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Thursday 15 February 2024
Samsung embraces hybrid bonding for advanced non-memory packaging
Samsung Electronics is actively enhancing its semiconductor foundry capabilities by embracing hybrid bonding technology. The company has recently integrated equipment from BE Semiconductor...
Wednesday 7 February 2024
Panasonic sells its VR/AR equipment startup due to lack of gaming console platform
Panasonic has decided to sell Shiftall, its subsidiary responsible for VR head-mounted display (HMD) development, on February 1, 2024. Panasonic, alongside Sharp and Sony, were all...
Wednesday 7 February 2024
Winbond plans transition to 16nm DRAM process
Winbond Electronics has kicked off mass production of specialty DRAM memory using 20nm process technology, with plans to transition to a newer 16nm process, according to the Taiwan-based...
Wednesday 7 February 2024
Growing semi equipment self-sufficiency in China favors local component vendors
China's drive for IC self-sufficiency has been benefiting local fab tool makers as well as their suppliers of parts and components, according to industry sources.
Tuesday 6 February 2024
DB Hitek has its ion implantation equipment for SiC semiconductors
South Korean semiconductor foundry DB Hitek is accelerating the development of silicon carbide (SiC) semiconductors.
Tuesday 6 February 2024
Japan's semiconductor renaissance (2): advanced packaging and materials
The Japanese government's efforts to attract foreign semiconductor investment have been very effective, with almost every major international semiconductor manufacturer responding...
Tuesday 6 February 2024
TSMC unlikely to adopt High-NA EUV for 2nm, A14 processes
TSMC has not placed orders for high-numerical aperture (High-NA) extreme ultraviolet (EUV) tools and is unlikely to use the technology in 2nm and 1.4nm (A14) process manufacturing,...
Monday 5 February 2024
Veeco advances quantum tech with GEN20-Q MBE system
Veeco Instruments has announced the shipment of a GEN20-Q molecular beam epitaxy (MBE) system to Hermes-Epitek, a semiconductor and optoelectronics client situated in Taiwan's Hsinchu...
Monday 5 February 2024
Roses are red, ultraviolets are blue, Samsung and ASML announce High-NA EUV equipment debut
Samsung Electronics and Dutch equipment manufacturer ASML jointly announced an investment in a semiconductor advanced process development center in South Korea.
Monday 5 February 2024
VIS expects 6-8% wafer shipment drop in 1Q24
Vanguard International Semiconductor (VIS), a Taiwan-based 8-inch IC foundry, expects a 6-8% sequential wafer shipment decline in the first quarter of 2024 with about flat ASP grow...
Monday 5 February 2024
TSMC in no rush to embrace ASML's High-NA EUV technology
In December 2023, a report from research institution SemiAnalysis created a significant buzz by revealing Intel's adoption of High-Numerical Aperture (High-NA) Extreme Ultraviolet...
Wednesday 31 January 2024
South Korean chip tool firms eager to grab EUV process market shares
Samsung Electronics and SK Hynix are engaging process equipment investments targeting high-bandwidth memory and DDR5. South Korean semiconductor equipment makers are participating...
Tuesday 30 January 2024
Japan's FPD equipment sales face short-term slump, G8 substrate OLED panel investments signal a promising rebound
The Semiconductor Equipment Association Japan (SEAJ) released its January 2024 report, projecting a 25% decline to JPY321.1 billion (US$2.2 billion) in Japan's Flat Panel Display...
Tuesday 30 January 2024
Japan sees rising investments from China-based semiconductor firms
Amid an investment wave in the semiconductor industry in Japan, China-based companies along the semiconductor supply chain are investing in Japan by setting up subsidiaries or acquiring...
Tuesday 30 January 2024
Advanced processes and subsidiary performance drive momentum for Gudeng
Taiwan-based semiconductor equipment supplier Gudeng Precision Industrial is forecasting high profits for 2024, with chairman Chiu Ming-Chien predicting double-digit growth in annual...