, Oct 7.

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Greater China touch panel shipment forecast through 2015
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